Panasonic KX-TCD286RUT / KX-TCA128RUT Service Manual ▷ View online
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free solder is used
5
2 FOR SERVICE TECHNICIANS
5
3 CAUTION
5
4 OPERATING INSTRUCTIONS
6
4.1.
Battery
6
4.2.
Location of Controls
8
4.3.
Connections
10
4.4.
Guide to Settings
11
4.5.
For Service Hint
12
5 DISASSEMBLY INSTRUCTIONS
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5.1.
Base Unit
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5.2.
Handset
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5.3.
Charger Unit
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6 HOW TO REPLACE THE HANDSET LCD
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7 TROUBLESHOOTING FLOWCHART
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7.1.
Check Power
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7.2.
Check Battery Charge
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7.3.
Check Link
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7.4.
Check Handset Transmission
24
7.5.
Check Handset Reception
24
7.6.
Check Caller ID
24
7.7.
Bell Reception
25
8 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
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8.1.
Check Point (Base Unit)
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8.2.
The Setting Method of JIG (Base Unit)
30
8.3.
Adjustment Standard (Base Unit)
32
8.4.
Check Point (Charger Unit)
34
8.5.
Adjustment Standard (Charger Unit)
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9 TROUBLESHOOTING BY SYMPTOM (HANDSET)
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9.1.
Check Point (Handset)
35
9.2.
The Setting Method of JIG (Handset)
39
9.3.
Adjustment Standard (Handset)
41
10 THINGS TO DO AFTER REPLACING IC
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10.1. Base Unit
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10.2. Handset
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11 RF SPECIFICATION
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11.1. Base Unit
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11.2. Handset
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12 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 44
13 FREQUENCY TABLE (MHz)
44
14 BLOCK DIAGRAM (BASE UNIT)
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15 CIRCUIT OPERATION (BASE UNIT)
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15.1. Outline
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15.2. Power Supply Circuit
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15.3. Telephone Line Interface
48
15.4. Transmitter/Receiver
48
15.5. Pulse Dialing section
48
16 BLOCK DIAGRAM (HANDSET)
49
17 CIRCUIT OPERATION (HANDSET)
50
17.1. Outline
50
17.2. Power Supply Circuit/Reset Circuit
50
17.3. Charge Circuit
50
17.4. Battery Low/Power Down Detector
51
17.5. Speakerphone
51
18 CIRCUIT OPERATION (CHARGER UNIT)
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18.1. Power Supply Circuit
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19 SIGNAL ROUTE
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20 CPU DATA (BASE UNIT)
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20.1. IC8 (BBIC)
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21 CPU DATA (HANDSET)
57
21.1. IC1 (BBIC)
57
22 ENGINEERING MODE
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22.1. Base Unit
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22.2. Handset
62
23 EEPROM LAYOUT (BASE UNIT)
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23.1. Scope
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23.2. Introduction
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23.3. EEPROM Layout
65
24 EEPROM LAYOUT (HANDSET)
70
24.1. Scope
70
24.2. Introduction
70
Note:
Because section 4 of this manual is an extract from the operating instructions for this model, it is subject to change without notice.
You can download and refer to the original operating instructions on TSN Server for further information.
You can download and refer to the original operating instructions on TSN Server for further information.
CONTENTS
Page
Page
2
KX-TCD286RUT / KX-TCA128RUT
24.3. EEPROM contents
70
25 HOW TO REPLACE THE FLAT PACKAGE IC
73
25.1. Preparation
73
25.2. How to Remove the IC
73
25.3. How to Install the IC
74
25.4. How to Remove a Solder Bridge
74
26 CABINET AND ELECTRICAL PARTS (BASE UNIT)
75
27 CABINET AND ELECTRICAL PARTS (HANDSET)
76
28 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
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29 ACCESSORIES AND PACKING MATERIALS
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29.1. KX-TCD286RUT
78
29.2. KX-TCA128RUT
79
30 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
80
30.1. Base Unit
80
30.2. Handset
80
30.3. Charger Unit
80
31 REPLACEMENT PARTS LIST
81
31.1. Base Unit
81
31.2. Handset
83
31.3. Charger Unit
85
31.4. Accessories and Packing Materials
85
31.5. Fixtures and Tools
85
32 FOR SCHEMATIC DIAGRAM
87
32.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT_MAIN
(baseband)))
87
32.2. Handset (SCHEMATIC DIAGRAM (HANDSET_MAIN)) 87
32.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
87
33 SCHEMATIC DIAGRAM (BASE UNIT_MAIN (baseband))
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34 SCHEMATIC DIAGRAM (BASE UNIT_MAIN (Line Interface)) 89
35 SCHEMATIC DIAGRAM (BASE UNIT_OPERATION)
90
36 SCHEMATIC DIAGRAM (BASE UNIT_RF PART)
91
37 SCHEMATIC DIAGRAM (HANDSET_MAIN)
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38 SCHEMATIC DIAGRAM (HANDSET_RF PART)
93
39 SCHEMATIC DIAGRAM (CHARGER UNIT)
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40 CIRCUIT BOARD (BASE UNIT_MAIN)
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40.1. Component View
95
40.2. Flow Solder Side View
96
41 CIRCUIT BOARD (BASE UNIT_OPERATION)
97
41.1. Component View
97
41.2. Flow Solder Side View
98
42 CIRCUIT BOARD (HANDSET)
99
42.1. Component View
99
42.2. Flow Solder Side View
100
43 CIRCUIT BOARD (CHARGER UNIT)
101
43.1. Component View
101
43.2. Flow Solder Side View
101
3
KX-TCD286RUT / KX-TCA128RUT
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
·
PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
·
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD286RUT / KX-TCA128RUT
1.2. How to recognize that Pb Free solder is used
(Example: Handset P.C.B.)
IC1
IC3
PbF
CN6
CN4
Marked
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil and ground them.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
3 CAUTION
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
5
KX-TCD286RUT / KX-TCA128RUT