Panasonic KX-TCD556UAT / KX-TCD556UAV / KX-TCA151UAT / KX-TCA151UAV Service Manual ▷ View online
KX-TCD556UAT
KX-TCD556UAV
KX-TCA151UAT
KX-TCA151UAV
KX-TCD556UAV
KX-TCA151UAT
KX-TCA151UAV
Digital Cordless Phone
Titanium Black Version
Violet Version
(for Ukraine)
Telephone Equipment
ORDER NO. KM40408525C3
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1. Suggested PbF Solder
4
1.2. How to recognize that Pb Free solder is used
5
2 FOR SERVICE TECHNICIANS
7
3 CAUTION
7
4 BATTERY
8
4.1. Battery Installation
8
4.2. Battery Charge
8
4.3. Battery Life
9
4.4. Battery Replacement
9
5 LOCATION OF CONTROLS
10
5.1. Base Unit
10
5.2. Handset
10
5.3. Charger
11
6 SETTINGS
12
6.1. Connections
12
6.2. Ringer Volume
13
6.3. Guide to Settings
14
6.4. PIN Code
16
6.5. Reset
17
6.6. Key Lock
19
6.7. R Button to Use the Recall Feature
19
6.8. Pause Button (for PBX/Long Distance Service Users)
19
6.9. Call Restriction
19
6.10. Call BAR On/Off (Call Prohibition On/Off)
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6.11. Selecting the Display Language
20
6.12. Selecting the Recall Mode
20
6.13. Selecting Category Private Colours
20
6.14. Setting Dialling Mode (Tone/Pulse)
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6.15. ARS (Automatic Route Selection)
22
7 DISPLAY
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7.1. Display Icons
23
7.2. Menu Icons
23
7.3. AOH and Caller ID Display
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7.4. Before Requesting Help (Troubleshooting)
25
8 OPERATIONS
27
8.1. Power ON/OFF
27
8.2. Setting the Date and Time
27
8.3. Redialling
27
8.4. Phonebook
28
8.5. Registering a Handset to a Base Unit
32
8.6. Selecting a Base Unit
32
9 DISASSEMBLY INSTRUCTIONS
33
9.1. Base Unit
33
9.2. Handset
34
9.3. Charger Unit
35
10 TROUBLESHOOTING GUIDE
36
10.1. Check Power
37
10.2. Check Battery Charge
38
10.3. Check Link
39
10.4. Check Handset Transmission
43
10.5. Check Handset Reception
43
10.6. Check Caller ID
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10.7. Bell Reception
44
11 CHECK PROCEDURE (BASE UNIT)
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11.1. Preparation
45
11.2. PC Setting
45
12 CHECK PROCEDURE (HANDSET)
46
12.1. Preparation
46
12.2. PC Setting
46
13 ADJUSTMENTS (BASE UNIT AND CHARGER UNIT)
47
13.1. Adjustment (Base Unit)
47
13.2. Adjustment Standard (Base Unit)
51
13.3. Adjustment (Charger Unit)
53
13.4. Adjustment Standard (Charger Unit)
53
14 ADJUSTMENTS (HANDSET)
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14.1. Adjustment (Handset)
54
14.2. Adjustment Standard (Handset)
58
15 RF SPECIFICATION
59
15.1. Base Unit
59
15.2. Handset
59
16 HOW TO CHECK THE HANDSET SPEAKER
59
Note:
Because CONTENTS 4 to 8 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD556UAT / KX-TCD556U AV / KX-TCA151UAT / KX-TCA151UAV
17 HOW TO CHECK THE HANDSET RECEIVER
60
18 FREQUENCY TABLE (MHz)
61
19 BLOCK DIAGRAM (BASE UNIT)
62
20 CIRCUIT OPERATION (BASE UNIT)
63
20.1. Outline
63
20.2. Power Supply Circuit
64
20.3. Telephone Line Interface
65
20.4. Transmitter/Receiver
65
20.5. Pulse Dialing
65
21 BLOCK DIAGRAM (HANDSET)
66
22 CIRCUIT OPERATION (HANDSET)
67
22.1. Outline
67
22.2. Power Supply Circuit/Reset Circuit
67
22.3. Charge Circuit
67
22.4. Battery Low/Power Down Detector
67
22.5. Speakerphone and Headset Jack
67
23 CIRCUIT OPERATION (CHARGER UNIT)
68
23.1. Power Supply Circuit
68
24 SIGNAL ROUTE
69
25 CPU DATA (BASE UNIT)
70
25.1. IC2 (BBIC)
70
26 CPU DATA (HANDSET)
72
26.1. IC1 (BBIC)
72
27 EEPROM LAYOUT (BASE UNIT)
74
27.1. Scope
74
27.2. Introduction
74
27.3. EEPROM Layout
74
28 EEPROM LAYOUT (HANDSET)
79
28.1. Scope
79
28.2. Introduction
79
28.3. EEPROM contents
79
29 HOW TO REPLACE FLAT PACKAGE IC
81
29.1. Preparation
81
29.2. Procedure
81
29.3. Modification Procedure of Bridge
81
30 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
82
31 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET)83
32 CABINET AND ELECTRICAL PARTS LOCATION (CHARGER
UNIT)
84
33 ACCESSORIES AND PACKING MATERIALS
85
33.1. KX-TCD556UAT/UAV
85
33.2. KX-TCA151UAT/UAV
86
34 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
87
34.1. Base Unit
87
34.2. Handset
87
34.3. Charger Unit
87
35 REPLACEMENT PARTS LIST
88
35.1. Base Unit
88
35.2. Handset
90
35.3. Charger Unit
91
35.4. Accessories and Packing Materials
92
35.5. Fixtures and Tools
92
36 FOR SCHEMATIC DIAGRAM
93
36.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
93
36.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
93
36.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
93
37 SCHEMATIC DIAGRAM (BASE UNIT)
94
38 SCHEMATIC DIAGRAM (HANDSET)
96
39 SCHEMATIC DIAGRAM (CHARGER UNIT)
98
40 CIRCUIT BOARD (BASE UNIT)
99
40.1. Main
99
40.2. Page Switch
101
41 CIRCUIT BOARD (HANDSET)
103
41.1. Component View
103
41.2. Flow Solder Side View
104
42 CIRCUIT BOARD (CHARGER UNIT)
105
42.1. Component View
105
42.2. Flow Solder Side View
105
3
KX-TCD556UAT / KX-TCD556U AV / KX-TCA151UAT / KX-TCA151UAV
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
• PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
•
•
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
•
•
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD556UAT / KX-TCD556U AV / KX-TCA151UAT / KX-TCA151UAV
