DOWNLOAD Panasonic KX-TGF310RUM / KX-TGF320RUM / KX-TGF320UCM / KX-TGFA30RUM Service Manual ↓ Size: 9.24 MB | Pages: 116 in PDF or view online for FREE

Model
KX-TGF310RUM KX-TGF320RUM KX-TGF320UCM KX-TGFA30RUM
Pages
116
Size
9.24 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / DIGITAL CORDED/ CORDLESS PHONE
File
kx-tgf310rum-kx-tgf320rum-kx-tgf320ucm-kx-tgfa30ru.pdf
Date

Panasonic KX-TGF310RUM / KX-TGF320RUM / KX-TGF320UCM / KX-TGFA30RUM Service Manual ▷ View online

3
KX-TGF310RUM/KX-TGF320RUM/KX-TGF320UCM/KX-TGFA30RUM
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions----------------------------------------------- 5
1.1. For Service Technicians --------------------------------- 5
2 Warning -------------------------------------------------------------- 5
2.1. Battery Caution--------------------------------------------- 5
2.2. About Lead Free Solder (PbF: Pb free)-------------- 5
2.2.1. Suggested PbF Solder ------------------------------ 6
2.3. Discarding of P. C. Board-------------------------------- 6
3 Specifications ----------------------------------------------------- 7
4 Technical Descriptions ----------------------------------------- 8
4.1. Block Diagram (Base Unit_Main)---------------------- 8
4.2. Circuit Operation (Base Unit) --------------------------- 9
4.2.1. Outline --------------------------------------------------- 9
4.3. Tel Interface Circuit---------------------------------------10
4.4. Block Diagram (Base Unit_RF Part) -----------------11
4.5. Circuit Operation (Base Unit) --------------------------12
4.5.1. BBIC (Base Band IC: IC501) ---------------------12
4.5.2. Flash Memory (IC502)------------------------------12
4.5.3. Flash Memory (IC601)(KX-TGF320 only) -----12
4.5.4. Power Supply Circuit/Reset Circuit--------------13
4.5.5. Telephone Line Interface---------------------------14
4.5.6. Transmitter/Receiver--------------------------------15
4.6. Block Diagram (Handset)-------------------------------16
4.7. Block Diagram (Handset_RF Part)-------------------17
4.8. Circuit Operation (Handset)----------------------------18
4.8.1. Outline --------------------------------------------------18
4.8.2. Power Supply Circuit/Reset Circuit--------------18
4.8.3. Charge Circuit ----------------------------------------19
4.8.4. Battery Low/Power Down Detector--------------19
4.8.5. Speakerphone ----------------------------------------19
4.9. Circuit Operation (Charger Unit) ----------------------20
4.10. Signal Route -----------------------------------------------21
5 Location of Controls and Components ------------------23
6 Installation Instructions ---------------------------------------23
7 Operating Instructions-----------------------------------------23
8 Test Mode ----------------------------------------------------------24
8.1. Engineering Mode ----------------------------------------24
8.1.1. Base Unit ----------------------------------------------24
8.1.2. Handset ------------------------------------------------26
8.2. EEPROM LAYOUT (Handset)-------------------------28
8.2.1. Scope ---------------------------------------------------28
8.2.2. Introduction--------------------------------------------28
8.2.3. EEPROM contents ----------------------------------28
8.3. How to Clear User Setting------------------------------29
8.3.1. Resetting both base unit and handset----------29
8.3.2. Resetting only handset -----------------------------29
9 Troubleshooting Guide ----------------------------------------30
9.1. Troubleshooting Flowchart -----------------------------30
9.1.1. Check Power------------------------------------------31
9.1.2. Check Record ----------------------------------------32
9.1.3. Check Playback  -------------------------------------35
9.1.4. Check Battery Charge ------------------------------35
9.1.5. Check Link---------------------------------------------36
9.1.6. Check the RF part -----------------------------------38
