DOWNLOAD Panasonic KX-TG8621RUM / KX-TGA860RUM Service Manual ↓ Size: 2.83 MB | Pages: 87 in PDF or view online for FREE

61

Ch.

Frequency (MHz)

Ch.

Frequency (MHz)

Ch.

Frequency (MHz)

0

2402

33

2435

66

2468

1

2403

34

2436

67

2469

2

2404

35

2437

68

2470

3

2405

36

2438

69

2471

4

2406

37

2439

70

2472

5

2407

38

2440

71

2473

6

2408

39

2441

72

2474

7

2409

40

2442

73

2475

8

2410

41

2443

74

2476

9

2411

42

2444

75

2477

10

2412

43

2445

76

2478

11

2413

44

2446

77

2479

12

2414

45

2447

78

2480

13

2415

46

2448

14

2416

47

2449

15

2417

48

2450

16

2418

49

2451

17

2419

50

2452

18

2420

51

2453

19

2421

52

2454

20

2422

53

2455

21

2423

54

2456

22

2424

55

2457

23

2425

56

2458

24

2426

57

2459

25

2427

58

2460

26

2428

59

2461

27

2429

60

2462

28

2430

61

2463

29

2431

62

2464

30

2432

63

2465

31

2433

64

2466

32

2434

65

2467

62

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.

• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700 

°F ± 20 °F (370 °C ± 10 °C)

Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.

• Flux

Recommended Flux: Specific Gravity 

→ 0.82.

Type 

→ RMA (lower residue, non-cleaning type)

Note: See About Lead Free Solder (Pbf: Pb free) (P.4)

1. Put plenty of solder on the IC pins so that the pins can be completely covered.

If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.

3. While the solder melts, remove it together with the IC pins.

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.

63

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

64

• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700

°F ± 20°F (370°C ± 10°C)

Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less 
experience could overheat and damage the PCB foil.

• Hot Air Desoldering Tool

Temperature: 608

°F ± 68°F (320°C ± 20°C)

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.

1. Cut the case along perforation.

2. Remove the cut part.

3. Cut the four corners along perforation.

4. Remove the reminds by melting solder.