Panasonic KX-TC2106UAB / KX-TC2106UAS / KX-TC2106UAT / KX-TC2106UAW Service Manual ▷ View online
KX-TC2106UAB
KX-TC2106UAS
KX-TC2106UAT
KX-TC2106UAW
KX-TC2106UAS
KX-TC2106UAT
KX-TC2106UAW
Cordless Phone
Black Version
Silver Version
Metic Black Version
White Version
(for Ukraine)
Telephone Equipment
ORDER NO. KM40509873CE
1
ABOUT LEAD FREE SOLDER (PbF: Pb free)
4
1.1.
Suggested PbF Solder
4
1.2.
How to recognize that Pb Free Solder is Used
5
2
FOR SERVICE TECHNICIANS
5
3
CAUTION
5
4
OPERATING INSTRUCTIONS
6
4.1.
Battery
6
4.2.
Location of Controls
7
4.3.
Connection
8
4.4.
Troubleshooting
9
5
DISASSEMBLY INSTRUCTIONS
10
6
TROUBLESHOOTING GUIDE
12
6.1.
Check Power
13
6.2.
Bell Reception
14
6.3.
Check Battery Charge
15
6.4.
Check Link
16
6.5.
Check Handset Transmission
17
6.6.
Check Handset Reception
18
7
ADJUSTMENTS (BASE UNIT)
19
7.1.
Test Mode Flow Chart (Base Unit)
19
7.2.
How to change the channel
20
7.3.
Adjustment
20
7.4.
Adjustment Standard (Base Unit)
21
8
ADJUSTMENTS (HANDSET)
22
8.1.
Test Mode Flow Chart (Handset)
22
8.2.
How to change the channel
23
8.3.
Adjustment
23
8.4.
Adjustment Standard (Handset)
24
9
RF SPECIFICATION
25
9.1.
Base Unit
25
9.2.
Handset
25
10 HOW TO CHECK THE HANDSET SPEAKER
25
11 FREQUENCY TABLE (MHz)
26
12 EXPLANATION OF CPU DATA COMMUNICATION
27
12.1. STAND-BY -> TALK, TALK -> STAND-BY
27
12.2. Ringing
28
12.3. Changing the Channel
29
12.4. Ports for transmitting and receiving of data
30
12.5. Waveform of DATA used for cordless transmission and
reception
30
13 BLOCK DIAGRAM (BASE UNIT)
31
14 CIRCUIT OPERATION (BASE UNIT)
32
14.1. Outline
32
14.2. Power Supply Circuit
33
14.3. Reset Circuit
34
14.4. Charge Circuit
35
14.5. Telephone Line Interface
35
14.6. Transmitter/Receiver
36
15 BLOCK DIAGRAM (HANDSET)
38
16 CIRCUIT OPERATION (HANDSET)
39
16.1. Outline
39
16.2. Reset Circuit
39
16.3. Battery Low / Power Down Detector
40
17 SIGNAL ROUTE
41
18 CPU DATA (Base Unit)
42
18.1. IC201
42
19 CPU DATA (Handset)
43
19.1. IC701
43
20 RF IC (Base Unit and Handset)
44
20.1. Base Unit: IC401, Handset: IC801
44
21 HOW TO REPLACE THE FLAT PACKAGE IC
45
21.1. PREPARATION
45
21.2. FLAT PACKAGE IC REMOVAL PROCEDURE
45
21.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
46
21.4. BRIDGE MODIFICATION PROCEDURE
46
22 CABINET AND ELECTRICAL PARTS (BASE UNIT)
47
23 CABINET AND ELECTRICAL PARTS (HANDSET)
48
24 ACCESSORIES AND PACKING MATERIALS
49
25 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
50
25.1. Base Unit
50
25.2. Handset
50
26 REPLACEMENT PARTS LIST
51
26.1. Base Unit
51
Note:
Because CONTENTS 4 is the extract from the Operating Instructions of this model, it is subject to change without notice. You can
download and refer to the original Operating Instructions on TSN Server for further information.
download and refer to the original Operating Instructions on TSN Server for further information.
CONTENTS
Page
Page
2
KX-TC2106UAB / KX-TC2106U AS / KX-TC2106U AT / KX-TC2106UAW
26.2. Handset
53
26.3. Accessories and Packing Materials
55
27 FOR SCHEMATIC DIAGRAM
56
27.1. Base Unit (SCHEMATIC DIAGRAM (BASE UNIT))
56
27.2. Handset (SCHEMATIC DIAGRAM (HANDSET))
56
28 SCHEMATIC DIAGRAM (BASE UNIT)
57
29 SCHEMATIC DIAGRAM (HANDSET)
58
30 CIRCUIT BOARD (BASE UNIT)
59
30.1. Component View
59
30.2. Flow Solder Side View
60
31 CIRCUIT BOARD (HANDSET)
61
31.1. Component View
61
31.2. Flow Solder Side View
62
3
KX-TC2106UAB / KX-TC2106U AS / KX-TC2106U AT / KX-TC2106UAW
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
•
PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700°F ± 20° F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
temperature control and adjust it to 700°F ± 20° F (370°C ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
•
•
•
•
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C).
•
•
•
•
If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
•
When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
opposite side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TC2106UAB / KX-TC2106U AS / KX-TC2106U AT / KX-TC2106UAW