9.1.7. Registering a Handset to the Base Unit--------42
9.1.8. Deregistering a Handset ---------------------------42
9.1.9. Check Handset Transmission --------------------43
9.1.10. Check Handset Reception-------------------------43
9.1.11. Check Caller ID --------------------------------------43
9.1.12. Bell Reception---------------------------------------- 44
9.1.13. Check TAM Operation------------------------------ 44
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit)---------------------------------------------- 45
9.2.1. Check Point (Base Unit) --------------------------- 45
9.3. Troubleshooting by Symptom (Handset)----------- 47
9.3.1. Check Point (Handset)----------------------------- 47
10 Disassembly and Assembly Instructions--------------- 50
10.1. Disassembly Instructions------------------------------- 50
10.1.1. Base Unit ---------------------------------------------- 50
10.1.2. Handset------------------------------------------------ 55
10.1.3. Charger Unit ------------------------------------------ 56
10.1.4. How to Replace the Base unit LCD------------- 57
10.2. How to Replace the Handset LCD------------------- 59
11 Measurements and Adjustments -------------------------- 60
11.1. Equipment Required ------------------------------------ 60
11.2. The Setting Method of JIG (Base Unit) ------------- 60
11.2.1. Connections (Base Unit) -------------------------- 60
11.2.2. Connections (Handset) ---------------------------- 61
11.2.3. How to install Batch file into P.C. ---------------- 62
11.2.4. Commands-------------------------------------------- 63
11.3. Adjustment Standard (Base Unit) -------------------- 64
11.3.1. Bottom View ------------------------------------------ 64
11.4. Adjustment Standard (Handset) ---------------------- 65
11.4.1. Component View ------------------------------------ 65
11.5. Things to Do after Replacing IC or X'tal ------------ 66
11.5.1. How to download the data ------------------------ 66
11.6. RF Specification ------------------------------------------ 71
11.6.1. Base Unit ---------------------------------------------- 71
11.6.2. Handset------------------------------------------------ 71
11.7. How to Check the Handset Speaker or
Receiver ---------------------------------------------------- 72
11.8. Frequency Table (MHz)--------------------------------- 72
12 Miscellaneous---------------------------------------------------- 73
12.1. How to Replace the LLP (Leadless Leadframe
Package) IC ----------------------------------------------- 73
12.1.1. Preparation-------------------------------------------- 73
12.1.2. Caution------------------------------------------------- 73
12.1.3. How to Remove the IC----------------------------- 73
12.1.4. How to Install the IC -------------------------------- 74
12.2. How to Replace the Flat Package IC --------------- 75
12.2.1. Preparation-------------------------------------------- 75
12.2.2. How to Remove the IC----------------------------- 75
12.2.3. How to Install the IC -------------------------------- 76
12.2.4. How to Remove a Solder Bridge ---------------- 76
12.3. How to Replace the Shield Case--------------------- 77
12.3.1. Preparation-------------------------------------------- 77
12.3.2. Caution------------------------------------------------- 77
12.3.3. How to Remove the Shield Case---------------- 77
12.3.4. How to Install the Shield Case ------------------- 78
12.4. Terminal Guide of the ICs, Transistors and
Diodes ------------------------------------------------------ 79
12.4.1. Base Unit ---------------------------------------------- 79
12.4.2. Handset------------------------------------------------ 79
13 Schematic Diagram -------------------------------------------- 81
13.1. For Schematic Diagram -------------------------------- 81
13.1.1. Base Unit (Schematic Diagram (Base
Unit_Main)) ------------------------------------------- 81
4
KX-TGF310RUM/KX-TGF320RUM/KX-TGF320UCM/KX-TGFA30RUM
