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Model
KX-TG7331CAM KX-TG7331CAT KX-TGA731RUM KX-TGA731RUT KX-TGA731RUC KX-TGA731RUS
Pages
102
Size
2.85 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / TELEPHONE EQUIPMENT
File
kx-tg7331cam-kx-tg7331cat-kx-tga731rum-kx-tga731ru.pdf
Date
PREV: Panasonic KX-TG7321UAC / KX-TG7321UAS / KX-TGA731RUC / KX-TGA731RUS (serv.man4) Service Manual / Supplement

Panasonic KX-TG7331CAM / KX-TG7331CAT / KX-TGA731RUM / KX-TGA731RUT / KX-TGA731RUC / KX-TGA731RUS Service Manual ▷ View online

69
KX-TG7331CAM/KX-TG7331CAT/KX-TGA731RUM/KX-TGA731RUT/KX-TGA731RUC/KX-TGA731RUS
59
P1_3/INT3/SIO
D.I
ROW2
I_0/1
I-PD
60
P1_2/INT2/SK
D.I
ROW3
I_0/1
I-PU
61
P1_1/INT1/LE
D.I
N.C.
I_0/1
I-PU
62
P2_6/WTF_IN
-
GND
-
I-PU
63
P0_7/SPI_DI
D.I
N.C.
I_0/1
I-PU
64
P0_6/SPI_DO
D.O
N.C.
O_0/1
I-PU
65
P0_5/SPI_CLK
D.O
N.C.
O_0/1
I-PU
66
P0_4/SPI_EN
D.O
N.C.
O_0/1
I-PU
67
P0_3/SCL2
D.O
SCL2
O_0/1
I-PU
68
P0_2/SDA2
D.I/O
SDA2
I/O_0/1
I-PU
69
P0_1/URX/PWM0
D.I
URX
I_0/1
I-PU
70
P0_0/UTX
D.O
UTX
O_0/1
I-PU
71
P5_0
D.O
KEY0
O_0/1
I-PU
72
P5_1
D.O
KEY1
O_0/1
I-PU
73
P5_2
D.O
KEY2
O_0/1
I-PU
74
P5_3
D.O
KEY3
O_0/1
I-PU
75
P5_4
D.O
KEY4
O_0/1
I-PU
76
RSTn
A.O
RSTn
A.O
I-PU
77
JTAG
D.I/O
JTAG
I/O_0/1
I-PU
78
P2_5/PCM_FSC/SF
D.O
PCM_FSC
O_0/1
I-PU
79
P2_4/SCL1/PCM_DO/
DP3
D.O
PCM_DO
O_0/1
I-PU
80
P2_3/SDA1/PCM_DI/DP2 D.I
PCM_DI
I_0/1
I-PU
81
P2_2/PCM_CLK/CLK100 D.O
PCM_CLK
O_0/1
I-PU
82
P5_5
D.O
KEY5
O_0/1
I-PU
83
P5_6
D.O
EEP_WP
O_0
I-PU
84
P5_7
D.O
N.C.
O_Low
I-PU
85
P2_1/ECZ2/PWM1/LED4 D.O
TAM_RESET
O_0/1
I
86
P2_0/ECZ1/PWM0/LED3 D.O
Low_Rad
O_0/1
I
87
NC
-
NC
-
-
88
VSS
-
GND
-
-
89
VDD3
-
+1.8V
-
-
90
LDORF_CTRL
A.I
LDORF_CTRL
A.I
A.I
91
RF_SUPPLY2
-
RF_SUPPLY2
-
-
92
RFP0n
D.O
ANT2
O_0/1
Hi-Z
93
RFP4
D.O
PON
O_0/1
Hi-Z
94
RFP3
D.O
PSEL
O_0/1
Hi-Z
95
VDD_PADR
A.O
VDD_PADRV
A.O
A.O
96
VSS_PADR1
-
GND
-
-
97
RF_TXn
A.O
TXp
A.O
A.O
98
RF_TXp
A.O
TXn
A.O
A.O
99
VSS_PADR2
-
GND
-
-
100
RFP2
D.O
TXON
D.O
Hi-Z
101
GND
-
GND
-
-
Pin No.
Description
I/O
Connection
at Normal mode
at Reset mode
70
KX-TG7331CAM/KX-TG7331CAT/KX-TGA731RUM/KX-TGA731RUT/KX-TGA731RUC/KX-TGA731RUS
12.2. CPU Data (Handset)
12.2.1. IC1 (BBIC)
Pin No.
Description
I/O
Connection
at Normal mode
at Reset mode
1
VSS_LNA1
-
GND
-
-
2
RF_RXp
A.I
RF_RXp
A.I
A.I
3
RF_RXn
A.I
RF_RXn
A.I
A.I
4
VSS_LNA2
-
GND
-
-
5
RFP1
D.O
RXON
O_0/1
Hi-Z
6
RFP0
D.O
ANT1
O_0/1
Hi-Z
7
REF_RES
A.O
REF_RES
A.O
A.O
8
AVS_XTAL
-
GND
-
-
9
XTAL2
A.I
XTAL2
A.I
A.I
10
XTAL1
A.I
XTAL1
A.I
A.I
11
AVD_XTAL
-
AVD_XTAL
-
-
12
RF_SUPPLY1
-
RF_SUPPLY1
-
-
13
LDO_CTRL
A.O
LDO_CTRL
A.O
O-1
14
AVD
-
+1.8V
-
-
15
LSRn
A.O
LSRn
A.O
A.O
16
LSRp
A.O
LSRp
A.O
A.O
17
VREFm
-
GND
-
-
18
MICh
A.I
N.C.
