Panasonic KX-TG1711UAB / KX-TG1711UAJ / KX-TG1711UAW / KX-TGA171RUB / KX-TGA171RUJ / KX-TGA171RUW Service Manual ▷ View online
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KX-TG1711UAB/KX-TG1711UAJ/KX-TG1711UAW/KX-TGA171RUB/KX-TGA171RUJ/KX-TGA171RUW
11.7. How to Check the Handset Speaker or Receiver
1. Prepare the digital voltmeter, and set the selector knob to ohm meter.
2. Put the probes at the speaker terminals as shown below.
2. Put the probes at the speaker terminals as shown below.
11.8. Frequency Table (MHz)
Note:
Channel No. 10: In the Test Mode on Base Unit and Handset.
BASE UNIT
HANDSET
Channel No
Transmit Frequency
Receive Frequency
Transmit Frequency
Receive Frequency
1
1897.344 1897.344 1897.344 1897.344
2
1895.616 1895.616 1895.616 1895.616
3
1893.888 1893.888 1893.888 1893.888
4
1892.160 1892.160 1892.160 1892.160
5
1890.432 1890.432 1890.432 1890.432
6
1888.704 1888.704 1888.704 1888.704
7
1886.976 1886.976 1886.976 1886.976
8
1885.248
1885.248
1885.248
1885.248
9
1883.520 1883.520 1883.520 1883.520
10
1881.792 1881.792 1881.792 1881.792
Is the value between
(+) terminal and (–) terminal about 150
(+) terminal and (–) terminal about 150
Ω
?
NG
NO
OK
YES
Replace the new
speaker.
speaker.
Handset speaker
Digital Voltmeter
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KX-TG1711UAB/KX-TG1711UAJ/KX-TG1711UAW/KX-TGA171RUB/KX-TGA171RUJ/KX-TGA171RUW
12 Miscellaneous
12.1. How to Replace the Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
12.1.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
°F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity
→ 0.82.
Type
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4)
12.1.2. How to Remove the IC
1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
left at the joint on the board, the new IC will not be attached properly.
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KX-TG1711UAB/KX-TG1711UAJ/KX-TG1711UAW/KX-TGA171RUB/KX-TGA171RUJ/KX-TGA171RUW
12.1.3. How to Install the IC
1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
12.1.4. How to Remove a Solder Bridge
1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
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KX-TG1711UAB/KX-TG1711UAJ/KX-TG1711UAW/KX-TGA171RUB/KX-TGA171RUJ/KX-TGA171RUW
12.2. How to Replace the Shield Case
12.2.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608
°F ± 68°F (320°C ± 20°C)
12.2.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
12.2.3. How to Remove the Shield Case
Note:
If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations.
1. Cut the case along perforation.
2. Remove the cut part.
3. Cut the four corners along perforation.
4. Remove the reminds by melting solder.
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