Panasonic KX-TG1107UAJ / KX-TG1107UAM / KX-TGA110UAJ / KX-TGA110UAM Service Manual ▷ View online
KX-TG1107UAJ
KX-TG1107UAM
KX-TGA110UAJ
KX-TGA110UAM
KX-TG1107UAM
KX-TGA110UAJ
KX-TGA110UAM
Digital Cordless Phone
Ivory Version
Metic Grey Version
(for Ukraine)
Telephone Equipment
ORDER NO. KM40703313CE
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
2
FOR SERVICE TECHNICIANS
5
3
CAUTION
5
4
OPERATING INSTRUCTIONS
6
4.1.
Battery
6
4.2.
Location of Controls
7
4.3.
Connections
8
4.4.
Guide to Settings
9
4.5.
For Service Hint
11
5
DISASSEMBLY INSTRUCTIONS
12
5.1.
Base Unit
12
5.2.
Handset
13
6
ASSEMBLY INSTRUCTIONS
14
6.1.
Warning When Constructing the Base Unit
14
6.2.
How to Replace the Handset LCD
15
7
TROUBLESHOOTING GUIDE
16
7.1.
Check Power
17
7.2.
Check Battery Charge
18
7.3.
Check Link
19
7.4.
Check Handset Transmission
21
7.5.
Check Handset Reception
21
7.6.
Check Caller ID
21
7.7.
Bell Reception
21
8
TROUBLESHOOTING BY SYMPTOM (BASE UNIT)
22
8.1.
Check Point (Base Unit)
22
8.2.
The Setting Method of JIG (Base Unit)
26
8.3.
Adjustment Standard (Base Unit)
28
9
TROUBLESHOOTING BY SYMPTOM (HANDSET)
30
9.1.
Check Point (Handset)
30
9.2.
The Setting Method of JIG (Handset)
33
9.3.
Adjustment Standard (Handset)
35
10 THINGS TO DO AFTER REPLACING IC
36
10.1. Base Unit
36
10.2. Handset
36
11 RF SPECIFICATION
37
11.1. Base Unit
37
11.2. Handset
37
12 HOW TO CHECK THE HANDSET SPEAKER
37
13 FREQUENCY TABLE (MHz)
38
14 BLOCK DIAGRAM (BASE UNIT)
39
15 CIRCUIT OPERATION (BASE UNIT)
40
15.1. Outline
40
15.2. Power Supply Circuit
41
15.3. Telephone Line Interface
43
15.4. Transmitter/Receiver
43
15.5. Pulse Dialling
43
16 BLOCK DIAGRAM (HANDSET)
44
17 CIRCUIT OPERATION (HANDSET)
45
17.1. Outline
45
17.2. Power Supply Circuit/Reset Circuit
45
17.3. Charge Circuit
45
17.4. Battery Low/Power Down Detector
45
18 SIGNAL ROUTE
46
19 CPU DATA (BASE UNIT)
47
19.1. IC2 (BBIC)
47
20 CPU DATA (HANDSET)
49
20.1. IC4 (BBIC)
49
21 ENGINEERING MODE
51
21.1. Base Unit
51
21.2. Handset
53
22 EEPROM LAYOUT (BASE UNIT)
55
22.1. Scope
55
22.2. Introduction
55
22.3. EEPROM Layout
55
23 EEPROM LAYOUT (HANDSET)
58
23.1. Scope
58
23.2. Introduction
58
23.3. EEPROM contents
58
24 HOW TO REPLACE THE FLAT PACKAGE IC
61
24.1. PREPARATION
61
24.2. FLAT PACKAGE IC REMOVAL PROCEDURE
61
24.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
62
24.4. BRIDGE MODIFICATION PROCEDURE
62
Note:
Because section 4 of this manual is an extract from the operating instructions for this model, it is subject to change without notice.
You can download and refer to the original operating instruction on TSN Server for further information.
You can download and refer to the original operating instruction on TSN Server for further information.
CONTENTS
Page
Page
2
KX-TG1107UAJ / KX-TG1107U AM / KX-TGA110UAJ / KX-TGA110UAM
25 CABINET AND ELECTRICAL PARTS (BASE UNIT)
63
26 CABINET AND ELECTRICAL PARTS (HANDSET)
64
27 ACCESSORIES AND PACKING MATERIALS
65
27.1. KX-TG1107UAJ/UAM
65
28 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
66
28.1. Base Unit
66
28.2. Handset
66
29 REPLACEMENT PARTS LIST
67
29.1. Base Unit
67
29.2. Handset
68
29.3. Accessories and Packing Materials
69
29.4. Screws
69
29.5. Fixtures and Tools
69
30 FOR SCHEMATIC DIAGRAM
71
30.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
71
30.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
71
31 SCHEMATIC DIAGRAM (BASE UNIT)
72
32 SCHEMATIC DIAGRAM (HANDSET)
74
33 CIRCUIT BOARD (BASE UNIT)
77
33.1. Component View
77
33.2. Flow Solder Side View
78
34 CIRCUIT BOARD (HANDSET)
79
34.1. Component View
79
34.2. Flow Solder Side View
80
3
KX-TG1107UAJ / KX-TG1107U AM / KX-TGA110UAJ / KX-TGA110UAM
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
work we suggest using the same type of solder.
Caution
•
PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C).
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C).
•
Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent
solder splash or damage to the PCB.
solder splash or damage to the PCB.
•
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
•
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
4
KX-TG1107UAJ / KX-TG1107U AM / KX-TGA110UAJ / KX-TGA110UAM