Panasonic KX-NT511ARUW / KX-NT511ARUB Service Manual ▷ View online
29
KX-NT511ARUW/KX-NT511ARUB
10.2. Remove and Assembly for LCD
Please note the tab when LCD is resolved and assembled.
6. Remove 3 Screws (A).
7. Remove the Ope Board.
7. Remove the Ope Board.
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KX-NT511ARUW/KX-NT511ARUB
10.3. Assembly for Lead wire
Perform this process in reverse when taking the unit apart.
Note:
White modle only
NG
Reference line
ACETATE TAPE
(Width=10mm,L=10mm)
OK
Never make line
Clamp LEAD WIRE to each slit as follows.
- Top: WIRE from SPEAKER (Blue & Orange)
- Mid: WIRE from DC JACK (Black & Red)
- Bottom: WIRE from DC JACK
- Top: WIRE from SPEAKER (Blue & Orange)
- Mid: WIRE from DC JACK (Black & Red)
- Bottom: WIRE from DC JACK
(Brown & Yellow)
Push LEAD WIRE to the root
and there is no deflection.
and there is no deflection.
Push LEAD WIRE
under the Board.
No protrude WIREs from
the yellow line (the rib).
the yellow line (the rib).
Push LEAD WIRE under the PCB.
Style LEAD WIREs under
the hooks
the hooks
of SPEAKER RUBBER.
Taping for fixing cables
:
White area inside blue circle is the rib position of lower cabinet .
Never lead wire on this area.
Never lead wire on this area.
Taping area
Never tape on white area
Never tape on white area
ACETATE TAPE
(Width=6mm,L=15mm)
(Width=6mm,L=15mm)
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
CLAMP
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
SOLDERING
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KX-NT511ARUW/KX-NT511ARUB
11 Maintenance
11.1. Terminal Guide of the ICs Transistors and Diodes
11.1.1.
Main Board
11.1.2.
Operation Board
11.1.3.
LED Board
B1GFCFNN0010
C0EBH0000445
DZ2J056M0L
DMC5610M0R
B3AAB0000347
B3AAB0000347
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KX-NT511ARUW/KX-NT511ARUB
11.2. How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
11.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
F ± 20F (370C ± 10C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity
0.82.
Type
RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4).
11.2.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
11.2.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
solder to the tip so that it flows under the pins as they are
heated.
11.2.4.
Removing Solder From Between
Pins
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
pads.
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