A.I
A.I
19
CIDOUT/MICn
A.I
MICn
A.I
A.I
20
CIDINn/MICp
A.I
MICp
A.I
A.I
21
CIDINp/VREFp
A.O
VREFp
A.O
A.I
22
RINGp/P3_7
D.O
COL4
O_0/1
A.I
23
RINGn/P3_6
D.O
COL3
O_0/1
A.I
24
RINGOUT/RINGING/
P3_5
D.O
COL2
O_0/1
A.I
25
PARADET/P3_4
D.O
COL1
O_0/1
A.I
26
ADC0/P3_3
D.O
COL0
O_0/1
A.I
27
ADC1/INT0/P1_0
D.I
ROW0
I_0/1
I-PU
28
NTC/ADC2
A.I
ADC2
I_0
A.I
29
SOCp
A.I
SOCp
A.I
A.I
30
SOCn
A.I
SOCn
A.I
A.I
31
CHARGE_CTRL
A.O
CHARGE_CTRL
A.O
O-0
32
P1_7/CHARGE
A.I
CHARGE
A.I
I-PD
33
PAOUTp/P3_1
A.O
PAOUTp
A.O
O-0
34
VDDPA
-
VDDPA
-
-
35
PAOUTn/P3_0
A.O
PAOUTn
A.O
O-0
36
VBAT1
-
VBAT1
-
-
37
CP_C1x
A.I/O
CP_C1x
A.I/O
A.I
38
CP_C2x
A.I/O
CP_C2x
A.I/O
A.I
39
CP_C1y
A.I/O
CP_C1y
A.I/O
A.I
40
VBAT2
-
VBAT2
-
-
41
CP_C2y
A.I/O
CP_C2y
A.I/O
A.I
42
CP_VOUT1/LED1
A.O
CP_VOUT1
A.O
A.I
43
CP_VOUT2/LED2
A.O
CP_VOUT2
A.O
A.I
44
PON/P1_6
A.I
PON
A.I
I-PD
45
VDD1
-
+1.8V
-
-
46
P2_7/BXTAL
D.O
COL5
O_0/1
I-PU
47
P1_5/INT5/RDI/VDDE
D.O
N.C.
O_0
O-1
48
P1_4/INT4/TDOD
D.O
DCDC_REG_CS
O_0/1
I-PD
49
P1_3/INT3/SIO
D.I
ROW3
I_0/1
I-PD
50
P1_2/INT2/SK
D.I
ROW2
I_0/1
I-PU
51
P1_1/INT1/LE
D.I
ROW1
I_0/1
I-PU
52
P2_6/WTF_IN
D.O
KEY_LED
O_0/1
I-PU
53
P0_7/SPI_DI
D.O
EEPROM_WP
O_0/1
I-PU
54
P0_6/SPI_DO
D.O
LCD_SDA
O_0/1
I-PU
55
P0_5/SPI_CLK
D.O
LCD_SCL
O_0/1
I-PU
56
P0_4/SPI_EN
D.O
LCD_CD
O_0/1
I-PU
57
P0_3/SCL2
D.O
SCL
O_0/1
I-PU
58
P0_2/SDA2
D.I/O
SDA
I/O_0/1
I-PU
59
P0_1/URX
D.I
URX
I_0/1
I-PU
60
P0_0/UTX
D.O
UTX
O_0/1
I-PU
61
RSTn
D.O
RSTn
O_0/1
I-PU
71
KX-TG7331CAM/KX-TG7331CAT/KX-TGA731RUM/KX-TGA731RUT/KX-TGA731RUC/KX-TGA731RUS
62
JTAG
D.I/O
JTAG
I/O_0/1
I-PU
63
P2_5/PCM_FSC/SF
D.O
LCD_CSB
O_0/1
I-PU
64
P2_4/SCL1/PCM_DO/
DP3
D.O
N.C.
O_0
I-PU
65
P2_3/SDA1/PCM_DI/DP2
D.O
N.C.
O_0
I-PU
66
P2_2/PCM_CLK/CLK100
D.O
LCD_RESET
O_0/1
I-PU
67
P2_1/ECZ2/PWM1/LED4
D.I
N.C.
O_0
A.I
68
P2_0/ECZ1/PWM0/LED3
D.O
BELL_LED_A
A.I
A.I
69
VDD2
-
+1.8V
-
-
70
LDORF_CTRL
A.I
N.C.
A.I
A.I
71
RF_SUPPLY2
-
RF_SUPPLY2
-
-
72
RF0n
D.O
ANT2
O_0/1
Hi-Z
73
RFP4
D.O
PON
O_0/1
Hi-Z
74
RFP3
D.O
PSEL
O_0/1
Hi-Z
75
VDD_PADR
A.O
VDD_PADRV
A.O
A.O
76
VSS_PADR1
-
GND
-
-
77
RF_TXp
A.O
TXp
A.O
A.O
78
RF_TXn
A.O
TXn
A.O
A.O
79
VSS_PADR2
-
GND
-
-
80
RFP2
D.O
TXON
O_0/1
Hi-Z
81
GND
-
GND
-
-
Pin No.
Description
I/O
Connection
at Normal mode
at Reset mode
72
KX-TG7331CAM/KX-TG7331CAT/KX-TGA731RUM/KX-TGA731RUT/KX-TGA731RUC/KX-TGA731RUS
12.3. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
12.3.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 
°F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity 
→ 0.82.
Type 
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (Pbf: Pb free) (P.4)
12.3.2. How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
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