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There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

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• Design and specifications are subject to change without notice.

• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line

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Analog

Front

End

T

o TEL_LINE

Bridge

Rect

 D3D3

Hook Switch

Q3, Q4Q3,

Q4

Audio

Bell/Caller ID

Interface

CPU

24

22

29

26

27

25

30

BELL

HOOK

Off-Hook Line Voltage

31

A/D

D/A

ADPCM

Codec Filter

DSP

Speech Encoding

Speech Decoding

BMC

Burst Encoding

Burst Decoding

RF

PLL

5

3

97

95

9

10

EEPROM

SCL

SDA

67

68

54

66

65

64

63

16

17

15

14

85

To AC Adaptor

Limit

Resistor

Charge

Detector

CHARGE

CONTACT

(Optional)

VUNREG

3.0V

Reg.

IC1

2.4V

Reg.

Q401

1.8V

Reg.

Q8

3.0 V

2.4 V

1.8 V

BBIC

FLASH MEMORY

(TAM)

TAM Companion IC

MIC

SP

MOD/DEMOD

Charge

Pump

53

2.5V

X

T

A

L

X

1

X1

10.3

68

M

H

z

R

X

n

R

X

p

T

X

p

T

X

n

P

on

P

S

E

L

V

DD

-P

A

D

R

V

4

3

6

7

T

X

on

R

X

on

D

801

D802

6

92

AN

T1

AN

T2

9

8

AN

T1

AN

T2

R

F

 P

A

AN

T1

ANT2

98

93

94

100

L

1

L

2

L

1

L2

2

1

91

0

1

1

1

2

2

3

CE

SPI_DI

SPI_DO

SPI_CLK

SPI_EN

RST

SCK

SI

SO

6

5

14

16

27

31

2

KX-TG

80

41 BLOCK DIA

GRAM

(BASE UNIT)

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Base Unit consists of the following ICs as shown in Block Diagram (Base Unit) (P.7).

• DECT BBIC (Base Band IC): IC7

- Handling all the audio, signal and data processing needed in a DECT base unit
- Controlling the DECT specific physical layer and radio section (Burst Module Controller section)
- ADPCM code filter for speech encoding and speech decoding (DSP section)
- Echo-cancellation and Echo-suppression (DSP section)
- Any tones (tone, sidetone, ringing tone, etc.) generation (DSP section)
- DTMF receiver (DSP section)
- Clock Generation for RF Module
- ADC, DAC, timer, and power control circuitry
- PLL Oscillator
- Detector 
- Compress/Expander
- First Mixer
- All interfaces (ex: RF Power Amp, EEPROM, LED, Analog Front End, etc.)

• RF Power Amp.: IC801

- Amplifier for transmission and reception

• EEPROM: IC401

- Temporary operating parameters (for RF, etc.)

• FLASH MEMORY: IC421

- Voice Prompt (TAM) D/L Area
- ICM/OGM Recording Area

• TAM Companion: IC201

- Voice Compression

• Additionally,

- Power Supply Circuit (+3.0 V, +2.4 V, +1.8 V output)
- Crystal Circuit (10.368 MHz)
- Charge Circuit
- Telephone Line Interface Circuit