DOWNLOAD Panasonic TH-49AF1U / TH-49AF1W (serv.man2) Service Manual ↓ Size: 26.72 MB | Pages: 67 in PDF or view online for FREE

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TH-50LFC70U/TH-50LFC70W

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals.   These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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TH-50LFC70U/TH-50LFC70W

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d 
suggest the use of Pb free solder as well, although Pb solder may be used.

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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English

 

55-inch model

:  TH-55AF1U

 

49-inch model

:  TH-49AF1U

 

42-inch model

:  TH-42AF1U

 

55-inch model

:  TH-55AF1W

 

49-inch model

:  TH-49AF1W

 

42-inch model

:  TH-42AF1W

 

 

55-inch model

 190 W

 

49-inch model

 175 W

 

42-inch model

 155 W

 

 0.3 W

 Stand-by condition
 (when [OpenPort PLATFORM standby] is set to [Off])

 0.5 W

 Stand-by condition
 (when [OpenPort PLATFORM standby] is set to [On] 

(Factory default))

 approx. 20 W

 

55-inch model

 55-inch IPS panel (Edge LED backlight), 16:9 aspect 

ratio

 

49-inch model

 49-inch IPS panel (Edge LED backlight), 16:9 aspect 

ratio

 

42-inch model

 42-inch IPS panel (Edge LED backlight), 16:9 aspect 

ratio

 

55-inch model

 1 209 mm (W) × 680 mm (H) × 1 387 mm (diagonal) / 

47.6” (W) × 26.7” (H) × 54.6” (diagonal)

 

49-inch model

 1 073 mm (W) × 604 mm (H) × 1 232 mm (diagonal) / 

42.2” (W) × 23.7” (H) × 48.5” (diagonal)

 

42-inch model

 927 mm (W) × 521 mm (H) × 1 064 mm (diagonal) / 

36.5” (W) × 20.5” (H) × 41.9” (diagonal)

 2 073 600 (1 920 (W) × 1 080 (H))

 

55-inch model

 1 229 mm × 699 mm × 72 mm (57 mm: without 

handles) / 

48.4” × 27.6” × 2.8” (2.3”: without handles)

 

49-inch model

 1 093 mm × 623 mm × 72 mm (57 mm: without 

handles) / 

43.1” × 24.6” × 2.8” (2.3”: without handles)

 

42-inch model

 947 mm × 541 mm × 72 mm (57 mm: without 

handles) / 

37.3” × 21.3” × 2.8” (2.3”: without handles)

 

55-inch model

 approx. 25.0   / 55.2 lbs net

 

49-inch model

 approx. 19.3   / 42.6 lbs net

 

42-inch model

 approx. 15.6   / 34.4 lbs net

 TH-55AF1U, TH-49AF1U, TH-42AF1U:

 110 - 127V (110-127V alternating current), 50/60Hz

 TH-55AF1W, TH-49AF1W, TH-42AF1W:

 220 - 240V (220-240V alternating current), 

50/60Hz

 0 °C to 40 °C (32 °F to 104 °F)*

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 20 % to 80 % (no condensation)

 -20 °C to 60 °C (-4 °F to 140 °F)

 20 % to 80 % (no condensation)

 Android 4.4.3

 

 Cortex-A9, 1.0 GHz (quad)

 

 RAM 1 GB / ROM 8 GB

 

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 Video:   MPEG4, H.264/AVC, H.263, MotionJPEG, 

MPEG2, WMV, VP8

 Audio: MP3, AAC, WMA, AMR, Ogg Vorbis

 USB connector × 3, TYPE A
 USB2.0

 

 Micro-USB connector, Micro-B
 USB2.0

 

 microSD, microSDHC

 

 For RJ45 network connections, compatible with 

PJLink
 Communication method:

 RJ45 10BASE-T/100BASE-TX/1000BASE-T

 

 IEEE 802.11a/b/g/n

 TYPE A Connector*

2

 × 2

 Audio signal:

 Linear PCM (sampling frequencies - 48 kHz, 

44.1 kHz, 32 kHz)

 

 DVI-D 24 Pin:

 Compliance with DVI Revision 1.0

 Content Protection:

 Compatible with HDCP 1.1

 

 DVI-D 24 Pin:

 Compliance with DVI Revision 1.0

 Content Protection:

 Compatible with HDCP 1.1

 

 Y/G

 BNC terminal 1.0 Vp-p (75 ) (with sync signal)

 P

B

/C

B

/B

 BNC terminal 0.7 Vp-p (75 ) (without sync 

signal)

 P

R

/C

R

/R

 BNC terminal 0.7 Vp-p (75 ) (without sync 

signal)

 

 VIDEO

 BNC terminal 1.0 Vp-p (75 )
 Also used as Y/G terminal

 

 Mini D-sub 15 Pin (Compatible with DDC2B)
 Y/G:

 1.0 Vp-p (75 ) (with sync signal)
 0.7 Vp-p (75 ) (without sync signal)

 P

B

/C

B

/B:

 0.7 Vp-p (75 ) (without sync signal)

 P

R

/C

R

/R:

 0.7 Vp-p (75 ) (without sync signal)

 HD/VD:

 1.0 - 5.0 Vp-p (high impedance)

 

 Stereo mini jack (M3) 0.5 Vrms
 Shared with DVI-D IN and PC IN

 Stereo mini jack (M3) 0.5 Vrms
 Shared with COMPONENT/RGB IN and VIDEO IN

 

 Stereo mini jack (M3) 0.5 Vrms
 Output: Variable (-∞ to 0 dB) 

(1 kHz 0 dB input, 10 k load)

 

 USB connector, TYPE A
 DC 5V / 1A (USB 3.0 is not supported.)

 External Control Terminal
 D-sub 9 Pin:

 RS-232C compatible

 

 External Control Terminal
 D-sub 9 Pin:

 RS-232C compatible

 

 Stereo mini jack (M3)

 

 Stereo mini jack (M3)