Panasonic KX-TCD225UA / KX-TCA122UA / KX-TCA121UA Service Manual ▷ View online
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to Recognize that Pb Free Solder is Used
5
2
FOR SERVICE TECHNICIANS
5
3
CAUTION
5
4
BATTERY
6
4.1.
Battery Installation
6
4.2.
Battery Charge
6
4.3.
Battery Life
7
4.4.
Battery Replacement
7
5
LOCATION OF CONTROLS
8
5.1.
Base Unit
8
5.2.
Handset
8
6
SETTINGS
9
6.1.
Connections
10
6.2.
Guide to Settings
11
6.3.
Ringer Volume
13
6.4.
Night Mode
14
6.5.
PIN Code
15
6.6.
Reset
16
6.7.
Key Lock
17
6.8.
R Button to Use the Recall Feature
17
6.9.
Pause Button for PBX/Long Distance Service Users
17
6.10. Setting Call Restriction
17
6.11. Turning Call BAR On/Off (Call Prohibition)
18
6.12. Changing the Display Language
18
6.13. Changing the Recall Time
18
6.14. Setting Dialling Mode (Tone/Pulse)
18
6.15. ARS (Automatic Route Selection)
19
7
DISPLAY
20
7.1.
Display Icons
20
7.2.
ABH and Caller ID Display
20
8
OPERATIONS
22
8.1.
Turning the Power On/Off
22
8.2.
Setting the Date and Time
22
8.3.
Redialling
22
8.4.
Calling Code
23
8.5.
Voice ABH
23
8.6. Phonebook
24
8.7.
Voice Mail Service
28
8.8.
Registering a Handset to a Base Unit
28
8.9.
Selecting a Base Unit
29
9
Answering System
30
9.1.
Turning the Answering System On/Off
30
9.2.
Greeting Message
30
9.3.
Listening to Message
31
9.4.
Using Direct Commands
32
9.5.
Remote Operation
33
10 TROUBLESHOOTING
34
11 DISASSEMBLY INSTRUCTIONS
37
11.1. Base Unit
37
11.2. Handset
38
11.3. Charger Unit
39
12 HOW TO REPLACE THE HANDSET LCD
40
13 TROUBLESHOOTING FLOWCHART
41
13.1. Check Power
42
13.2. Check Battery Charge
43
13.3. Check Link
44
13.4. Check Handset Transmission
48
13.5. Check Handset Reception
48
13.6. Check Caller ID
48
13.7. Bell Reception
49
13.8. Check TAM Operation
49
14 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
50
14.1. Check Point (Base Unit)
50
14.2. The Setting Method of JIG (Base Unit)
54
14.3. Adjustment Standard (Base Unit)
55
14.4. Check Point (Charger Unit)
56
14.5. Adjustment Standard (Charger Unit)
56
15 TROUBLESHOOTING BY SYMPTOM (HANDSET)
57
15.1. Check Point (Handset)
57
15.2. Troubleshooting for Speakerphone
60
15.3. The Setting Method of JIG (Handset)
61
Note:
Because CONTENTS 4 to 10 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD225UA / KX-TCA122UA / KX-TCA121UA
15.4. Adjustment Standard (Handset)
62
16 THINGS TO DO AFTER REPLACING IC
63
16.1. Base Unit
63
16.2. Handset
63
17 RF SPECIFICATION
64
17.1. Base Unit
64
17.2. Handset
64
18 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 65
19 FREQUENCY TABLE (MHz)
65
20 BLOCK DIAGRAM (BASE UNIT)
66
21 CIRCUIT OPERATION (BASE UNIT)
67
21.1. Outline
67
21.2. Power Supply Circuit
68
21.3. Telephone Line Interface
69
21.4. Transmitter/Receiver
69
21.5. Pulse Dialling
69
22 BLOCK DIAGRAM (HANDSET)
70
23 CIRCUIT OPERATION (HANDSET)
71
23.1. Outline
71
23.2. Power Supply Circuit/Reset Circuit
71
23.3. Charge Circuit
71
23.4. Battery Low/Power Down Detector
71
23.5. Speakerphone
71
24 CIRCUIT OPERATION (CHARGER UNIT)
72
24.1. Power Supply Circuit
72
25 SIGNAL ROUTE
73
26 CPU DATA (BASE UNIT)
75
26.1. IC8 (BBIC)
75
27 CPU DATA (HANDSET)
77
27.1. IC1 (BBIC)
77
28 ENGINEERING MODE
79
28.1. Base Unit
