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Model
KX-TG6811RUB KX-TG6811RUM KX-TG6812RUB KX-TG6821RUB KX-TG6821RUM KX-TG6822RUM KX-TG6881RUB KX-TG6891RUB KX-TGA681RUB KX-TGA681RUM KX-TGA20EXB
Pages
95
Size
6.85 MB
Type
PDF
Document
Service Manual
Brand
Device
Telephone / DIGITAL CORDLESS PHONE
File
kx-tg6811rub-kx-tg6811rum-kx-tg6812rub-kx-tg6821ru.pdf
Date

Panasonic KX-TG6811RUB / KX-TG6811RUM / KX-TG6812RUB / KX-TG6821RUB / KX-TG6821RUM / KX-TG6822RUM / KX-TG6881RUB / KX-TG6891RUB / KX-TGA681RUB / KX-TGA681RUM / KX-TGA20EXB Service Manual ▷ View online

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KX-TG6811RUB/KX-TG6811RUM/KX-TG6812RUB/KX-TG6821RUB/KX-TG6821RUM/KX-TG6822RUM/KX-TG6881RUB/KX-TG6891RUB/KX-TGA681RUB/KX-TGA681RUM/KX-TGA20EXB
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2.
About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 
F ~ 70 F (30 C ~ 40 C) higher than Pb solder. Please use a soldering iron with 
temperature control and adjust it to 700 
F ± 20 F (370 C ± 10 C). 
• Exercise care while using higher temperature soldering irons.: 
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 
F (600 C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
Component
Component 
pin
solder
Remove all of the
excess solder
(Slice View)
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KX-TG6811RUB/KX-TG6811RUM/KX-TG6812RUB/KX-TG6821RUB/KX-TG6821RUM/KX-TG6822RUM/KX-TG6881RUB/KX-TG6891RUB/KX-TGA681RUB/KX-TGA681RUM/KX-TGA20EXB
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer’s
specific instructions for the melting points of their products and any precautions for using their product with other materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.
Discarding of P.C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
0.3 mm X 100 g
0.6 mm X 100 g
1.0 mm X 100 g
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KX-TG6811RUB/KX-TG6811RUM/KX-TG6812RUB/KX-TG6821RUB/KX-TG6821RUM/KX-TG6822RUM/KX-TG6881RUB/KX-TG6891RUB/KX-TGA681RUB/KX-TGA681RUM/KX-TGA20EXB
3 Specifications
*1 KX-TG6811/KX-TG6881
*2 KX-TG6821/KX-TG6891
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
• Optional DECT repeater: KX-A405
• Optional Key finder: KX-TGA20RU
Standard:
DECT (Digital Enhanced Cordless Telecommunications), GAP (Generic Access Profile)
Number of Channels:
120 Duplex Channels
Frequency Range:
1.88 GHz to 1.90 GHz
Duplex Procedure:
TDMA (Time Division Multiple Access)
Channel Spacing:
1,728 kHz
Bit Rate:
1,152 kbit/s
Modulation:
GFSK (Gaussian Frequency Shift Keying)
RF Transmission Power:
Approx. 10mW (average power per channel)
Voice Coding:
ADPCM 32 kbit/s
Operating conditions:
0
C - 40C, 20 % - 80 % relative air humidity (dry)
Power source (AC Adaptor):
220 - 240 V AC, 50/60 Hz
Base unit: PNLV226CE0Z
Charger: PNLV233CEKZ 
Power consumption:
Base unit
*1
:
Standby: Approx. 0.6 W
Maximum: Approx. 2.5 W
Base unit
*2
:
Standby: Approx. 0.8 W
Maximum: Approx. 3.1 W
Charger:
Standby: Approx. 0.12 W
Maximum: Approx. 1.8 W
Dimensions:
Base unit: Approx. 107 mm x 86 mm x 77 mm
Handset: Approx. 48 mm x 29 mm x 164 mm
Charger unit: Approx. 70 mm x 70 mm x 39 mm 
Mass (Weight):
Base unit
*1
: Approx. 100 g
Base unit
*2
: Approx. 120 g  
Handset: Approx. 130 g  
Charger: Approx. 40 g  
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KX-TG6811RUB/KX-TG6811RUM/KX-TG6812RUB/KX-TG6821RUB/KX-TG6821RUM/KX-TG6822RUM/KX-TG6881RUB/KX-TG6891RUB/KX-TGA681RUB/KX-TGA681RUM/KX-TGA20EXB
4 Technical Descriptions
4.1.
Block Diagram (Base Unit)
Oper
ational P
.C
. Board
D101
CHARGE_CONT
A
C
T
+
-
SP
X501
13.824 MHz
ANT
2
ANT
1
TEL
 J
A
CK
L1R
L1T
DCP
DCM
DC J
A
CK
RL
Y
LINE
DETECT
SIDE T
O
NE
CIRCUIT
Q161
Q141
BELL
 
DETECT
HOOK
BELL
Q
111
LIN
LOUT
RF_P
AR
T
HSMIP
HSMIN
IC501
BBIC
INUSE
DETECT
 2
RECEIVE
AMP
DCIN 1 and 3
IC302
VCCP
A
VBA
T_APU
VBA
T
VCC_FE
VCC_IF
VCC_VCO
DCINS
CHARGE_DET
3.0V
DOUBOUT
SCL, SDA
WP
VCC
IC601
FLASH
MEMOR
Y
IC61
1
EEPR
OM
MEMOR
Y
KEYS
R151,R152
Q171
DI,CS
MSG_LED
KEYIN 1~3
KEYS_C~E
SPOUTN
SPOUTP
3.0 V
REGULA
T
O
R
Q351,
 Q352
CLK,DO
STM/CKM
R371
R372
D362
Q701, Q702
CHARGE
DETECT
VCCA
VCC
SCL,RST
CS
,CD,SIO
DCIN 2
CAP
_
SW
CAP_CHG
HS_SUPPL
Y_DET
BA
CKUP
CAP
 CIRCUIT
PO
WER
SUPPL
Y
CIRCUIT
FR
OM
HS
C901
optional
optional
TG6721 only
TG6721 only
ANT2
ANT1
RXp
RXn
RXON
TXp
TXn
TXON
RESET
RSTN
KX-TG681
1/6821 BLOCK DI
A
GRAM 
(BASE UNIT)
LED
T
AM counter P
.CBoard
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