Panasonic KX-TS2368RUW Service Manual ▷ View online
12 MODULE BLOCK DIAGRAM
12.1. LCD MODULE BLOCK
12.2. CONNECTOR PIN ASSIGNMENT
Pin no.
signal
Function
Enable
1
VDD
Power Supply (5V)
2
VLCD
LCD Power Input
3
VSS
Power Gnd (0V)
4
DATA
Serial Data Input
H/L
5
WR
Write Data
L
→
H
6
CS
Chip Selection
Low Active
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KX-TS2368RUW
13 HOW TO REPLACE FLAT PACKAGE IC
13.1. Preparation
·
SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
·
Soldering iron
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 ~ 80 W iron, but beginner might damage foil by overheating.)
Recommended power consumption will be between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle between 60 ~ 80 W iron, but beginner might damage foil by overheating.)
·
Flux
HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
HI115 Specific gravity 0.863
(Original flux will be replaced daily.)
13.2. Procedure
1. Temporary fix FLAT PACKAGE IC by soldering on two marked 2 pins.
*Most important matter is accurate setting of IC to the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder employing specified solder to direction of arrow, as sliding the soldering iron.
13.3. Modification Procedure of Bridge
1. Re-solder slightly on bridged portion.
2. Remove remained solder along pins employing soldering iron as shown in below figure.
2. Remove remained solder along pins employing soldering iron as shown in below figure.
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KX-TS2368RUW
14 CABINET AND ELECTRICAL PARTS LOCATION
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KX-TS2368RUW
15 ACCESSORIES AND PACKING MATERIALS
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KX-TS2368RUW
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