Panasonic KX-TCD586RUS / KX-TCA158RUS Service Manual ▷ View online
KX-TCD586RUS
KX-TCA158RUS
KX-TCA158RUS
Digital Cordless Answering System
Silver Version
(for Russia)
Telephone Equipment
ORDER NO. KM40407489C3
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2
FOR SERVICE TECHNICIANS
7
3
CAUTION
7
4
BATTERY
8
4.1.
Battery Installation
8
4.2.
Battery Charge
8
4.3.
Battery Life
9
4.4.
Battery Replacement
9
5
LOCATION OF CONTROLS
10
5.1.
Base Unit
10
5.2.
Handset
10
5.3.
Charger
11
6
SETTINGS
12
6.1.
Connections
12
6.2.
Ringer Volume
13
6.3.
Guide to Settings
14
6.4.
PIN Code
16
6.5.
Reset
17
6.6.
Key Lock
18
6.7.
R Button to Use the Recall Feature
19
6.8.
Pause Button (for PBX/Long Distance Service Users) 19
6.9.
Call Restriction
19
6.10. Call BAR On/Off (Call Prohibition On/Off)
19
6.11. Selecting the Display Language
20
6.12. Selecting the Recall Mode
20
6.13. Selecting Category Private Colours
20
6.14. Vibration Feature
21
6.15. Auto Voice Dial ON/OFF
21
6.16. Setting Dialling Mode (tone/pulse)
21
6.17. ARS (Automatic route selection)
22
7
DISPLAY
23
7.1.
Display Icons
23
7.2.
Menu Icons
23
7.3.
AOH and Caller ID Display
24
7.4.
Before Requesting Help (Troubleshooting)
25
8
OPERATIONS
27
8.1.
Power ON/OFF
27
8.2.
Setting the Date and Time
27
8.3.
Redialling
27
8.4.
Phonebook
28
8.5.
Registering a Handset to a Base Unit
33
8.6.
Selecting a Base Unit
34
9
ANSWERING SYSTEM
35
9.1.
Answering System On/Off
35
9.2.
Greeting Message
35
9.3.
Listening to Messages
35
9.4.
Direct Commands
36
9.5.
Remote Operation
36
10 DISASSEMBLY INSTRUCTIONS
37
10.1. Base Unit
37
10.2. Handset
38
10.3. Charger Unit
39
11 TROUBLESHOOTING GUIDE
40
11.1. Check Power
41
11.2. Check Battery Charge
43
11.3. Check Link
45
11.4. Check Handset Transmission
48
11.5. Check Handset Reception
48
11.6. Check Caller ID
48
11.7. Bell Reception
49
11.8. Check TAM Operation
49
12 CHECK PROCEDURE (BASE UNIT)
50
12.1. Preparation
50
12.2. PC Setting
50
13 CHECK PROCEDURE (HANDSET)
51
13.1. Preparation
51
13.2. PC Setting
51
14 ADJUSTMENTS (BASE UNIT AND CHARGER UNIT)
52
14.1. Adjustment (Base Unit)
52
14.2. Adjustment Standard (Base Unit)
55
Note:
Because CONTENTS 4 to 9 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD586RUS / KX-TCA158RUS
14.3. Adjustment (Charger Unit)
57
14.4. Adjustment Standard (Charger Unit)
57
15 ADJUSTMENTS (HANDSET)
58
15.1. Adjustment (Handset)
58
15.2. Adjustment Standard (Handset)
61
16 RF SPECIFICATION
62
16.1. Base Unit
62
16.2. Handset
62
17 HOW TO CHECK THE HANDSET SPEAKER
62
18 HOW TO CHECK THE HANDSET RECEIVER
63
19 FREQUENCY TABLE (MHz)
64
20 BLOCK DIAGRAM (BASE UNIT)
65
21 CIRCUIT OPERATION (BASE UNIT)
66
21.1. Outline
66
21.2. Power Supply Circuit
67
21.3. Telephone Line Interface
68
21.4. Transmitter/Receiver
68
21.5. Pulse Dialing
68
22 BLOCK DIAGRAM (HANDSET)
69
23 CIRCUIT OPERATION (HANDSET)
70
23.1. Outline
70
23.2. Power Supply Circuit/Reset Circuit
70
23.3. Charge Circuit
70
23.4. Battery Low/Power Down Detector
70
23.5. Speakerphone and Headset Jack
71
24 BLOCK DIAGRAM (RF MODULE)
72
25 CIRCUIT OPERATION (CHARGER UNIT)
73
26 SIGNAL ROUTE
74
27 CPU DATA (BASE UNIT)
75
27.1. IC2 (BBIC)
75
28 CPU DATA (HANDSET)
77
28.1. IC201 (BBIC)
77
29 EEPROM LAYOUT (BASE UNIT)
79
29.1. Scope
79
29.2. Introduction
79
29.3. EEPROM Layout
79
30 EEPROM LAYOUT (HANDSET)
84
30.1. Scope
84
30.2. Introduction
84
30.3. EEPROM contents
84
31 HOW TO REPLACE FLAT PACKAGE IC
86
31.1. Preparation
86
31.2. Procedure
86
31.3. Modification Procedure of Bridge
86
32 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
87
33 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET) 88
34 CABINET AND ELECTRICAL PARTS LOCATION (CHARGER
UNIT)
89
35 ACCESSORIES AND PACKING MATERIALS
90
35.1. KX-TCD586RUS
90
35.2. KX-TCA158RUS
91
36 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
92
36.1. Base Unit
92
36.2. Handset
92
36.3. Charger Unit
92
37 REPLACEMENT PARTS LIST
93
37.1. Base Unit
93
37.2. Handset
95
37.3. Charger Unit
97
37.4. Accessories and Packing Materials
97
37.5. Fixtures and Tools
98
38 FOR SCHEMATIC DIAGRAM
99
38.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
99
38.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
99
38.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
99
39 SCHEMATIC DIAGRAM (BASE UNIT)
100
40 SCHEMATIC DIAGRAM (HANDSET)
102
41 SCHEMATIC DIAGRAM (RF MODULE)
104
42 SCHEMATIC DIAGRAM (CHARGER UNIT)
105
42.1. Memo
106
43 CIRCUIT BOARD (BASE UNIT)
107
43.1. Main
107
43.2. Page Switch
109
43.3. Memo
110
44 CIRCUIT BOARD (HANDSET)
111
44.1. Component View
111
44.2. Flow Solder Side View
112
45 CIRCUIT BOARD (CHARGER UNIT)
113
45.1. Component View
113
45.2. Flow Solder Side View
113
3
KX-TCD586RUS / KX-TCA158RUS
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
·
PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
·
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and
Copper(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
Copper(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
4
KX-TCD586RUS / KX-TCA158RUS
