Panasonic KX-TG7321UAC / KX-TG7321UAS / KX-TGA731RUC / KX-TGA731RUS Service Manual ▷ View online
ORDER NO. KM40804564CE
Telephone Equipment
Model No.
KX-TG7321UAC
KX-TG7321UAS
KX-TGA731RUC
KX-TGA731RUS
KX-TG7321UAS
KX-TGA731RUC
KX-TGA731RUS
Digital Cordless Answering System
Blue Version
Silver Version
(for Ukrainian)
Silver Version
(for Ukrainian)
2
KX-TG7321UAC/KX-TG7321UAS/KX-TGA731RUC/KX-TGA731RUS
3
KX-TG7321UAC/KX-TG7321UAS/KX-TGA731RUC/KX-TGA731RUS
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
2.3. Discarding of P.C. Board--------------------------------- 5
2.2. About Lead Free Solder (Pbf: Pb free)--------------- 4
2.3. Discarding of P.C. Board--------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4 Technical Descriptions ----------------------------------------- 7
4.1. Block Diagram (Base Unit) ------------------------------ 7
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Handset)-------------------------------11
4.4. Circuit Operation (Handset)----------------------------12
4.5. Circuit Operation (Charger Unit) ----------------------13
4.6. Signal Route -----------------------------------------------14
4.2. Circuit Operation (Base Unit) --------------------------- 8
4.3. Block Diagram (Handset)-------------------------------11
4.4. Circuit Operation (Handset)----------------------------12
4.5. Circuit Operation (Charger Unit) ----------------------13
4.6. Signal Route -----------------------------------------------14
5 Location of Controls and Components ------------------16
5.1. Controls -----------------------------------------------------16
6 Installation Instructions ---------------------------------------17
6.1. Connections------------------------------------------------17
6.2. Battery-------------------------------------------------------18
6.2. Battery-------------------------------------------------------18
7 Operating Instructions-----------------------------------------19
7.1. Programmable Settings ---------------------------------19
7.2. Registering a Handset to the Base Unit ------------21
7.3. Dialling Mode (Tone/Pulse) ----------------------------22
7.4. Error Messages -------------------------------------------22
7.5. Troubleshooting-------------------------------------------23
7.6. For Service Hint-------------------------------------------26
7.2. Registering a Handset to the Base Unit ------------21
7.3. Dialling Mode (Tone/Pulse) ----------------------------22
7.4. Error Messages -------------------------------------------22
7.5. Troubleshooting-------------------------------------------23
7.6. For Service Hint-------------------------------------------26
8 Service Mode -----------------------------------------------------27
8.1. Engineering Mode ----------------------------------------27
8.2. Copying Phonebook Items when Repairing -------31
8.3. How to Clear User Setting------------------------------33
8.2. Copying Phonebook Items when Repairing -------31
8.3. How to Clear User Setting------------------------------33
9 Troubleshooting Guide ----------------------------------------34
9.1. Troubleshooting Flowchart -----------------------------34
9.2. Troubleshooting by Symptom (Base Unit and
9.2. Troubleshooting by Symptom (Base Unit and
Charger Unit) ----------------------------------------------46
9.3. Troubleshooting by Symptom (Handset) -----------50
9.4. How to Replace the Flat Package IC----------------54
9.5. How to Replace the LLP (Leadless Leadframe
9.4. How to Replace the Flat Package IC----------------54
9.5. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------56
10 Disassembly and Assembly Instructions ---------------58
10.1. Disassembly Instructions -------------------------------58
10.2. How to Replace the Handset LCD -------------------62
10.2. How to Replace the Handset LCD -------------------62
11 Measurements and Adjustments---------------------------63
11.1. The Setting Method of JIG (Base Unit) -------------63
11.2. Adjustment Standard (Base Unit)---------------------65
11.3. Adjustment Standard (Charger Unit)-----------------66
11.4. The Setting Method of JIG (Handset) ---------------67
11.5. Adjustment Standard (Handset) ----------------------69
11.6. Things to Do after Replacing IC or X'tal ------------70
11.7. RF Specification-------------------------------------------72
11.8. How to Check the Handset Speaker or
11.2. Adjustment Standard (Base Unit)---------------------65
11.3. Adjustment Standard (Charger Unit)-----------------66
11.4. The Setting Method of JIG (Handset) ---------------67
11.5. Adjustment Standard (Handset) ----------------------69
11.6. Things to Do after Replacing IC or X'tal ------------70
11.7. RF Specification-------------------------------------------72
11.8. How to Check the Handset Speaker or
Receiver ----------------------------------------------------73
11.9. Frequency Table (MHz) ---------------------------------73
12 Schematic Diagram ---------------------------------------------74
12.1. For Schematic Diagram---------------------------------74
12.2. Schematic Diagram (Base Unit) ----------------------76
12.3. Schematic Diagram (Base Unit_Operation) -------78
12.4. Schematic Diagram (Handset) ------------------------80
12.5. Schematic Diagram (Charger Unit) ------------------82
12.2. Schematic Diagram (Base Unit) ----------------------76
12.3. Schematic Diagram (Base Unit_Operation) -------78
12.4. Schematic Diagram (Handset) ------------------------80
12.5. Schematic Diagram (Charger Unit) ------------------82
13 Printed Circuit Board ------------------------------------------ 83
13.1. Circuit Board (Base Unit_MAIN) --------------------- 83
13.2. Circuit Board (Base Unit_Operation)---------------- 85
13.3. Circuit Board (Handset) -------------------------------- 87
13.4. Circuit Board (Charger Unit)--------------------------- 89
13.2. Circuit Board (Base Unit_Operation)---------------- 85
13.3. Circuit Board (Handset) -------------------------------- 87
13.4. Circuit Board (Charger Unit)--------------------------- 89
14 Appendix Information of Schematic Diagram --------- 90
14.1. CPU Data (Base Unit) ---------------------------------- 90
14.2. CPU Data (Handset) ------------------------------------ 92
14.3. Terminal Guide of the ICs, Transistors and
14.2. CPU Data (Handset) ------------------------------------ 92
14.3. Terminal Guide of the ICs, Transistors and
Diodes ------------------------------------------------------ 94
15 Exploded View and Replacement Parts List ----------- 95
15.1. Cabinet and Electric Parts (Base Unit) ------------- 95
15.2. Cabinet and Electric Parts (Handset) --------------- 96
15.3. Cabinet and Electric Parts (Charger Unit) --------- 97
15.4. Accessories and Packing Materials ----------------- 98
15.5. Replacement Part List -------------------------------- 100
15.2. Cabinet and Electric Parts (Handset) --------------- 96
15.3. Cabinet and Electric Parts (Charger Unit) --------- 97
15.4. Accessories and Packing Materials ----------------- 98
15.5. Replacement Part List -------------------------------- 100
4
KX-TG7321UAC/KX-TG7321UAS/KX-TGA731RUC/KX-TGA731RUS
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as technical guides so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a wiring unit is supplied as a repair part, the entire wiring unit shall be replaced, rather than repairing and connecting the
2. If a wiring unit is supplied as a repair part, the entire wiring unit shall be replaced, rather than repairing and connecting the
wires, even when only some of its wires are broken.
3. FASTON terminals shall be plugged straight in and unplugged straight out, rather than jiggling them into or out of position.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2.
About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50
°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700
°F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).