13.1.2. Handset (Schematic Diagram
(Handset_Main))------------------------------------- 81
13.2. Schematic Diagram (Base Unit_Main)-------------- 82
13.2.1. KX-TGF310RU--------------------------------------- 82
13.2.2. KX-TGF320RU/UC---------------------------------- 84
13.3. Schematic Diagram (Base Unit_Operation) ------- 86
13.4. Schematic Diagram (Base Unit_Hook Switch) --- 86
13.5. Schematic Diagram (Base Unit_LCD) -------------- 88
13.6. Schematic Diagram (Base Unit_LED) -------------- 88
13.7. Schematic Diagram (Handset_Main) --------------- 90
13.7.1. BBIC MODULE Schematic Diagram
(Handset_Main)-------------------------------------- 92
14 Printed Circuit Board ------------------------------------------ 95
14.1. Circuit Board (Base Unit_Main) ---------------------- 95
14.1.1. Component View ------------------------------------ 95
14.1.2. Bottom View ------------------------------------------ 96
14.2. Circuit Board (Base Unit_Operation)---------------- 97
14.3. Circuit Board (Base Unit_Operation_Hook
Switch) ------------------------------------------------------ 99
14.3.1. Component View ------------------------------------ 99
14.3.2. Bottom View ------------------------------------------ 99
14.4. Circuit Board (Base Unit_LCD) --------------------- 101
14.5. Circuit Board (Base Unit_LED) --------------------- 101
14.6. Circuit Board (Handset_Main) ---------------------- 103
14.6.1. Component View ---------------------------------- 103
14.6.2. Bottom View ---------------------------------------- 104
14.7. Circuit Board (Handset_BBIC Module) ----------- 105
14.7.1. Component View ---------------------------------- 105
15 Exploded View and Replacement Parts List --------- 106
15.1. Cabinet and Electrical Parts (Base Unit) --------- 106
15.1.1. KX-TGF310/320 ----------------------------------- 106
15.2. Cabinet and Electrical Parts (Handset)----------- 107
15.3. Cabinet and Electrical Parts (Charger Unit) ----- 108
15.4. Accessories and Packing Materials --------------- 109
15.5. Replacement Parts List --------------------------------110
15.5.1. Base Unit ---------------------------------------------110
15.5.2. Handset -----------------------------------------------114
15.5.3. Charger Unit -----------------------------------------115
15.5.4. Accessories and Packing Materials------------116
15.5.5. Screws ------------------------------------------------116
15.5.6. Fixtures and Tools----------------------------------116
5
KX-TGF310RUM/KX-TGF320RUM/KX-TGF320UCM/KX-TGFA30RUM
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced. 
3. FASTON terminals shall be plugged straight in and unplugged straight out. 
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 
F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 
F ± 20 F (370 C ± 10 C).
• Exercise care while using higher temperature soldering irons.: 
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 
F (600 C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
Component
Component 
pin
Solder
Remove all of the
excess solder
(Slice View)
6
KX-TGF310RUM/KX-TGF320RUM/KX-TGF320UCM/KX-TGFA30RUM
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
0.3 mm X 100 g
0.6 mm X 100 g
1.0 mm X 100 g
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Panasonic KX-TGF310RUM / KX-TGF320RUM / KX-TGF320UCM / KX-TGFA30RUM Service Manual ▷ Download

  • DOWNLOAD Panasonic KX-TGF310RUM / KX-TGF320RUM / KX-TGF320UCM / KX-TGFA30RUM Service Manual ↓ Size: 9.24 MB | Pages: 116 in PDF or view online for FREE
  • Here you can View online or download the Service Manual for the Panasonic KX-TGF310RUM / KX-TGF320RUM / KX-TGF320UCM / KX-TGFA30RUM in PDF for free, which will help you to disassemble, recover, fix and repair Panasonic KX-TGF310RUM / KX-TGF320RUM / KX-TGF320UCM / KX-TGFA30RUM Telephone. Information contained in Panasonic KX-TGF310RUM / KX-TGF320RUM / KX-TGF320UCM / KX-TGFA30RUM Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.