Panasonic PT-RZ670 / PT-RW630 (serv.man13) Service Manual / Other ▷ View online
SECTION 2 DISASSEMBLY PROCEDURES
<RZ670J/RW630J>
3. Unscrew the 5 screws and remove the LD drive block.
4. 1) Remove the 2 clamps and remove the Sheet1.
2) Unscrew the 2 screws and remove the DR-P.C.Board.
5. Unscrew the 4 screws and remove the D-P.C.B top plate.
LD drive block
Sheet1
DR-P.C.Board
D-P.C.B. top plate
5
2
4
DIS-10
SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
6. Unscrew the 2 screws and remove the D-P.C.B (LD2).
7. Unscrew the 2 screws and remove the D-P.C.B (LD1).
2. 7. Removal of Power Supply Block
1. Remove the signal processing block according to the section 2.5 "Removal of Signal Processing Block
(DG-P.C.Board/A-P.C.Board)".
2. Unscrew the 6 screws and remove the Power Supply Block.
2. 8. Removal of DMD Block (FM-P.C.Board / DMD Chip / Trim Wheel)
1. Remove the front cover according to the section 2.4 "Removal of Side cover (L) / Side cover (R) / Front cover / Rear cover)"
2. Unscrew the 3 screws and remove the Lens cover.
D-P.C.Board
（LD1）
D-P.C.Board
（LD2）
Power supply block
Lens cover
4
4
6
3
DIS-11
SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
3. Unscrew the 3 screws and remove the Trim wheel cover.
[Coution] ・Carefully pull out the flexible cable of trim wheel from the through slit of the dust protection sheet.
・When re-assembling, make sure flexible cable is properly placed without slackness.
1) Unscrew the 2 screws and remove the Trim plate.
2) Unscrew the 3 screws and remove the Trim wheel.
（Torque:22±2 N・cm）
4. Unscrew the 6 screws and remove the DMD block.
[Coution] ・Refer section 2.1 to remove the flexible cables.
5. Unscrew the 4 screws and remove the heatsink.
[ Note for re-assembling ]
・ Apply the heat dissipation compound evenly to the rear surface of DMD heatsink.
・ Take care that compound does not stick out.
・ Take care that compound does not stick out.
Trim wheel cover
DMD block
Apply heat dissipation compound
Heatsink
Heat-sink
Smaller R of
spring to screw head
spring to screw head
3
6
4
3
2
Heat dissipation compound :
Shin-Etsu Silicone [ G-776 ] grade
Shin-Etsu Silicone [ G-776 ] grade
DIS-12
SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
6. Unscrew the 4 screws, remove FM-PCB and DMD chip.
[ Caution ] ・Do not touch the interposer contact part on FM-P.C.Board. (cause poor contact)
・Do not touch on the chip surface and contact pins of DMD.
[ Note for re-assembling ]
・ Tighten the 4 screws in numerical order. (torque : 50 - 60 N ・cm）
2.9. Removal of Rod (ASSY)
1. Remove the side cover (R) according to the section 2.4 "Removal of Side cover (L) / Side cover (R) / Front cover /
Rear cover".
2. Unscrew the 2 screws and remove the Radiator fan block.
3. Unscrew the 2 screws and remove the Liquid cooling tank plate.
FM-PCB
DMD chip
Interposer
Insulator
backer plate
①
②
③
④
Radiator fan block
Liquid cooling tank
(Upper）
4
2
2
DIS-13
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