Panasonic KX-TCD500RUN / KX-TCA150RUN Service Manual ▷ View online
KX-TCD500RUN
KX-TCA150RUN
KX-TCA150RUN
Digital Cordless Phone
Gold Version
(for Russia)
Telephone Equipment
ORDER NO. KM40607158CE
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2
FOR SERVICE TECHNICIANS
6
3
CAUTION
6
4
BATTERY
7
4.1.
Battery Installation
7
4.2.
Battery Charge
7
4.3.
Battery Information
8
4.4.
Replacing the Batteries
8
5
LOCATION OF CONTROLS
9
5.1.
Base Unit
9
5.2.
Handset
9
6
SETTINGS
10
6.1.
Connection
10
6.2.
Settings Menu Chart
11
7
DISPLAY
13
7.1.
Display Icons
13
7.2.
Main Menu Display
13
7.3.
Before Requesting Help (Troubleshooting)
14
8
OPERATIONS
15
8.1.
Handset Registration to a Base Unit
15
8.2.
Base Unit Selection
16
9
DISASSEMBLY INSTRUCTIONS
17
9.1.
Base Unit
17
9.2.
Handset
18
10 ASSEMBLY INSTRUCTIONS
19
10.1. Warning When Constructing the Base Unit
19
11 TROUBLESHOOTING GUIDE
20
11.1. Check Power
21
11.2. Check Battery Charge
22
11.3. Check Link
23
11.4. Check Handset Transmission
27
11.5. Check Handset Reception
27
11.6. Check Caller ID
27
11.7. Bell Reception
28
12 CHECK PROCEDURE (BASE UNIT)
29
12.1. Preparation
29
12.2. PC Setting
29
13 CHECK PROCEDURE (HANDSET)
30
13.1. Preparation
30
13.2. PC Setting
30
14 ADJUSTMENTS (BASE UNIT)
31
14.1. Adjustment (Base Unit)
31
14.2. Adjustment Standard (Base Unit)
34
15 ADJUSTMENTS (HANDSET)
36
15.1. Adjustment (Handset)
36
15.2. Adjustment Standard (Handset)
39
16 RF SPECIFICATION
40
16.1. Base Unit
40
16.2. Handset
40
17 HOW TO CHECK THE HANDSET SPEAKER
40
18 HOW TO CHECK THE HANDSET RECEIVER
41
19 FREQUENCY TABLE (MHz)
42
20 BLOCK DIAGRAM (BASE UNIT)
43
21 CIRCUIT OPERATION (BASE UNIT)
44
21.1. Outline
44
21.2. Power Supply Circuit
45
21.3. Telephone Line Interface
46
21.4. Transmitter/Receiver
46
21.5. Pulse Dialing
46
22 BLOCK DIAGRAM (HANDSET)
47
23 CIRCUIT OPERATION (HANDSET)
48
23.1. Outline
48
23.2. Power Supply Circuit/Reset Circuit
48
23.3. Charge Circuit
48
23.4. Battery Low/Power Down Detector
48
23.5. Speakerphone and Headset Jack
48
24 SIGNAL ROUTE
49
25 CPU DATA (BASE UNIT)
50
25.1. IC2 (BBIC)
50
26 CPU DATA (HANDSET)
52
26.1. IC1 (BBIC)
52
27 EEPROM LAYOUT (BASE UNIT)
54
Note:
Because section 4 to 8 of this manual is an extract from the operating instructions for this model, it is subject to change without
notice. You can download and refer to the original operating instructions on TSN Server for further information.
notice. You can download and refer to the original operating instructions on TSN Server for further information.
CONTENTS
Page
Page
2
KX-TCD500RUN / KX-TCA150RUN
27.1. Scope
54
27.2. Introduction
54
27.3. EEPROM Layout
54
28 EEPROM LAYOUT (HANDSET)
59
28.1. Scope
59
28.2. Introduction
59
28.3. EEPROM contents
59
29 HOW TO REPLACE THE FLAT PACKAGE IC
61
29.1. Preparation
61
29.2. How to Remove the IC
61
29.3. How to Install the IC
62
29.4. How to Remove a Solder Bridge
62
30 CABINET AND ELECTRICAL PARTS (BASE UNIT)
63
31 CABINET AND ELECTRICAL PARTS (HANDSET)
64
32 ACCESSORIES AND PACKING MATERIALS
65
33 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
66
33.1. Base Unit
66
33.2. Handset
66
34 REPLACEMENT PARTS LIST
67
34.1. Base Unit
67
34.2. Handset
68
34.3. Accessories and Packing Materials
70
34.4. Fixtures and Tools
70
35 FOR SCHEMATIC DIAGRAM
71
35.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
71
35.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
71
36 SCHEMATIC DIAGRAM (BASE UNIT)
72
37 SCHEMATIC DIAGRAM (HANDSET)
74
37.1. Memo
76
38 CIRCUIT BOARD (BASE UNIT)
77
38.1. Component View
77
38.2. Flow Solder Side View
78
39 CIRCUIT BOARD (HANDSET)
79
39.1. Component View
79
39.2. Flow Solder Side View
80
3
KX-TCD500RUN / KX-TCA150RUN
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
•
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
•
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD500RUN / KX-TCA150RUN
