Panasonic KX-TCD530RUM / KX-TCD530RUT / KX-TCA151RUM / KX-TCA151RUT Service Manual ▷ View online
KX-TCD530RUM
KX-TCD530RUT
KX-TCA151RUM
KX-TCA151RUT
KX-TCD530RUT
KX-TCA151RUM
KX-TCA151RUT
Digital Cordless Phone
Metic Grey Version
Titanium Black Version
(for Russia)
Telephone Equipment
ORDER NO. KM40310259C3
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2
FOR SERVICE TECHNICIANS
8
3
CAUTION
8
4
BATTERY
9
4.1.
Battery Installation
9
4.2.
Battery Charge
9
4.3.
Battery Information
10
4.4.
Replacing the Batteries
10
5
LOCATION OF CONTROLS
11
5.1.
Base Unit
11
5.2.
Cordless Handset
12
5.3.
Charger Unit
12
5.4.
Icons above SOFT KEYS
13
6
SETTINGS
14
6.1.
Connection
14
6.2.
Symbols Used for Operations
15
6.3.
Setting the Ringer Volume
17
6.4.
Settings Menu Chart
18
6.5.
PIN Code
19
6.6.
Reset the Settings
20
6.7.
Key Lock
21
6.8.
Recall Feature
21
6.9.
Dialling Pause for PBX line/long distance service users
22
6.10. Call Restriction
22
6.11. Call BAR On/Off (Call Prohibition On/Off)
23
6.12. Selecting the Display Language
24
6.13. Automatic Route Selection
25
7
DISPLAY
26
7.1.
Display Icons
26
7.2.
Caller ID Service
27
7.3.
Before Requesting Help (Troubleshooting)
28
8
OPERATIONS
31
8.1.
Power ON/OFF
31
8.2.
Setting the Date and Time
31
8.3.
Redialling
32
8.4.
Phonebook
33
8.5.
Cordless Handset Registration to a Base Unit
41
8.6.
Base Unit Selection
43
9
DISASSEMBLY INSTRUCTIONS
44
9.1.
Base Unit
44
9.2.
Cordless Handset
45
9.3.
Charger Unit
46
10 TROUBLESHOOTING GUIDE
47
10.1. Check Power
48
10.2. Check Battery Charge
49
10.3. Check Link
50
10.4. Check Cordless Handset Transmission
54
10.5. Check Cordless Handset Reception
54
10.6. Check Curl Cord Handset Transmission
54
10.7. Check Curl Cord Handset Reception
54
10.8. Check Caller ID
54
10.9. Bell Reception
55
10.10. Check DTMF Dial
55
11 CHECK PROCEDURE (BASE UNIT)
56
11.1. Preparation
56
11.2. PC Setting
56
12 CHECK PROCEDURE (CORDLESS HANDSET)
57
12.1. Preparation
57
12.2. PC Setting
57
13 ADJUSTMENTS (BASE UNIT AND CHARGER UNIT)
58
13.1. Adjustment (Base Unit)
58
13.2. Adjustment Standard (Base Unit)
62
13.3. Adjustment (Charger Unit)
64
13.4. Adjustment Standard (Charger Unit)
64
14 ADJUSTMENTS (CORDLESS HANDSET)
65
14.1. Adjustment (Cordless Handset)
65
14.2. Adjustment Standard (Cordless Handset)
69
15 RF SPECIFICATION
70
15.1. Base Unit
70
15.2. Cordless Handset
70
16 HOW TO CHECK THE CORDLESS HANDSET AND BASE UNIT
SPEAKER
70
17 HOW TO CHECK THE CORDLESS HANDSET RECEIVER
71
18 FREQUENCY TABLE (MHz)
72
19 BLOCK DIAGRAM (BASE UNIT)
73
20 CIRCUIT OPERATION (BASE UNIT)
74
20.1. Outline
74
20.2. Power Supply Circuit
75
CONTENTS
Page
Page
2
KX-TCD530RUM / KX-TCD530R UT / KX-TCA151RUM / KX-TCA151RUT
20.3. Telephone Line Interface
76
20.4. Transmitter/Receiver
76
20.5. Pulse Dialing
76
21 BLOCK DIAGRAM (CORDLESS HANDSET)
77
22 CIRCUIT OPERATION (CORDLESS HANDSET)
78
22.1. Outline
78
22.2. Power Supply Circuit/Reset Circuit
78
22.3. Charge Circuit
78
22.4. Battery Low/Power Down Detector
78
22.5. Speakerphone and Headset Jack
78
23 CIRCUIT OPERATION (CHARGER UNIT)
79
23.1. Power Supply Circuit
79
24 SIGNAL ROUTE
80
25 CPU DATA (BASE UNIT)
81
25.1. IC2 (BBIC)
81
26 CPU DATA (CORDLESS HANDSET)
83
26.1. IC1 (BBIC)
83
27 EEPROM LAYOUT (BASE UNIT)
85
27.1. Scope
85
27.2. Introduction
85
27.3. EEPROM Layout
85
28 EEPROM LAYOUT (CORDLESS HANDSET)
90
28.1. Scope
90
28.2. Introduction
90
28.3. EEPROM contents
90
29 HOW TO REPLACE FLAT PACKAGE IC
92
29.1. Preparation
92
29.2. Procedure
92
29.3. Modification Procedure of Bridge
92
30 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
93
31 CABINET AND ELECTRICAL PARTS LOCATION (CORDLESS
HANDSET)
94
32 CABINET AND ELECTRICAL PARTS LOCATION (CHARGER
UNIT)
95
33 ACCESSORIES AND PACKING MATERIALS
96
33.1. KX-TCD530RUM/RUT
96
33.2. KX-TCA151RUM/RUT
97
34 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
98
34.1. Base Unit
98
34.2. Cordless Handset
98
34.3. Charger Unit
98
35 REPLACEMENT PARTS LIST
99
35.1. Base Unit
99
35.2. Cordless Handset
102
35.3. Charger Unit
103
35.4. Accessories and Packing Materials
104
35.5. Fixtures and Tools
104
36 FOR SCHEMATIC DIAGRAM
105
36.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
105
36.2. Cordless Handset (SCHEMATIC DIAGRAM (CORDLESS
HANDSET))
105
37 SCHEMATIC DIAGRAM (BASE UNIT)
106
37.1. Main
106
37.2. Operation
108
37.3. Memo
109
38 SCHEMATIC DIAGRAM (CORDLESS HANDSET)
110
39 SCHEMATIC DIAGRAM (CHARGER UNIT)
112
40 CIRCUIT BOARD (BASE UNIT)
113
40.1. Main
113
40.2. Operation
115
41 CIRCUIT BOARD (CORDLESS HANDSET)
117
41.1. Component View
117
41.2. Flow Solder Side View
118
42 CIRCUIT BOARD (CHARGER UNIT)
119
42.1. Component View
119
42.2. Flow Solder Side View
119
3
KX-TCD530RUM / KX-TCD530R UT / KX-TCA151RUM / KX-TCA151RUT
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
·
PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
·
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD530RUM / KX-TCD530R UT / KX-TCA151RUM / KX-TCA151RUT