79
28.2. Handset
82
29 EEPROM LAYOUT (BASE UNIT)
84
29.1. Scope
84
29.2. Introduction
84
29.3. EEPROM Layout
84
30 EEPROM LAYOUT (HANDSET)
89
30.1. Scope
89
30.2. Introduction
89
30.3. EEPROM contents
89
31 HOW TO REPLACE THE FLAT PACKAGE IC
92
31.1. PREPARATION
92
31.2. FLAT PACKAGE IC REMOVAL PROCEDURE
92
31.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
93
31.4. BRIDGE MODIFICATION PROCEDURE
93
32 CABINET AND ELECTRICAL PARTS (BASE UNIT)
94
33 CABINET AND ELECTRICAL PARTS (HANDSET)
95
34 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
96
35 ACCESSORIES AND PACKING MATERIALS
97
35.1. KX-TCD225UAF/UAS/UAT
97
35.2. KX-TCA121UAF/UAS/UAT
98
36 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
99
36.1. Base Unit
99
36.2. Handset
99
36.3. Charger Unit
99
37 REPLACEMENT PARTS LIST
100
37.1. Base Unit
100
37.2. Handset
102
37.3. Charger Unit
104
37.4. Accessories and Packing Materials
104
37.5. Fixtures and Tools
104
38 FOR SCHEMATIC DIAGRAM
105
38.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
105
38.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
105
38.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
105
39 SCHEMATIC DIAGRAM (BASE UNIT)
106
40 SCHEMATIC DIAGRAM (HANDSET)
108
41 SCHEMATIC DIAGRAM (CHARGER UNIT)
110
42 CIRCUIT BOARD (BASE UNIT)
111
42.1. Component View
111
42.2. Flow Solder Side View
112
43 CIRCUIT BOARD (HANDSET)
113
43.1. Component View
113
43.2. Flow Solder Side View
114
44 CIRCUIT BOARD (CHARGER UNIT)
115
44.1. Component View
115
44.2. Flow Solder Side View
115
3
KX-TCD225UA / KX-TCA122UA / KX-TCA121UA
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
·
PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
·
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
·
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
·
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD225UA / KX-TCA122UA / KX-TCA121UA
(Example: Handset P.C.B.)
1.2. How to Recognize that Pb Free Solder is Used
C66
A201
ANT
R59
C54
C55
C45
R54
R55
C46
C47
R62
Q5
Q9
J3
TP22
CHG
CHG
TP23
J2
UTX
URX
J4
C58
C97
C102
C68
C37
C91
R85
C6
C19
R19
R82
C82
SP_TEST1
REV_TEST1
REV_TEST2
SP_TEST2
C60
C59
C123
C64
C61
C65
C44
C62
CLK
C63
D1
R93
C119
R6
R47
R46
R86
R25
R29
C10
C101
C107
C108
C111
C112
F1
J1
C3
R1
R83
R43
C98
L9
L7
L6
C95
C78
C79
VDD3
D7
D6
D9
Q8
D10
C40
R5
L5
L4
R74
C80
R36
C76
C16
C92
R80
C13
C83
C69
C70
C81
C86
C15
R35
R67
R66
C14
R34
C75
C38
C77
R61
R71
R40
R39
R64
D5
D8
D4
R60
JTAG
R63
VDD1
VDD2
POWER
R91
C93
C41
C4
C94
C22
C72
R15
R57
R96
C116
C117
C122
C113
C24
R68
C100
C20
C7
R21 R20
BAT GND
C57
C1
C53
CN6
C51
C50
C48
C49
C67
A
17
26
10
1
C84
R75
PbF
IC1
IC3
IC2
X1
C21
R90
C18
C96
R92
R72
C99
C23
C23
R87
R7
C114
R94
C120
C115
C71
R89
R88
R88
C39
R26
C90
C90
C103
R38
R37
C17
R37
C17
C109
C87
C12
C12
L1
R12
R81
C118
C104
C5
C8
Q4
Q11
Q2
Q3
Q10
Q1
Q7
PQUP11278Z
1
1
1
8
8
4
4
5
5
20
80
61
60
41
21
40
Marked
(Component View)
Note:
The location of the “PbF” mark is subject to change without notice.
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil and ground them.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
3 CAUTION
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
5
KX-TCD225UA / KX-TCA122UA / KX-TCA121UA