Panasonic KX-TCD460UA / KX-A146UA-1 / KX-A146UA Service Manual ▷ View online
KX-TCD460UA
KX-A146UA-1
KX-A146UA
KX-A146UA-1
KX-A146UA
Digital Cordless Phone
UAF-Metic Blue Version
UAS-New Silver Version
UAT-Titanium Black Version
(for Ukraine)
Telephone Equipment
ORDER NO. KM40406458C3
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2
FOR SERVICE TECHNICIANS
7
3
CAUTION
7
4
SPECIFICATIONS
7
5
BATTERY
8
5.1.
Battery Installation
8
5.2.
Battery Charge
8
5.3.
Battery Life
9
5.4.
Battery Replacement
9
6
LOCATION OF CONTROLS
10
6.1.
Base Unit
10
6.2.
Handset
10
7
SETTINGS
11
7.1.
Connections
11
7.2.
Ringer Volume
12
7.3.
PIN Code
13
7.4.
Reset
14
7.5.
Key Lock
15
7.6.
R button (to use the recall feature)
15
7.7.
Pause button (for PBX line/long distance service users)
15
7.8.
Setting Call Restriction
16
7.9.
Cancelling a Restricted Number
16
7.10. Setting Call BAR
16
7.11. Selecting the Display Language
17
7.12. Setting Dialling Mode (tone/pulse)
17
7.13. Setting Flash Time
17
7.14. Automatic Route Selection
17
8
DISPLAY
20
8.1.
Handset Display
20
8.2.
Caller ID Display
20
8.3.
Before Requesting Help (Troubleshooting)
22
9
OPERATIONS
24
9.1.
Turning the Power On/Off
24
9.2.
Setting the Time and Date
24
9.3.
Redialling
24
9.4.
Phonebook
25
9.5.
Registering a Handset to a Base Unit
27
9.6.
Selecting a Base Unit
28
10 DISASSEMBLY INSTRUCTIONS
29
10.1. Base Unit
29
10.2. Handset
30
10.3. Charger Unit
31
11 ASSEMBLY INSTRUCTIONS
32
11.1. Warning When Constructing the Base Unit
32
11.2. Processing of Ringer/Charge Terminal Lead
33
12 TROUBLESHOOTING GUIDE
34
12.1. Check Power
35
12.2. Check Battery Charge
36
12.3. Check Link
37
12.4. Check Handset Transmission
39
12.5. Check Handset Reception
39
12.6. Check Caller ID
39
12.7. Bell Reception
40
13 CHECK PROCEDURE (BASE UNIT)
41
13.1. Preparation
41
13.2. PC Setting
41
14 CHECK PROCEDURE (HANDSET)
42
14.1. Preparation
42
14.2. PC Setting
42
15 ADJUSTMENTS (BASE UNIT AND CHARGER UNIT)
43
15.1. Adjustment (Base Unit)
43
15.2. Adjustment Standard (Base Unit)
47
15.3. Adjustment (Charger Unit)
49
15.4. Adjustment Standard (Charger Unit)
49
16 ADJUSTMENTS (HANDSET)
50
16.1. Adjustment (Handset)
50
16.2. Adjustment Standard (Handset)
53
17 RF SPECIFICATION
54
17.1. Base Unit
54
17.2. Handset
54
Note:
Because CONTENTS 5 to 9 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD460UA / KX-A146UA-1 / KX-A146UA
18 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 54
19 FREQUENCY TABLE (MHz)
55
20 BLOCK DIAGRAM (BASE UNIT)
56
21 CIRCUIT OPERATION (BASE UNIT)
57
21.1. Outline
57
21.2. Power Supply Circuit
58
21.3. Telephone Line Interface
59
21.4. Transmitter/Receiver
59
21.5. Pulse Dialing
59
22 BLOCK DIAGRAM (HANDSET)
60
23 CIRCUIT OPERATION (HANDSET)
61
23.1. Outline
61
23.2. Power Supply Circuit/Reset Circuit
61
23.3. Charge Circuit
61
23.4. Battery Low/Power Down Detector
61
23.5. Speakerphone
61
24 CIRCUIT OPERATION (CHARGER UNIT)
62
24.1. Power Supply Circuit
62
25 SIGNAL ROUTE
63
26 CPU DATA (BASE UNIT)
64
26.1. IC2 (BBIC)
64
27 CPU DATA (HANDSET)
66
27.1. IC1 (BBIC)
66
28 EEPROM LAYOUT (BASE UNIT)
68
28.1. Scope
68
28.2. Introduction
68
28.3. EEPROM Layout
68
29 EEPROM LAYOUT (HANDSET)
71
29.1. Scope
71
29.2. Introduction
71
29.3. EEPROM contents
71
30 HOW TO REPLACE FLAT PACKAGE IC
74
30.1. Preparation
74
30.2. Procedure
74
30.3. Modification Procedure of Bridge
74
31 CABINET AND ELECTRICAL PARTS LOCATION (BASE UNIT)
75
32 CABINET AND ELECTRICAL PARTS LOCATION (HANDSET) 76
33 CABINET AND ELECTRICAL PARTS LOCATION (CHARGER
UNIT)
77
34 ACCESSORIES AND PACKING MATERIALS
78
34.1. KX-TCD460UAF/UAS/UAT
78
34.2. KX-A146UAF/UAS/UAT
79
35 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
80
35.1. Base Unit
80
35.2. Handset
80
35.3. Charger Unit
80
36 REPLACEMENT PARTS LIST
81
36.1. Base Unit
81
36.2. Handset
82
36.3. Charger Unit
84
36.4. Accessories and Packing Materials
84
36.5. Fixtures and Tools
84
37 FOR SCHEMATIC DIAGRAM
85
37.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
85
37.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
85
37.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
85
38 SCHEMATIC DIAGRAM (BASE UNIT)
86
39 SCHEMATIC DIAGRAM (HANDSET)
88
40 SCHEMATIC DIAGRAM (CHARGER UNIT)
90
41 CIRCUIT BOARD (BASE UNIT)
91
41.1. Component View
91
41.2. Flow Solder Side View
92
42 CIRCUIT BOARD (HANDSET)
93
42.1. Component View
93
42.2. Flow Solder Side View
94
43 CIRCUIT BOARD (CHARGER UNIT)
95
43.1. Component View
95
43.2. Flow Solder Side View
95
3
KX-TCD460UA / KX-A146UA-1 / KX-A146UA
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
·
PbF solder has a melting point that is 50 °F ~70°F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C). In case of using high temperature soldering iron, please
be careful not to heat too long.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
·
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
4
KX-TCD460UA / KX-A146UA-1 / KX-A146UA