Panasonic KX-TCD576RUT / KX-TCD576RUV / KX-TCA151RUT / KX-TCA151RUV Service Manual ▷ View online
KX-TCD576RUT
KX-TCD576RUV
KX-TCA151RUT
KX-TCA151RUV
KX-TCD576RUV
KX-TCA151RUT
KX-TCA151RUV
Digital Cordless Answering System
Titanium Black Version
Violet Version
(for Russia)
Telephone Equipment
7ORDER NO. KM40409527C3
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1. Suggested PbF Solder
4
1.2. How to recognize that Pb Free solder is used
5
2 FOR SERVICE TECHNICIANS
7
3 CAUTION
7
4 BATTERY
8
4.1. Battery Installation
8
4.2. Battery Charge
8
4.3. Battery Life
9
4.4. Battery Replacement
9
5 LOCATION OF CONTROLS
10
5.1. Base Unit
10
5.2. Handset
10
5.3. Charger
11
6 SETTINGS
12
6.1. Connections
12
6.2. Ringer Volume
13
6.3. Guide to Settings
14
6.4. PIN Code
16
6.5. Reset
17
6.6. Key Lock
18
6.7. R Button to Use the Recall Feature
19
6.8. Pause Button (for PBX/Long Distance Service Users)
19
6.9. Call Restriction
19
6.10. Call BAR On/Off (Call Prohibition On/Off)
20
6.11. Selecting the Display Language
20
6.12. Selecting the Recall Mode
20
6.13. Selecting Category Private Colours
21
6.14. Setting Dialling Mode (Tone/Pulse)
21
6.15. ARS (Automatic Route Selection)
22
7 DIS PLAY
23
7.1. Display Icons
23
7.2. Menu Icons
23
7.3. AOH and Caller ID Display
24
7.4. Before Requesting Help (Troubleshooting)
25
8 OPERATIONS
27
8.1. Power ON/OFF
27
8.2. Setting the Date and Time
27
8.3. Redialling
27
8.4. Phonebook
28
8.5. Registering a Handset to a Base Unit
32
8.6. Selecting a Base Unit
33
9 ANSWERING SYSTEM
34
9.1. Answering System On/Off
34
9.2. Greeting Message
34
9.3. Listening to Messages
34
9.4. Direct Commands
35
9.5. Remote Operation
35
10 DISASSEMBLY INSTRUCTIONS
36
10.1. Base Unit
36
10.2. Handset
37
10.3. Charger Unit
38
11 TROUBLESHOOTING GUIDE
39
11.1. Check Power
40
11.2. Check Battery Charge
41
11.3. Check Link
42
11.4. Check Handset Transmission
45
11.5. Check Handset Reception
45
11.6. Check Caller ID
45
11.7. Bell Reception
46
11.8. Check TAM Operation
46
12 CHECK PROCEDURE (BASE UNIT)
47
12.1. Preparation
47
12.2. PC Setting
47
13 CHECK PROCEDURE (HANDSET)
48
13.1. Preparation
48
13.2. PC Setting
48
14 ADJUSTMENTS (BASE UNIT AND CHARGER UNIT)
49
14.1. Adjustment (Base Unit)
49
14.2. Adjustment Standard (Base Unit)
52
14.3. Adjustment (Charger Unit)
54
14.4. Adjustment Standard (Charger Unit)
54
Note:
Because CONTENTS 4 to 9 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD576RUT / KX-TCD576R UV / KX-TCA151RUT / KX-TCA151RUV
15 ADJUSTMENTS (HANDSET)
55
15.1. Adjustment (Handset)
55
15.2. Adjustment Standard (Handset)
59
16 RF SPECIFICATION
60
16.1. Base Unit
60
16.2. Handset
60
17 HOW TO CHECK THE HANDSET SPEAKER
60
18 HOW TO CHECK THE HANDSET RECEIVER
61
19 FREQUENCY TABLE (MHz)
62
20 BLOCK DIAGRAM (BASE UNIT)
63
21 CIRCUIT OPERATION (BASE UNIT)
64
21.1. Outline
64
21.2. Power Supply Circuit
65
21.3. Telephone Line Interface
66
21.4. Transmitter/Receiver
66
21.5. Pulse Dialing
66
22 BLOCK DIAGRAM (HANDSET)
67
23 CIRCUIT OPERATION (HANDSET)
68
23.1. Outline
68
23.2. Power Supply Circuit/Reset Circuit
68
23.3. Charge Circuit
68
23.4. Battery Low/Power Down Detector
68
23.5. Speakerphone and Headset Jack
68
24 CIRCUIT OPERATION (CHARGER UNIT)
69
24.1. Power Supply Circuit
69
25 SIGNAL ROUTE
70
26 CPU DATA (BASE UNIT)
71
26.1. IC2 (BBIC)
71
27 CPU DATA (HANDSET)
73
27.1. IC1 (BBIC)
73
28 EEPROM LAYOUT (BASE UNIT)
75
28.1. Scope
75
28.2. Introduction
75
28.3. EEPROM Layout
75
29 EEPROM LAYOUT (HANDSET)
80
29.1. Scope
80
29.2. Introduction
80
29.3. EEPROM contents
80
30 HOW TO REPLACE FLAT PACKAGE IC
82
30.1. Preparation
82
30.2. Procedure
82
30.3. Modification Procedure of Bridge
82
31 CABINET AND ELECTRICAL PARTSLOCATION (BASE UNIT)
83
32 CABINET AND ELECTRICAL PARTSLOCATION (HANDSET) 84
33 CABINET AND ELECTRICAL PARTSLOCATION (CHARGER
UNIT)
85
34 ACCESSORIES AND PACKING MATERIALS
86
34.1. KX-TCD576RUT/RUV
86
34.2. KX-TCA151RUT/RUV
87
35 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
88
35.1. Base Unit
88
35.2. Handset
88
35.3. Charger Unit
88
36 REPLACEMENT PARTSLIST
89
36.1. Base Unit
89
36.2. Handset
91
36.3. Charger Unit
92
36.4. Accessories and Packing Materials
93
36.5. Fixtures and Tools
93
37 FOR SCHEMATIC DIAGRAM
95
37.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
95
37.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
95
37.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
95
38 SCHEMATIC DIAGRAM (BASE UNIT)
96
39 SCHEMATIC DIAGRAM (HANDSET)
98
40 SCHEMATIC DIAGRAM (CHARGER UNIT)
100
41 CIRCUIT BOARD (BASE UNIT)
101
41.1. Main
101
41.2. Page Switch
103
41.3. Memo
104
42 CIRCUIT BOARD (HANDSET)
105
42.1. Component View
105
42.2. Flow Solder Side View
106
43 CIRCUIT BOARD (CHARGER UNIT)
107
43.1. Component View
107
43.2. Flow Solder Side View
107
3
KX-TCD576RUT / KX-TCD576R UV / KX-TCA151RUT / KX-TCA151RUV
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type ofsolder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type ofsolder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
•
PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case ofusing high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case ofusing high temperature soldering iron, please
be careful not to heat too long.
•
•
•
•
PbF solder will tend to splash ifit is heated much higher than its melting point, approximately 1100°F (600°C).
•
•
•
•
Ifyou must use Pb solder on a PCB manufactured using PbF solder, remove as much ofthe original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
•
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1.
Suggested PbF Solder
There are several types ofPbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials. The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and
1.0 mm.
4
KX-TCD576RUT / KX-TCD576R UV / KX-TCA151RUT / KX-TCA151RUV
