Panasonic KX-TCA185RU Service Manual ▷ View online
45
KX-TCA185RU
12.2. How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
12.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
F ± 20F (370C ± 10C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity
0.82.
Type
RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4).
12.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
12.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
solder to the tip so that it flows under the pins as they are
heated.
12.2.4.
Removing Solder From Between
Pins
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
pads.
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KX-TCA185RU
12.3. How to Replace the LLP (Leadless Leadframe Package) IC
12.3.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
F ± 20 F (370 C ± 10 C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608
F ± 68 F (320 C ± 20 C)
12.3.2.
Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
12.3.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the
P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is
melted completely.
Note:
Note:
• Be careful not to touch the peripheral parts with twee-
zers, etc. They are unstable.
When it is hard to melt the solder completely, heat it with
a hot air desoldering tool through the IC besides through
the P.C.Board.
a hot air desoldering tool through the IC besides through
the P.C.Board.
3. After removing the IC, clean the P.C.Board of residual sol-
der.
12.3.4.
How to Install the IC
1. Place the solder a little on the land where the radiation
GND pad on IC bottom is to be attached.
2. Place the solder a little on the land where IC pins are to
be attached, then place the IC.
Note:
Note:
• When placing the IC, the positioning should be done very
carefully.
3. Heat the IC with a hot air desoldering tool through the
P.C.Board until the solder on IC bottom is melted.
Note:
Note:
• Be sure to place it precisely, controlling the air volume of
the hot air desoldering tool.
4. After soldering, confirm there are no short and open cir-
cuits with visual inspection.
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KX-TCA185RU
12.3.5.
How to Remove a Solder Bridge
When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.
48
KX-TCA185RU
13 Schematic Diagram
13.1. Handset
KX-TCA185
58 No.1 1/2
(1)
(2)
(3)
(4)
(5)
(4)
(5)
(6)
(8)
(7)
(9)
(10)
(11)
(10)
(11)
(12)
(14)
(15)
(16)
(17)
(13)
Charge Current
5.5V
3.0V
1.775V
4.0V
(When LCD Backlight on)
C
E
B
A
D
F
3
4
2
1
5
CHG_CUR
CHG_CUR
VIB_CTRL
VIB_CTRL
CHG_CTRL
CHG_DET
VIB_CTRL
CP_ON
ON/OFF
KBIO_7
KBIO_7
ON/OFF
KBIO_7
CP_ON
R201
0.1
VBAT
GND
PCB
RE1
PNLB1926ZA-EC
C213
NC
GND
GND
GND
GND
GND
GND
C302
0.1u
C301
0.1u
RA300
3.3k
1
2
3
4
L200
10u
L201
10u
GND
C211
NC
C307
10p
3.0V
C21 2.2u
GNDA
GND
C214
NC
GNDA
VBAT
LNA_INN
ANT2
ANT1
RX_SW
TX_SW
BAL_OUT1
CHG_CTRL
C10
0.1u
C12
0.1u
C11
NC
GND
VBAT
CHG_CUR
VBAT_MON
GNDA
C306
10p
C201
NC
GND
VREF
VBG
3.0V
GND
GND
GND
GND
C7
NC
(1608)
C19 10u
GND
GND
C305
0.039u
C202
39p
L2
120
C206
39p
C210
39p
C3
1u
GND
CN500
1
2
VBAT
BAL_OUT2
IC200
NC
4
VSS
3
NC
1 OUT
2 VDD
4.0V
VBAT
IF_BAT_OK
IF_CDC_DAT_DA
IF_CDC_DAT_AD
IF_CDC_DAT_AD
IF_CDC_DIR
IF_CLK_IF
IF_CLK_PLL
IF_DATA_AD
IF_DATA_DA
IF_EN_AD
IF_EN_DA
IF_INT_ANA
IF_NARES
IF_NPORST
IF_T_DATA
IF_RX1
IF_MLSE
C6
10u
VDDC
VDDC
CHG_DET
CP_ON
F201
2.5A
C4
NC
VCCA
ZA2
1
2
3
4
GND
GND
GND
Q205
Q200
C23
0.1u
GND
ON/OFF
KBIO_7
GND
LNA_INP
VCC_PA
R3
100k
R205
47k
R206
NC
R208
10k
R210
100k
R543
NC
R542
1.8k
R211
NC
R203
NC
R7
100k
R8
100k
R9
100k
R300
3.3k
R6
10
R207
3.3
C207
NC
C209
NC
Q540
D540
R219
1k
C220
10u
C223
1u
ATSTN
ATSTP
C203
220u 6.3
C204
220u 6.3
C221
220u 6.3
220u 6.3
C222
GND
GND
VBAT
CHG(+)
CHG(-)
BATT+
BATT-
C22
(1608)
10u
GND
C8
2.2u
C9
2.2u
IC201
1
VOUT
2
GND
4
CN
5
VCC
3
SHD
6
CP
C219
10u
C215
NC
Q204
C1
1u
D200
C216 0.1u
GND
GND
GND
R214
100k
CHG+
CHG-
RSTN
Q201
Q203
R215
6.8k
R540
27
(2125)
R541
27
(2125)
R544
22
(2125)
C13
10u
(1608)
C14
22u
L1
22u
C205
0.01u
0.01u
R209 33k
R213
33k
C40
0.5p
C212
0.1u
IC1
1
DOUBCAPP2
2
DOUBCAPN1
18
SPOUTP
3
DOUBCAPP1
4
DOUT3V0
5
DOUT4V5
6
DOUT2V5/DCIN0/LIN0
7
LEDSINK2/DCIN1
8
DCIN2
19
VCCPA
20
SPOUTN
21
HSSPOUTP
22
LOUT
23
PWM0
24
DCINS
25
XOUT
38
TEST
39
RX_SW
40
LNA_INN
69
GND
9
DCIN3/LIN1
10
LEDSINK1/PWM1
11
VREF
12
VCCA
13
MIN
14
MIP
15
HSMIN
16
HSMIP
26
XIN
27
VDD_APU
28
VBAT_APU
29
VDD_IF
30
VCC_FE_IF
31
VCC_PA
32
BAL_OUT2
33
BAL_OUT1
41
LNA_INP
42
ATST_N
43
ATST_P/EXT_LNA
44
RSTN
45
VCC_VCO
46
ON_OFF
47
ON_OFF_OUT
48
IF_T_DATA
49
IF_MLSE
50
IF_RX1
51
IF_NPORST
53
IF_INT_ANA
54
IF_EN_DA
55
IF_EN_AD
56
IF_DATA_DA
57
IF_DATA_AD
58
IF_CLK_PLL
59
IF_CLK_IF
60
IF_CDC_DIR
61
IF_CDC_DAT_DA
62
IF_CDC_DAT_AD
63
IF_BAT_OK
64
VDD_ADIF
65
VDDCORE
66
COREOUT
67
VBAT
68 DOUBCAPN2
36
GND_RF
37
ANT2
17
MPWR
34
TX_SW
35
ANT1
52
IF_NARES
C5
10u
6.3
To Charge
Terminal
Terminal
To Battery
TO RF BLOCK
VIB
TO DPU
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