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ORDER NO. KM40802518CE

Digital Cordless Phone

Ivory Version
Silver Version
Titanium Black Version
(for Ukraine)

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1 Safety Precautions----------------------------------------------- 4

1.1. For Service Technicians --------------------------------- 4

2 Warning -------------------------------------------------------------- 4

2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5

3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7

4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Handset)-------------------------------- 9
4.4. Circuit Operation (Handset)----------------------------10
4.5. Signal Flow-------------------------------------------------11

5 Location of Controls and Components ------------------12

5.1. Controls -----------------------------------------------------12

6 Installation Instructions ---------------------------------------12

6.1. Connections------------------------------------------------12
6.2. Battery-------------------------------------------------------13

7 Operating Instructions-----------------------------------------14

7.1. Base Unit Settings----------------------------------------14
7.2. Handset Settings -----------------------------------------15
7.3. Registering a Handset to a Base Unit---------------16
7.4. Deregistering a Handset --------------------------------16
7.5. Key Lock ----------------------------------------------------16
7.6. For Service Hint-------------------------------------------17

8 Service Mode -----------------------------------------------------18

8.1. Engineering Mode ----------------------------------------18
8.2. How to Clear User Setting------------------------------23
8.3. How to Set when Replacing Unit ---------------------25

9 Troubleshooting Guide ----------------------------------------26

9.1. Error Message---------------------------------------------26
9.2. Troubleshooting-------------------------------------------27
9.3. Check Point ------------------------------------------------29
9.4. How to Replace the Flat Package IC----------------30

10 Disassembly and Assembly Instructions ---------------32

10.1. Disassembly Instructions -------------------------------32

11 Measurements and Adjustments---------------------------34

11.1. Preparation-------------------------------------------------34
11.2. Connections------------------------------------------------35
11.3. TEST Mode Settings ------------------------------------37
11.4. Read ID -----------------------------------------------------38
11.5. Adjustment Standard ------------------------------------39
11.6. Adjust Frequency  ----------------------------------------41
11.7. Adjust Voltage ---------------------------------------------42

12 Schematic Diagram ---------------------------------------------44

12.1. For Schematic Diagram---------------------------------44
12.2. Schematic Diagram (Base Unit_Main) --------------45
12.3. Schematic Diagram (Handset) ------------------------48

13 Printed Circuit Board-------------------------------------------51

13.1. Circuit Board (Base Unit) -------------------------------51
13.2. Circuit Board (Handset) ---------------------------------53

14 Appendix Information of Schematic Diagram ---------55

14.1. Terminal Guide of the ICs, Transistors and

Diodes -------------------------------------------------------55

15 Exploded View and Replacement Parts List -----------56

15.1. Cabinet and Electrical Parts (Base Unit) -----------56
15.2. Cabinet and Electrical Parts (Handset) -------------57
15.3. Accessories and Packing Materials------------------58

15.4. Replacement Part List ---------------------------------- 61

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• Repair service shall be provided in accordance with repair technology information such as service manual so as to 

prevent fires, injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 
2. If a lead wire assembly is supplied as a repair part, the leadwire assembly shall be replaced. 
3. FASTON terminals shall be plugged straight in and unplugged straight out. 

• ICs and LSIs are vulnerable to static electricity.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.

• PbF solder has a melting point that is 50 

°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with 

temperature control and adjust it to 700 

°F ± 20 °F (370 °C ± 10 °C). 

• Exercise care while using higher temperature soldering irons.: 

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 

°F (600 °C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See the figure below).