Panasonic KX-TG8011RUC / KX-TG8011RUS / KX-TG8011RUT / KX-TG8012RUS / KX-TG8012RUT / KX-TGA800RUC / KX-TGA800RUS / KX-TGA800RUT Service Manual ▷ View online
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KX-TG8011RU/KX-TG8012RU/KX-TGA800RU
12.3. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
12.3.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
°F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity
→ 0.82.
Type
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (Pbf: Pb free) (P.4)
12.3.2. How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
left at the joint on the board, the new IC will not be attached properly.
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12.3.3. How to Install the IC
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
12.3.4. How to Remove a Solder Bridge
1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
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12.4. Terminal Guide of the ICs, Transistors and Diodes
12.4.1. Base Unit
12.4.2. Handset
12.4.3. Charger Unit
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13 Schematic Diagram
13.1. For Schematic Diagram
13.1.1. Base Unit (Schematic Diagram (Base Unit))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagram may be modified at any time with the development of new technology.
13.1.2. Handset (Schematic Diagram (Handset))
Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
2. The schematic diagram may be modified at any time with the development of new technology.
2. The schematic diagram may be modified at any time with the development of new technology.
13.1.3. Charger Unit (Schematic Diagram (Charger Unit))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
2. The schematic diagram may be modified at any time with the development of new technology.
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