DOWNLOAD Panasonic KX-TS2570RUB / KX-TS2570RUW Service Manual ↓ Size: 1.72 MB | Pages: 47 in PDF or view online for FREE

Model
KX-TS2570RUB KX-TS2570RUW
Pages
47
Size
1.72 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / TELEPHONE EQUIPMENT
File
kx-ts2570rub-kx-ts2570ruw.pdf
Date

Panasonic KX-TS2570RUB / KX-TS2570RUW Service Manual ▷ View online

5
KX-TS2570RUB/KX-TS2570RUW
2.1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other materi-
als. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm. 
2.1.2.
How to recognize that Pb Free solder is used
(Example: Operation P.C.B.)
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
CN801
MIC
17
18
1
2
PQUP11371Z
A
PbF
Marked
6
KX-TS2570RUB/KX-TS2570RUW
3 Specifications
7
KX-TS2570RUB/KX-TS2570RUW
4 Technical Descriptions
4.1.
Block Diagram (Base Unit)
KX-TS2570 BLOCK DIAGRAM
T
1
D3, D5
C1
PC1
R1
IC1
D4, D6
Speaker
Q
103, Q
104
D7, D9
T
2AP
R
Q4
0
1
D8
, D1
0
   M
IC
D
306
D
304
IC
304
Q
701
Q
702
    6.5V
DC Po
w
e
r
IC
903
IC
902
IC
303, Q
301
LC
D
IC
305
H
andset / H
eadset
MIC
SP
IC
904
Q
402
Q
108
Ri
nger i
ndi
c
a
ti
on LE
D
LE
D 804 (1A
P
 - S
U
B
)
IC
901
DSP M
ICON
NS
 BBI
C
JOHN SMITH
1234567890
Key
boar
d
Sw
itc
h
RINGER
IC
BELL
Line
O
N
/O
FF
H
andset
Sending
Am
p
H
eadset
D
e
tection
FLA
S
H
ME
MO
R
Y
CIDI
N+
CIDI
N -
V
SP-Phone
Am
p
MI
C -
LS
R +
Headset
DE
T
MI
C +
LS
R  -
LI
N
E
 I
N
 -
L
INE
 OUT
Sidetone
Bridge
R
eg.
1.8V
R
eg.
3.2V
RS
T
n
VDD,
 A
V
D
VDDI
O
VBA
T
2
Reset IC
R
egulator
4.0V
R
egulator
4.0V
ACFL
Pow
er Dow
n
D
e
tection
8
KX-TS2570RUB/KX-TS2570RUW
4.2.
Circuit Operation (Base Unit)
4.2.1.
Outline
The unit consists of the following ICs as shown in the BLOCK DIAGRAM
• BBIC (Base Band IC): IC901
- Handling all the audio, signal and data processing needed
- ADPCM codec filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) genereation (DSP section)
- DTMF receiver (DSP section)
- ADC, DAC, timer and power control circuitry
- All interfaces (eg: LCD, LED, Analog Front End, etc.)
• FLASH MEMORY : IC902
- Voice Prompt (TAM) Download Area
- Program D/L Area
• RINGER IC : IC1
- Bell signal generator (for bell detection purpose)
• SP AMP : IC904
- Low voltage audio power amplifier
• Additionally,
- Power Supply Circuit (+4.0V, +4.0V, +3.2V, +1.8V output)
- Telephone Line Interface Circuit
- Bell Detection Circuit
- SP-Phone Circuit
- Handset Circuit
- TAM  Circuit
4.2.2.
Power Supply Circuit
The power is supplied to the BBIC, Flash ROM, SP AMP, Logic IC, LCD, LED from AC adaptor (6.5V)
as below :
• BBIC (IC901): CN301 -> D304 -> IC304 -> Q702 -> IC901 (3.2V)
• BBIC (IC901): CN301 -> D304 -> IC304 -> D701 -> Q701 -> IC901 (1.8V)
• Flash Memory (IC902): CN301 -> D304 -> IC304 -> Q702 -> IC902
• Logic IC (IC905): CN301 -> D304 -> IC304 -> Q702 -> IC905
• SP AMP (IC904): CN301 -> IC305 -> IC904
• LCD (LCD): CN301 -> D304 -> IC304 -> Q702 -> L302 -> LCD
• LED (LED801, LED802): CN301 -> IC305 -> L301 -> CN403 -> CN801 -> LED
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