Panasonic KX-TS2365RUB Service Manual ▷ View online
KX-TS2365RUB
Integrated Telephone System
Black Version
(for Russia)
Telephone Equipment
ORDER NO. KM40305091C3
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
3
1.1. Suggested PbF Solder
3
1.2. How to recognize that Pb Free solder is used
4
2 FOR SERVICE TECHNICIANS
4
3 CAUTION
4
4 BATTERY
5
4.1. Installing the Batteries
5
4.2. Battery Replacement
5
5 LOCATION OF CONTROLS
6
6 DISPLAY
7
7 CONNECTION
8
7.1. Connecting the Handset/Telephone Line Cord
8
7.2. Connecting a Communication Device
8
8 SETTINGS
9
8.1. Selecting the Dialing Mode
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8.2. Setting the PIN Code
10
8.3. Dial Lock
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8.4. Call Restriction
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8.5. How to Release the Establishment of Dial Lock
13
9 OPERATIONS
14
9.1. Making Calls
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9.2. Answering Calls
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9.3. FLASH Button
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10 DISASSEMBLY INSTRUCTIONS
18
11 TROUBLE SHOOTING GUIDE
19
11.1. Service Hints
19
11.2. Pulse Dialing Problems
19
11.3. Tone Dialing Problems (Handset)
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11.4. No Ringing Sound When Ring Signal is Input.
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12 BLOCK DIAGRAM
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13 CIRCUIT OPERATION
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13.1. Bell Detector Circuit
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13.2. Line Interface
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13.3. Speakerphone Circuit
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13.4. Telephone Line Interface
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13.5. Tone Detect
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13.6. Initializing Circuit
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14 CPU DATA
27
14.1. IC801
27
15 HOW TO SET THE FLASH TIME AND REDIAL TIME
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15.1. Flash Time
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15.2. Redial Time
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15.3. Speakerphone IC Data
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16 BLOCK DIAGRAM (IC 1)
30
16.1. Communication ICs
30
17 MODULE BLOCK DIAGRAM
31
17.1. MODULE BLOCK DIAGRAM
31
17.2. CONNECTOR PIN ASSIGNMENT
31
18 HOW TO REPLACE A FLAT PACKAGE IC
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18.1. Preparation
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18.2. Procedure
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18.3. Removing Solder from Between Pins
32
19 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
33
20 CABINET AND ELECTRICAL PARTS LOCATION
34
21 ACCESSORY AND PACKING MATERIALS
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22 REPLACEMENT PARTS LIST
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22.1. Base Unit
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22.2. ACCESSORIES AND PACKING MATERIALS
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23 FOR SCHEMATIC DIAGRAM (SCHEMATIC DIAGRAM)
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24 SCHEMATIC DIAGRAM
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25 CIRCUIT BOARD
42
25.1. Component View
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25.2. Flow Solder Side View
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CONTENTS
Page
Page
2
KX-TS2365RUB
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
·
PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 50° F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 50° F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
·
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
3
KX-TS2365RUB
1.2.
How to recognize that Pb Free solder is used
J56
J25
J63
J64
J65
X801
X802
IC903
J26
J90
J91
J61
J13
J60
J69
J62
J81
J92
J93
R
B
Y
G
H/S_J
A
C
K
C401
VR401
VR402
VR901
VR601
J66
J57
C427
D107
D651
D104
LCD
D106
J80
J10
D652
D601
D308
D421
D304
C302
C301
C414
J32
J30
J67
J68
J54
J55
J27
J22
J94
J84
J95
J96
J97
J28
J29
J31
MIC
D307
R210
D302
D303
D422
C625
SP
C618
C621
C619
C651
R654
IC601
C308
J23
J82
J21
J52
D105
D3
J19
J83
J53
J18
C105
C101
C102
C901
C202
J51
J50
J14
J12
SW101
J24
J20
C114
R194
R201
R101
J101
JJ101
JJ102
R108
R191
R1
R192
J102
Q191
J35
J1
J34
C1
C3
C6
C612
C611
C303
C652
J36
J15
J16
J17
Q108
E C B
Q106
D2
T1
D101
Q102
Q104
Q103
Q101
CN401
C614
C617
C615
14
15
28
1
C610
C106
C191
C107
C2
S1
PC1
R124
C601
C310
PO101
SA101
E
C
B
E C B
E C B
E C B
B C E
B C E
PbF
Marked
(Flow Solder Side View)
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
3 CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer´s Instructions.
4
KX-TS2365RUB
