Panasonic KX-TCD346UAS / KX-TCD346UAT / KX-TCA132UAS / KX-TCA132UAT / KX-TCA130UAS / KX-TCA130UAT Service Manual ▷ View online
2005 Panasonic Communications
KX-TCD346UAS
KX-TCD346UAT
KX-TCA132UAS
KX-TCA132UAT
KX-TCA130UAS
KX-TCA130UAT
KX-TCD346UAT
KX-TCA132UAS
KX-TCA132UAT
KX-TCA130UAS
KX-TCA130UAT
Digital Cordless Answering System
Silver Version
Titanium Black Version
(for Ukraine)
Telephone Equipment
ORDER NO. KM40507827CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1. Suggested PbF Solder
4
1.2. Howto recognize that Pb Free solder is used
5
2 FOR SERVICE TECHNICIANS
6
3 CAUTION
6
4 OPERATING INSTRUCTIONS
7
4.1. Battery
7
4.2. Location of Controls
9
4.3. Connections
11
4.4. Guide to Settings
12
4.5. For Service Hint
13
5 DISASSEMBLY INSTRUCTIONS
14
5.1. Base Unit
14
5.2. Handset
15
5.3. Charger Unit
16
6 ASSEMBLY INSTRUCTIONS
17
6.1. Fix the LCD to the Main P.C.Board (Handset)
17
7 TROUBLESHOOTING FLOWCHART
18
7.1. Check Power
19
7.2. Check Battery Charge
20
7.3. Check Link
21
7.4. Check Handset Transmission
25
7.5. Check Handset Reception
25
7.6. Check Caller ID
25
7.7. Check Base Speakerphone Transmission
25
7.8. Check Base Speakerphone Reception
25
7.9. Bell Reception
26
7.10. Check TAM Operation
26
8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
27
8.1. Check Point (Base Unit)
27
8.2. The Setting Method of JIG (Base Unit)
32
8.3. Adjustment Standard (Base Unit)
33
8.4. Check Point (Charger Unit)
34
8.5. Adjustment Standard (Charger Unit)
34
9 TROUBLESHOOTING BY SYMPTOM (HANDSET)
35
9.1. Check Point (Handset)
35
9.2. Troubleshooting for Speakerphone (Handset)
38
9.3. The Setting Method of JIG (Handset)
39
9.4. Adjustment Standard (Handset)
40
10 THINGS TO DO AFTER REPLACING IC
41
10.1. Base Unit
41
10.2. Handset
41
11 RFSPECIFICATION
42
11.1. Base Unit
42
11.2. Handset
42
12 HOW TO CHECK THE SPEAKER OR RECEIVER
43
13 FREQUENCY TABLE (MHz)
43
14 BLOCK DIAGRAM (BASE UNIT)
44
15 CIRCUIT OPERATION (BASE UNIT)
45
15.1. Outline
45
15.2. Power Supply Circuit
46
15.3. Telephone Line Interface
47
15.4. Transmitter/Receiver
47
15.5. Pulse Dialling
47
16 BLOCK DIAGRAM (HANDSET)
48
17 CIRCUIT OPERATION (HANDSET)
49
17.1. Outline
49
17.2. Power Supply Circuit/Reset Circuit
49
17.3. Charge Circuit
49
17.4. Battery Low/Power Down Detector
49
17.5. Speakerphone
49
18 CIRCUIT OPERATION (CHARGER UNIT)
50
18.1. Power Supply Circuit
50
19 SIGNAL ROUTE
51
20 CPU DATA (BASE UNIT)
53
20.1. IC4 (BBIC)
53
21 CPU DATA (HANDSET)
56
21.1. IC1 (BBIC)
56
22 ENGINEERING MODE
58
22.1. Base Unit
58
22.2. Handset
61
23 EEPROM LAYOUT (BASE UNIT)
63
23.1. Scope
63
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page
Page
2
KX-TCD346UAS / KX-TCD346UAT / KX-TCA132UAS / KX-TCA132UAT / KX-TCA130UAS / KX-TCA130UAT
23.2. Introduction
63
23.3. EEPROM Layout
63
24 EEPROM LAYOUT (HANDSET)
68
24.1. Scope
68
24.2. Introduction
68
24.3. EEPROM contents
68
25 HOW TO REPLACE THE FLAT PACKAGE IC
71
25.1. PREPARATION
71
25.2. FLAT PACKAGE IC REMOVAL PROCEDURE
71
25.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
72
25.4. BRIDGE MODIFICATION PROCEDURE
72
26 CABINET AND ELECTRICAL PARTS (BASE UNIT)
73
27 CABINET AND ELECTRICAL PARTS (HANDSET)
74
28 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
75
29 ACCESSORIES AND PACKING MATERIALS
76
29.1. KX-TCD346UAS/UAT
76
29.2. KX-TCA130UAS/UAT
77
30 TERMINAL GUIDE OFTHE ICs, TRANSISTORS AND DIODES
78
30.1. Base Unit
78
30.2. Handset
78
30.3. Charger Unit
79
31 REPLACEMENT PARTS LIST
80
31.1. Base Unit
80
31.2. Handset
83
31.3. Charger Unit
84
31.4. Accessories and Packing Materials
85
31.5. Fixtures and Tools
85
32 FOR SCHEMATIC DIAGRAM
87
32.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT_MAIN))
87
32.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
87
32.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
87
33 SCHEMATIC DIAGRAM (BASE UNIT_MAIN)
88
34 SCHEMATIC DIAGRAM (BASE UNIT_OPERATION)
90
35 SCHEMATIC DIAGRAM (HANDSET)
92
36 SCHEMATIC DIAGRAM (CHARGER UNIT)
94
37 CIRCUIT BOARD (BASE UNIT_MAIN)
95
37.1. Component View
95
37.2. FlowSolder Side View
96
38 CIRCUIT BOARD (BASE UNIT_OPERATION)
97
38.1. Component View
97
38.2. FlowSolder Side View
98
39 CIRCUIT BOARD (HANDSET)
99
39.1. Component View
99
39.2. FlowSolder Side View
100
40 CIRCUIT BOARD (CHARGER UNIT)
101
40.1. Component View
101
40.2. FlowSolder Side View
101
3
KX-TCD346UAS / KX-TCD346UAT / KX-TCA132UAS / KX-TCA132UAT / KX-TCA130UAS / KX-TCA130UAT
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
· PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
· PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
· If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
· When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
1.1.
Suggested PbFSolder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD346UAS / KX-TCD346UAT / KX-TCA132UAS / KX-TCA132UAT / KX-TCA130UAS / KX-TCA130UAT
