Panasonic KX-TCD500RUM / KX-TCA150RUM / KX-TCD500RUT / KX-TCA150RUT / KX-TCD500RUV / KX-TCA150RUV Service Manual ▷ View online
KX-TCD500RUM
KX-TCA150RUM
KX-TCD500RUT
KX-TCA150RUT
KX-TCD500RUV
KX-TCA150RUV
Digital Cordless Phone
Metic Grey Version
Titanium Black Version
Violet Version
(for Russia)
Titanium Black Version
Violet Version
(for Russia)
Telephone Equipment
ORDER NO. KM40308181C3
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1. Suggested PbF Solder
4
1.2. Howto recognize that Pb Free solder is used
5
2 FOR SERVICE TECHNICIANS
7
3 CAUTION
7
4 BATTERY
8
4.1. Battery Installation
8
4.2. Battery Charge
8
4.3. Battery Information
9
4.4. Replacing the Batteries
9
5 LOCATION OF CONTROLS
10
5.1. Base Unit
10
5.2. Handset
10
6 SETTINGS
12
6.1. Connection
12
6.2. Symbols Used in This Service Manual
13
6.3. Settings Menu Chart
14
6.4. PIN Code
16
6.5. Reset
17
6.6. Key Lock
18
6.7. Recall Feature
18
6.8. Dialling Pause for PBX line/long distance service users 18
6.9. Call Restriction
6.9. Call Restriction
19
6.10. Call BAR On/Off (Call Prohibition On/Off)
19
6.11. Selecting the Display Language
20
6.12. Automatic Route Selection
21
7 DISPLAY
22
7.1. Display Icons
22
7.2. Main Menu Display
22
7.3. Before Requesting Help (Troubleshooting)
23
8 OPERATIONS
25
8.1. Power ON/OFF
25
8.2. Making a Call
25
8.3. Answering a Call
25
8.4. Setting the Date and Time
26
8.5. Phonebook
27
8.6. Handset Registration to a Base Unit
36
8.7. Base Unit Selection
37
9 DISASSEMBLY INSTRUCTIONS
38
9.1. Base Unit
38
9.2. Handset
39
10 ASSEMBLY INSTRUCTIONS
40
10.1. Warning When Constructing the Base Unit
40
11 TROUBLESHOOTING GUIDE
41
11.1. Check Power
42
11.2. Check Battery Charge
43
11.3. Check Link
44
11.4. Check Handset Transmission
48
11.5. Check Handset Reception
48
11.6. Check Caller ID
48
11.7. Bell Reception
49
12 CHECK PROCEDURE (BASE UNIT)
50
12.1. Preparation
50
12.2. PC Setting
50
13 CHECK PROCEDURE (HANDSET)
51
13.1. Preparation
51
13.2. PC Setting
51
14 ADJUSTMENTS (BASE UNIT)
52
14.1. Adjustment
52
14.2. Adjustment Standard (Base Unit)
55
15 ADJUSTMENTS (HANDSET)
57
15.1. Adjustment (Handset)
57
15.2. Adjustment Standard (Handset)
60
16 RF SPECIFICATION
61
16.1. Base Unit
61
16.2. Handset
61
17 HOW TO CHECK THE HANDSET SPEAKER
61
18 HOW TO CHECK THE HANDSET RECEIVER
62
19 FREQUENCY TABLE (MHz)
63
20 BLOCK DIAGRAM (BASE UNIT)
64
21 CIRCUIT OPERATION (BASE UNIT)
65
21.1. Outline
65
21.2. Power Supply Circuit
66
21.3. Telephone Line Interface
67
21.4. Transmitter/Receiver
67
21.5. Pulse Dialing
67
22 BLOCK DIAGRAM (HANDSET)
68
23 CIRCUIT OPERATION (HANDSET)
69
23.1. Outline
69
23.2. Power Supply Circuit/Reset Circuit
69
23.3. Charge Circuit
69
23.4. Battery Low/Power Down Detector
69
CONTENTS
Page
Page
2
KX-TCD500RUM / KX-TCA150RUM / KX-TCD500RUT / KX-TCA150RUT / KX-TCD500RUV / KX-TCA150RUV
23.5. Speakerphone and Headset Jack
69
24 SIGNAL ROUTE
70
25 CPU DATA (BASE UNIT)
71
25.1. IC2 (BBIC)
71
26 CPU DATA (HANDSET)
73
26.1. IC1 (BBIC)
73
27 EEPROM LAYOUT (BASE UNIT)
75
27.1. Scope
75
27.2. Introduction
75
27.3. EEPROM Layout
75
28 EEPROM LAYOUT (HANDSET)
80
28.1. Scope
80
28.2. Introduction
80
28.3. EEPROM contents
80
29 HOW TO REPLACE FLAT PACKAGE IC
82
29.1. Preparation
82
29.2. Procedure
82
29.3. Modification Procedure of Bridge
82
30 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
83
31 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET) 84
32 ACCESSORIES AND PACKING MATERIALS
32 ACCESSORIES AND PACKING MATERIALS
85
33 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
86
33.1. Base Unit
86
33.2. Handset
86
34 REPLACEMENT PARTS LIST
87
34.1. Base Unit
87
34.2. Handset
89
34.3. Charger Unit
90
34.4. Accessories and Packing Materials
91
34.5. Fixtures and Tools
91
35 FOR SCHEMATIC DIAGRAM
92
35.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
92
35.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
92
35.3. Memo
93
36 SCHEMATIC DIAGRAM (BASE UNIT)
94
37 SCHEMATIC DIAGRAM (HANDSET)
96
37.1. Memo
98
38 CIRCUIT BOARD (BASE UNIT)
99
38.1. Component View
99
38.2. FlowSolder Side View
100
39 CIRCUIT BOARD (HANDSET)
101
39.1. Component View
101
39.2. FlowSolder Side View
102
3
KX-TCD500RUM / KX-TCA150RUM / KX-TCD500RUT / KX-TCA150RUT / KX-TCD500RUV / KX-TCA150RUV
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
·
PbF solder has a melting point that is 50°F ~70°F (30°C ~ 40°C)higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
·
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turers specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF)solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turers specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF)solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD500RUM / KX-TCA150RUM / KX-TCD500RUT / KX-TCA150RUT / KX-TCD500RUV / KX-TCA150RUV
