Panasonic KX-TG6461RUT / KX-TGA641RUT Service Manual ▷ View online
4
KX-TG6461RUT/KX-TGA641RUT
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1.
Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer's Instructions.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacturer's Instructions.
2.2.
About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50
°F ~ 70 ° F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with tem-
perature control and adjust it to 700
°F ± 20 ° F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
5
KX-TG6461RUT/KX-TGA641RUT
2.2.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other materi-
als.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other materi-
als.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
2.3.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
6
KX-TG6461RUT/KX-TGA641RUT
3 Specifications
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
• Analog telephone connection: Telephone Line
7
KX-TG6461RUT/KX-TGA641RUT
4 Technical Descriptions
4.1.
Block Diagram (Base Unit)
T
E
L Line
D101
Q
111/Q115
RLY
T
ra
n
si
st
o
r
RLY
T
ra
n
si
st
o
r
RLY
T
ra
n
si
st
o
r
RLY
T
ra
n
si
st
o
r
-
+
~
~
-
+
~
~
Hook
SW
Hook
_C
T
R
L
Puls
e
Q
112/Q114
Q
131
LSRp
Side
T
one
Ci
rcu
it
TP
1
0
TP
9
MI
C
h
P3_6
P2_1
Fil
te
r
-
+
~
~
-
+
~
~
Ringer
IC
CIDINp
CIDINn
R
ingi
ng
Fil
te
r
D161
IC101
IC301
IC304
IC801
RF PA
3.75V
3.5V
Q
351
1.8V
2.5V
IC303
VDD/AVD
L
D
O_
CT
RL
RF_SUPPLY
4.3V
D138
BAT
Key
sw
itch
Ma
tr
ix
P5_5-0
P1_5-2
,P2_
0
LED
LED1-4
Q
6
01-Q
604
LC
D
M
odule
Serial
Flas
h m
e
m
o
ry
Serial
EEPRO
M
TA
M
I
C
IC201
X
511
X
tal
(10.368Mhz)
XT
AL1
XT
AL2
IC501
Hands
et
Spea
k
e
r
Mi
c
LCD_CS,LCD_CD,L
CD_RESET
Q6
0
5
-Q6
0
7
SPI_CLK,SPI_DO
CP_
VOUT
1
3.0V
FLASH_CSn
SPI_DI
TA
M
_
W
P
Q
541
IC541
2.5V
SCL2,SDA2
EEP_
W
P
SCL2,SDA2
P5_6
SPI_DI
P0_4
P5_7
SPI_CLK,SPI_DO
KEY
5-0
RO
W
4
-0
G
P
IO
3-0
IC561
P4_7-5
BB
IC
BXT
AL
CL
K
CLK(10.2
68M
Hz
)
T
A
M
_
RESE
T
RST
2.5V
1.8V
2.5V
P3_0
PC
M
_
CLK,DI,DO,FSC
PC
M
_
CLK,DI,DO,FSC
PC
M
_
CLK,D
I,DO,FSC
VDDAVD.
VDDIO
VDD
VDD
LC
D
bac
kl
ight
3.5V_PD
3.5V_PD
VCC
SPI2_CLK,DI,DO
,EN
SPI2_CLK,DI,DO
,EN
IC
IC301
3.5V
Q
351
2.5V
IC303
3.5V_PD
IC
IC301
3.5V
Q
351
2.5V
IC303
Q
341
3.5V_PD
PC102
Ringer
DET
Q
331
PO
W
E
R_F
AIL
INT
1
DC
6.5V
Q
162
Q
608
3.2V_PD
3.2V_PD
VDDPA
22
24
29
85
27
26
30
30,20
54,89
19
12,91
42,45,50
10
9
61
82,7
5-71
57-60
,86
45-43
65,6
4
52
66
63
84
67,6
8
83
56
41
81-78
17-14
RX
o
n
RX
n
RX
p
VDD-PADRV
Tx
on
PSEL
Pon
TX
n
TX
p
BPF
ANT
1
ANT
2
ANT
1
ANT
2
D
A
801
D
A
802
6
5
3
2
95
97
98
93
94
100
92
RFP0
RFP1
RF_RX
n
RF_RX
p
VDD-PADR
RF_T
X
p
RF_T
X
n
RFP4
RFP3
RFP2
RFP0n
VCC
KX-TG6461 BLOCK DIAGRAM (BASE UNIT)
