Panasonic KX-TG1105RUJ / KX-TG1105RUM / KX-TG1106RUM / KX-TGA110RUJ / KX-TGA110RUM Service Manual ▷ View online
2007 Panasonic Communications
KX-TG1105RUJ
KX-TG1105RUM
KX-TG1106RUM
KX-TGA110RUJ
KX-TGA110RUM
KX-TG1105RUM
KX-TG1106RUM
KX-TGA110RUJ
KX-TGA110RUM
Digital Cordless Phone
Ivory Version
Metic Grey Version
(for Russia)
Telephone Equipment
ORDER NO. KM40703312CE
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
2
FOR SERVICE TECHNICIANS
5
3
CAUTION
5
4
OPERATING INSTRUCTIONS
6
4.1.
Battery
6
4.2.
Location of Controls
7
4.3.
Connections
8
4.4.
Guide to Settings
9
4.5.
For Service Hint
11
5
DISASSEMBLY INSTRUCTIONS
12
5.1.
Base Unit
12
5.2.
Handset
13
5.3.
Charger Unit
14
6
ASSEMBLY INSTRUCTIONS
15
6.1.
Warning When Constructing the Base Unit
15
6.2.
How to Replace the Handset LCD
16
7
TROUBLESHOOTING GUIDE
17
7.1.
Check Power
18
7.2.
Check Battery Charge
19
7.3.
Check Link
20
7.4.
Check Handset Transmission
22
7.5.
Check Handset Reception
22
7.6.
Check Caller ID
22
7.7.
Bell Reception
22
8
TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
23
8.1.
Check Point (Base Unit)
23
8.2.
The Setting Method of JIG (Base Unit)
28
8.3.
Adjustment Standard (Base Unit)
30
8.4.
Check Point (Charger Unit)
32
8.5.
Adjustment Standard (Charger Unit)
32
9
TROUBLESHOOTING BY SYMPTOM (HANDSET)
33
9.1.
Check Point (Handset)
33
9.2.
The Setting Method of JIG (Handset)
36
9.3.
Adjustment Standard (Handset)
38
10 THINGS TO DO AFTER REPLACING IC
39
10.1. Base Unit
39
10.2. Handset
39
11 RF SPECIFICATION
40
11.1. Base Unit
40
11.2. Handset
40
12 HOW TO CHECK THE HANDSET SPEAKER
40
13 FREQUENCY TABLE (MHz)
41
14 BLOCK DIAGRAM (BASE UNIT)
42
15 CIRCUIT OPERATION (BASE UNIT)
43
15.1. Outline
43
15.2. Power Supply Circuit
44
15.3. Telephone Line Interface
46
15.4. Transmitter/Receiver
46
15.5. Pulse Dialling
46
16 BLOCK DIAGRAM (HANDSET)
47
17 CIRCUIT OPERATION (HANDSET)
48
17.1. Outline
48
17.2. Power Supply Circuit/Reset Circuit
48
17.3. Charge Circuit
48
17.4. Battery Low/Power Down Detector
48
18 CIRCUIT OPERATION (CHARGER UNIT)
49
18.1. Power Supply Circuit
49
19 SIGNAL ROUTE
50
20 CPU DATA (BASE UNIT)
51
20.1. IC2 (BBIC)
51
21 CPU DATA (HANDSET)
53
21.1. IC4 (BBIC)
53
22 ENGINEERING MODE
55
22.1. Base Unit
55
22.2. Handset
57
23 EEPROM LAYOUT (BASE UNIT)
59
23.1. Scope
59
23.2. Introduction
59
23.3. EEPROM Layout
59
24 EEPROM LAYOUT (HANDSET)
62
24.1. Scope
62
24.2. Introduction
62
Note:
Because section 4 of this manual is an extract from the operating instructions for this model, it is subject to change without notice.
You can download and refer to the original operating instruction on TSN Server for further information.
You can download and refer to the original operating instruction on TSN Server for further information.
CONTENTS
Page
Page
2
KX-TG1105RUJ / KX-TG1105R UM / KX-TG1106R UM / KX-TGA110RUJ / KX-TGA110RUM
24.3. EEPROM contents
62
25 HOW TO REPLACE THE FLAT PACKAGE IC
65
25.1. PREPARATION
65
25.2. FLAT PACKAGE IC REMOVAL PROCEDURE
65
25.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
66
25.4. BRIDGE MODIFICATION PROCEDURE
66
26 CABINET AND ELECTRICAL PARTS (BASE UNIT)
67
27 CABINET AND ELECTRICAL PARTS (HANDSET)
68
28 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
69
29 ACCESSORIES AND PACKING MATERIALS
70
29.1. KX-TG1105RUJ/RUM
70
29.2. KX-TG1106RUM
71
30 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
72
30.1. Base Unit
72
30.2. Handset
72
30.3. Charger Unit
72
31 REPLACEMENT PARTS LIST
73
31.1. Base Unit
73
31.2. Handset
74
31.3. Charger Unit
75
31.4. Accessories and Packing Materials
75
31.5. Screws
76
31.6. Fixtures and Tools
76
32 FOR SCHEMATIC DIAGRAM
77
32.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
77
32.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
77
32.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
77
33 SCHEMATIC DIAGRAM (BASE UNIT)
78
34 SCHEMATIC DIAGRAM (HANDSET)
80
35 SCHEMATIC DIAGRAM (CHARGER UNIT)
82
36 CIRCUIT BOARD (BASE UNIT)
83
36.1. Component View
83
36.2. Flow Solder Side View
84
37 CIRCUIT BOARD (HANDSET)
85
37.1. Component View
85
37.2. Flow Solder Side View
86
38 CIRCUIT BOARD (CHARGER UNIT)
87
38.1. Component View
87
38.2. Flow Solder Side View
87
3
KX-TG1105RUJ / KX-TG1105R UM / KX-TG1106R UM / KX-TGA110RUJ / KX-TGA110RUM
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
work we suggest using the same type of solder.
Caution
·
PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C).
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C).
·
Exercise care while using higher temperature soldering irons.: Do not heat the PCB for too long time in order to prevent
solder splash or damage to the PCB.
solder splash or damage to the PCB.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
4
KX-TG1105RUJ / KX-TG1105R UM / KX-TG1106R UM / KX-TGA110RUJ / KX-TGA110RUM
