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Model
KX-TG8105RU KX-TG8106RU KX-TGA810RU KX-TG8106RUT KX-TG8106RUS
Pages
91
Size
4 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / DIGITAL CORDLESS PHONE
File
kx-tg8105ru-kx-tg8106ru-kx-tga810ru-kx-tg8106rut-k.pdf
Date

Panasonic KX-TG8105RU / KX-TG8106RU / KX-TGA810RU / KX-TG8106RUT / KX-TG8106RUS Service Manual ▷ View online

5
KX-TG8105RU/KX-TG8106RU/KX-TGA810RU
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other materi-
als. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.2.2.
How to Recognize that Pb Free Solder is Used
(Example: Handset P.C.B.)
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
PbF
11
0
16
17
11
32
27
26
IC1
KX-TG8120/TG8100/TGA810
IC4
PQUP11411Z
1
80
20
21
40
61
41
60
IC3
1
4
8
5
Marked
6
KX-TG8105RU/KX-TG8106RU/KX-TGA810RU
3 Specifications
7
KX-
T
G81
05
RU/KX
-TG81
0
6RU
/K
X
-T
G
A8
1
0RU
4
Technical Descriptions
4.1.
Block Diagra
m (Base Unit)
Analog
Front
End
To TEL_LINE
A
B
CN1
Bridge
Rect D3
D3
Hook Switch
Q4,Q5
Audio
Bell/Caller ID
Interface
Analog
Switch
CPU
59
54
61
52
60
56
55
BELL
HOOK
Off-Hook Line Voltage
64 ADCO
D/A
A/D
ADPCM
Codec Filter
DSP
Speech Decoding
Speech Encoding
BMC
Burst Decoding
Burst Encoding
RF
Interface
18
19
TXDA
RXDA
15
21
20
22
RSSI
SYCL
SYDA
SYEN
ANT1
ANT2
RF Module
18
16
2
31
8
21
14
13
12
12
13
XTAL
X1
10.368
MHz
EEPROM
SCL
SDA
6
5
To AC Adaptor
CN2
Limit
Resistor
CHARGE
CONTACT
VUNREG
3.3V
Reg.
IC1
2.5V
Reg.
Q9
1.8V
Reg. Q8
3.3V
2.5V
1.8V
BBIC
IC5
IC7
IC10
KX-TG8105/8106 BLOCK DIAGRAM (BASE UNIT)
8
KX-TG8105RU/KX-TG8106RU/KX-TGA810RU
4.2.
Circuit Operation (Base Unit)
4.2.1.
Outline
Base Unit consists of the following ICs as shown in Block Diagram (Base Unit) (P.7).
• DECT BBIC (Base Band IC): IC7
- Handling all the audio, signal and data processing needed in a DECT base unit
- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
- ADPCM code filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
- DTMF receiver (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- All interfaces (ex: RF module, EEPROM, LED, Analog Front End, etc.)
• RF Module: IC10
- PLL Oscillator
- Detector
- Compress/Expander
- First Mixer
- Amplifier for transmission and reception
• EEPROM: IC5
- Temporary operating parameters (for RF, etc.)
• Additionally,
- Power Supply Circuit (+3.3V, +2.5V, +1.8V output)
- Crystal Circuit (10.368MHz)
- Charge Circuit
- Telephone Line Interface Circuit
4.2.2.
Power Supply Circuit
The power is supplied to the DECT BBIC, RF Module, EEPROM and Charge Contact from AC Adaptor (+6.5V) as shown in
Fig.101. The power supply is as follows;
• DECT BBIC (IC7): 
CN2 (+6.5V) 
→ IC1 → Q9 → IC7
CN2 (+6.5V) 
→ IC1 → Q8 → IC7
• RF Module (IC10): 
CN2 (+6.5V) 
→ IC1 → Q9 → IC10 (PLL)
CN2 (+6.5V) 
→ IC1 → Q10 → IC10 (Power AMP)
• EEPROM (IC5): 
CN2 (+6.5V) 
→ IC1 → Q9 → IC5
• Charge Contact (TP16): 
CN2 (+6.5V) 
→ R55, R56 → TP16
<Fig.101>
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