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1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.

*Check the accuracy of the IC setting with the corresponding soldering foil.

2. Apply flux to all pins of the FLAT PACKAGE IC.

3. Solder the pins, sliding the soldering iron in the direction of the arrow.

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.

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• PbF (: Pb free) Solder
• Soldering Iron

Tip Temperature of 700

°F ± 20°F (370°C ± 10°C)

Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less 
experience could overheat and damage the PCB foil.

• Hot Air Desoldering Tool

Temperature: 608

°F ± 68°F (320°C ± 20°C)

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.

If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.

1. Cut the case along perforation.

2. Remove the cut part.

3. Cut the four corners along perforation.

4. Remove the reminds by melting solder.

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• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
• Shield case’s No. : PNMC1013Z

1. Put the shield case.

2. Solder the surroundings.

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