Panasonic KX-TCD805RUT / KX-TCA180RUT Service Manual ▷ View online
KX-TCD805RUT
KX-TCA180RUT
KX-TCA180RUT
Digital Cordless Phone
Titanium Black Version
(for Russia)
Telephone Equipment
ORDER NO. KM40508848CE
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2
FOR SERVICE TECHNICIANS
5
3
CAUTION
5
4
OPERATING INSTRUCTIONS
6
4.1.
Battery
6
4.2.
Location of Controls
7
4.3.
Connections
8
4.4.
Guide to Settings
9
4.5.
For Service Hint
11
5
DISASSEMBLY INSTRUCTIONS
12
5.1.
Base Unit
12
5.2.
Handset
13
5.3.
Charger Unit
15
6
ASSEMBLY INSTRUCTIONS
16
6.1.
Fix the LCD to the Main P.C.Board (Handset)
16
7
TROUBLESHOOTING FLOWCHART
17
7.1.
Check Power
18
7.2.
Check Battery Charge
19
7.3.
Check Link
20
7.4.
Check Handset Transmission
24
7.5.
Check Handset Reception
24
7.6.
Check Caller ID
24
7.7.
Bell Reception
25
8
TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
26
8.1.
Check Point (Base Unit)
26
8.2.
The Setting Method of JIG (Base Unit)
30
8.3.
Adjustment Standard (Base Unit)
32
8.4.
Check Point (Charger Unit)
34
8.5.
Adjustment Standard (Charger Unit)
34
9
TROUBLESHOOTING BY SYMPTOM (HANDSET)
35
9.1.
Check Point (Handset)
35
9.2.
The Setting Method of JIG (Handset)
39
9.3.
Adjustment Standard (Handset)
41
10 THINGS TO DO AFTER REPLACING IC
42
10.1. Base Unit
42
10.2. Handset
42
11 RF SPECIFICATION
43
11.1. Base Unit
43
11.2. Handset
43
12 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 44
13 FREQUENCY TABLE (MHz)
44
14 BLOCK DIAGRAM (BASE UNIT)
45
15 CIRCUIT OPERATION (BASE UNIT)
46
15.1. Outline
46
15.2. Power Supply Circuit
47
15.3. Telephone Line Interface
48
15.4. Transmitter/Receiver
48
15.5. Pulse Dialling
48
16 BLOCK DIAGRAM (HANDSET)
49
17 CIRCUIT OPERATION (HANDSET)
50
17.1. Outline
50
17.2. Power Supply Circuit/Reset Circuit
50
17.3. Charge Circuit
50
17.4. Battery Low/Power Down Detector
51
17.5. Speakerphone
51
18 CIRCUIT OPERATION (CHARGER UNIT)
52
18.1. Power Supply Circuit
52
19 SIGNAL ROUTE
53
20 CPU DATA (BASE UNIT)
54
20.1. IC8 (BBIC)
54
21 CPU DATA (HANDSET)
56
21.1. IC1 (BBIC)
56
22 ENGINEERING MODE
59
22.1. Base Unit
59
22.2. Handset
62
23 EEPROM LAYOUT (BASE UNIT)
64
23.1. Scope
64
23.2. Introduction
64
23.3. EEPROM Layout
64
24 EEPROM LAYOUT (HANDSET)
69
24.1. Scope
69
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page
Page
2
KX-TCD805RUT / KX-TCA180RUT
24.2. Introduction
69
24.3. EEPROM contents
69
25 HOW TO REPLACE THE FLAT PACKAGE IC
72
25.1. PREPARATION
72
25.2. FLAT PACKAGE IC REMOVAL PROCEDURE
72
25.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
73
25.4. BRIDGE MODIFICATION PROCEDURE
73
26 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
74
27 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET) 75
28 CABINET AND ELECTRICAL PARTS LOCATION (CHARGER
UNIT)
76
29 ACCESSORIES AND PACKING MATERIALS
77
29.1. KX-TCD805RUT
77
29.2. KX-TCA180RUT
78
30 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
79
30.1. Base Unit
79
30.2. Handset
79
30.3. Charger Unit
80
31 REPLACEMENT PARTS LIST
81
31.1. Base Unit
81
31.2. Handset
83
31.3. Charger Unit
85
31.4. Accessories and Packing Materials
85
31.5. Fixtures and Tools
85
32 FOR SCHEMATIC DIAGRAM
87
32.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
87
32.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
87
32.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
87
33 SCHEMATIC DIAGRAM (BASE UNIT)
88
34 SCHEMATIC DIAGRAM (HANDSET)
90
35 SCHEMATIC DIAGRAM (HANDSET_OPERATION)
92
36 SCHEMATIC DIAGRAM (CHARGER UNIT)
93
37 CIRCUIT BOARD (BASE UNIT)
95
37.1. Component View
95
37.2. Flow Solder Side View
96
38 CIRCUIT BOARD (HANDSET)
97
38.1. Component View
97
38.2. Flow Solder Side View
98
39 CIRCUIT BOARD (HANDSET_OPERATION)
99
39.1. Component View
99
39.2. Folw Solder Side View
100
40 CIRCUIT BOARD (CHARGER UNIT)
101
40.1. Component View
101
40.2. Flow Solder Side View
101
3
KX-TCD805RUT / KX-TCA180RUT
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
•
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
•
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD805RUT / KX-TCA180RUT