Panasonic TY-TP42P10S / TY-TP50P10S Service Manual ▷ View online
ORDER NO. ITD0805032CE
Touch Panel
Model No.
TY-TP42P10S
Model No.
TY-TP50P10S
TABLE OF CONTENTS
PAGE
PAGE
1 Warning -------------------------------------------------------------- 2
1.1. Prevention of Electrostatic Discharge (ESD)
to Electrostaticy Sensitive (ES) Devices---------- 2
1.2. About lead free solder (PbF)---------------------------- 3
2 Specifications ----------------------------------------------------- 4
3 General/Introduction -------------------------------------------- 5
3 General/Introduction -------------------------------------------- 5
3.1. PCB Stracture ---------------------------------------------- 5
4 Operating Instructions------------------------------------------ 6
5 Disassembly and Assembly Instructions ---------------40
5 Disassembly and Assembly Instructions ---------------40
5.1. Remove the Frame U Assy ----------------------------40
5.2. Remove the Cover-U Assy-----------------------------40
5.3. Remove the Flat bracing metal -----------------------40
5.4. Remove the Main board unit---------------------------40
5.5. Remove the Sensor-L board unit ---------------------40
5.6. Remove the Sensor-R board unit --------------------40
5.7. Remove the Right angle-UL ---------------------------41
5.8. Remove the Right angle-UR---------------------------41
5.2. Remove the Cover-U Assy-----------------------------40
5.3. Remove the Flat bracing metal -----------------------40
5.4. Remove the Main board unit---------------------------40
5.5. Remove the Sensor-L board unit ---------------------40
5.6. Remove the Sensor-R board unit --------------------40
5.7. Remove the Right angle-UL ---------------------------41
5.8. Remove the Right angle-UR---------------------------41
6 Measurements and Adjustments---------------------------42
6.1. Before the adjustment when Circuit board are
exchanged ------------------------------------------------- 42
6.2. Cautions for replacing the Circuit board------------ 42
6.3. Flow chart for replacing the Boards ----------------- 42
6.4. How to rewrite data when replacing the Main
6.3. Flow chart for replacing the Boards ----------------- 42
6.4. How to rewrite data when replacing the Main
Board-------------------------------------------------------- 43
6.5. Adjust the optical axis----------------------------------- 43
6.6. Adjust PEAKPOSI (Corner) --------------------------- 45
6.7. Setting range (first, last) of the optical axis-------- 46
6.8. Adjust and confirm the light level--------------------- 47
6.6. Adjust PEAKPOSI (Corner) --------------------------- 45
6.7. Setting range (first, last) of the optical axis-------- 46
6.8. Adjust and confirm the light level--------------------- 47
7 25-point calibration--------------------------------------------- 48
7.1. Before performing 25-point calibration-------------- 48
7.2. Explanation of 25-point Calibration------------------ 48
7.2. Explanation of 25-point Calibration------------------ 48
8 Dimensions ------------------------------------------------------- 51
9 Block Diagram --------------------------------------------------- 52
9 Block Diagram --------------------------------------------------- 52
10 Schematic Diagram -------------------------------------------- 53
10.1. Main Board Unit Schematic Diagram --------------- 53
10.2. Sensor Board Unit Schematic Diagram ------------ 54
10.2. Sensor Board Unit Schematic Diagram ------------ 54
TY-TP42P10S / TY-TP50P10S
2
1 Warning
1.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)"
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)"
can generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
to damage an ES device).
TY-TP42P10S / TY-TP50P10S
3
1.2.
About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70
°F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20
°F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100
°F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
TY-TP42P10S / TY-TP50P10S
4
2 Specifications
Type
Touch Panel
Power source
Voltage
+5V DC ± 10%
Electric current
Max. 450 mA
Supply system
From USB bus
Touch panel
Detection system
Infrared retroreflective detection
Panel window
36
15
/
16
” (938 mm) (W)
× 21
5
/
64
” (535 mm) (H)
(TY-TP42P10S)
44
27
/
64
” (1,128 mm) (W)
× 25
33
/
64
” (648 mm) (H)
(TY-TP50P10S)
Detection range
36
15
/
64
“ (920 mm) (W)
× 20
13
/
32
” (518 mm) (H)
(TY-TP42P10S)
43
35
/
64
“ (1,106 mm) (W)
× 24
1
/
2
” (622 mm) (H)
(TY-TP50P10S)
Effective detection range
Same as above
Resolution
Approx. 32,000
× 18,000 points *1
Output system
Coordinate output
Optic element pitch
Infrared LED x 4, CMOS image sensor
× 2
Minimum detection size
9
/
32
” (7 mm) (TY-TP42P10S)
21
/
64
” (8 mm) (TY-TP50P10S)
Response rate
100 points / sec
Interface
USB 2.0 full speed device
Signals: +DATA, -DATA, VCC, GND
Connector: Type B
Signals: +DATA, -DATA, VCC, GND
Connector: Type B
Temperature
When operating: 0 ~ 70
°C (0 ~ 40°C) *2
Humidity
When operating: 20 ~ 80% (No dewing) *2
Resistance to external
Lateral light 2,000 lx + 20% (20
° angle of incidence)
light
Frontal light 10,000 lx + 20% (90
° angle of incidence)
External dimensions
40
1
/
32
” (1,016.4 mm) (W)
× 27” (686 mm) (H)
× 1
57
/
64
” (47.9 mm) (D) (TY-TP42P10S)
47
1
/
2
” (1,206.4 mm) (W)
× 31
29
/
64
” (798.6 mm) (H)
× 1
57
/
64
” (47.9 mm) (D) (TY-TP50P10S)
Mass
Approx. 9.04 lb. (4.1 kg) (TY-TP42P10S)
Approx. 10.14 lb. (4.6 kg) (TY-TP50P10S)
Escutcheon material
Aluminum
*1 Resolution obtained by using a dedicated Driver software
*2 When the panel is attached to a Plasma display produced by Matsushita Electric Industrial Co., Ltd.
*2 When the panel is attached to a Plasma display produced by Matsushita Electric Industrial Co., Ltd.