Panasonic KX-TCD215UA / KX-TCD217UA / KX-TCA121UA Service Manual ▷ View online
KX-TCD215UA
KX-TCD217UA
KX-TCA121UA
KX-TCD217UA
KX-TCA121UA
Digital Cordless Phone
UAF-Blue Metic Version
UAS-Silver Version
UAT-Titanium Black Version
(for Ukraine)
Telephone Equipment
ORDER NO. KM40505719CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
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1.1. Suggested PbF Solder
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1.2. How to Recognize that Pb Free Solder is Used
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2 FOR SERVICE TECHNICIANS
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3 CAUTION
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4 BATTERY
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4.1. Battery Installation
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4.2. Battery Charge
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4.3. Battery Life
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4.4. Battery Replacement
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5 LOCATION OF CONTROLS
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5.1. Base Unit
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5.2. Handset
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6 SETTINGS
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6.1. Connections
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6.2. Guide to Settings
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6.3. Ringer Volume
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6.4. Night Mode
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6.5. PIN Code
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6.6. Reset
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6.7. Key Lock
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6.8. R Button (to Use the Recall Feature)
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6.9. Pause Button for PBX/Long Distance Service Users
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6.10. Setting Call Restriction
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6.11. Turning Call BAR On/Off (Call Prohibition)
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6.12. Changing the Display Language
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6.13. Changing the Recall Time
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6.14. Setting Dialling Mode (Tone/Pulse)
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6.15. ARS (Automatic Route Selection)
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7 DISPLAY
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7.1. Display Icons
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7.2. ABH and Caller ID Display
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8 OPERATIONS
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8.1. Turning the Power On/Off
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8.2. Setting the Date and Time
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8.3. Redialling
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8.4. Calling Code
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8.5. Voice ABH
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8.6. Phonebook
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8.7. Voice Mail Service
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8.8. Registering a Handset to a Base Unit
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8.9. Selecting a Base Unit
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9 TROUBLESHOOTING
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10 DISASSEMBLY INSTRUCTIONS
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10.1. Base Unit
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10.2. Handset
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10.3. Charger Unit
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11 HOW TO REPLACE THE HANDSET LCD
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12 TROUBLESHOOTING FLOWCHART
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12.1. Check Power
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12.2. Check Battery Charge
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12.3. Check Link
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12.4. Check Handset Transmission
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12.5. Check Handset Reception
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12.6. Check Caller ID
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12.7. Bell Reception
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13 TROUBLESHOOTING BY SYMPTOM (BASE UNIT AND
CHARGER UNIT)
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13.1. Check Point (Base Unit)
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13.2. The Setting Method ofJIG (Base Unit)
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13.3. Adjustment Standard (Base Unit)
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13.4. Check Point (Charger Unit)
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13.5. Adjustment Standard (Charger Unit)
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14 TROUBLESHOOTING BY SYMPTOM (HANDSET)
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14.1. Check Point (Handset)
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14.2. Troubleshooting for Speakerphone
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14.3. The Setting Method ofJIG (Handset)
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14.4. Adjustment Standard (Handset)
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15 THINGS TO DO AFTER REPLACING IC
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15.1. Base Unit
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15.2. Handset
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16 RF SPECIFICATION
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16.1. Base Unit
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16.2. Handset
61
Note:
Because CONTENTS 4 to 9 are the extracts from the Operating Instructions of this model, they are subject to change without
notice. Please refer to the original Operating Instructions for further information.
notice. Please refer to the original Operating Instructions for further information.
CONTENTS
Page
Page
2
KX-TCD215UA / KX-TCD217U A / KX-TCA121UA
17 HOW TO CHECK THE HANDSET SPEAKER OR RECEIVER 62
18 FREQUENCY TABLE (MHz)
62
19 BLOCK DIAGRAM (BASE UNIT)
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20 CIRCUIT OPERATION (BASE UNIT)
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20.1. Outline
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20.2. Power Supply Circuit
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20.3. Telephone Line Interface
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20.4. Transmitter/Receiver
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20.5. Pulse Dialling
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21 BLOCK DIAGRAM (HANDSET)
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22 CIRCUIT OPERATION (HANDSET)
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22.1. Outline
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22.2. Power Supply Circuit/Reset Circuit
68
22.3. Charge Circuit
68
22.4. Battery Low/Power Down Detector
68
22.5. Speakerphone
68
23 CIRCUIT OPERATION (CHARGER UNIT)
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23.1. Power Supply Circuit
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24 SIGNAL ROUTE
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25 CPU DATA (BASE UNIT)
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25.1. IC8 (BBIC)
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26 CPU DATA (HANDSET)
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26.1. IC1 (BBIC)
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27 ENGINEERING MODE
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27.1. Base Unit
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27.2. Handset
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28 EEPROM LAYOUT (BASE UNIT)
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28.1. Scope
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28.2. Introduction
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28.3. EEPROM Layout
80
29 EEPROM LAYOUT (HANDSET)
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29.1. Scope
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29.2. Introduction
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29.3. EEPROM contents
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30 HOW TO REPLACE THE FLAT PACKAGE IC
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30.1. PREPARATION
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30.2. FLAT PACKAGE IC REMOVAL PROCEDURE
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30.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
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30.4. BRIDGE MODIFICATION PROCEDURE
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31 CABINET AND ELECTRICAL PARTS (BASE UNIT)
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32 CABINET AND ELECTRICAL PARTS (HANDSET)
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33 CABINET AND ELECTRICAL PARTS (CHARGER UNIT)
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34 ACCESSORIES AND PACKING MATERIALS
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34.1. KX-TCD215UAF/UAS/UAT
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34.2. KX-TCD217UAS/UAT
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34.3. KX-TCA121UAF/UAS/UAT
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35 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
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35.1. Base Unit
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35.2. Handset
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35.3. Charger Unit
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36 REPLACEMENT PARTS LIST
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36.1. Base Unit
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36.2. Handset
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36.3. Charger Unit
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36.4. Accessories and Packing Materials
101
36.5. Fixtures and Tools
101
37 FOR SCHEMATIC DIAGRAM
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37.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
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37.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
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37.3. Charger Unit (SCHEMATIC DIAGRAM (CHARGER UNIT))
103
38 SCHEMATIC DIAGRAM (BASE UNIT)
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39 SCHEMATIC DIAGRAM (HANDSET)
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40 SCHEMATIC DIAGRAM (CHARGER UNIT)
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41 CIRCUIT BOARD (BASE UNIT)
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41.1. Component View
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41.2. Flow Solder Side View
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42 CIRCUIT BOARD (HANDSET)
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42.1. Component View
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42.2. Flow Solder Side View
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43 CIRCUIT BOARD (CHARGER UNIT)
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43.1. Component View
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43.2. Flow Solder Side View
113
3
KX-TCD215UA / KX-TCD217U A / KX-TCA121UA
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type ofsolder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type ofsolder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
•
PbF solder has a melting point that is 50°F ~ 70°F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case ofusing high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20°F (370°C ± 10°C). In case ofusing high temperature soldering iron, please
be careful not to heat too long.
•
•
•
•
PbF solder will tend to splash ifit is heated much higher than its melting point, approximately 1100°F (600°C).
•
•
•
•
Ifyou must use Pb solder on a PCB manufactured using PbF solder, remove as much ofthe original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
•
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1.
Suggested PbF Solder
There are several types ofPbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu) or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TCD215UA / KX-TCD217U A / KX-TCA121UA
