Panasonic TH-50PF11EK Service Manual ▷ View online
5
TH-50PF11EK
2.2.
About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70
°F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20
°F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100
°F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
6
TH-50PF11EK
3 Service Navigation
3.1.
Service Hint
Board Name
Function
Board Name
Function
DN
Digital Signal Processor, Microcomputer
C1
Data drive (Right)
D
Format Converter, Plasma AI Processor
Sub-Field Processor
Sub-Field Processor
C2
Data drive (Center)
C3
Data drive (Left)
H3
Speaker terminal
DS
Slot Interface (Audio / Video / Sync Input Switch),
Sync Processor, Audio Processor,
Speaker Out Amplifier, DC-DC Converter
Sync Processor, Audio Processor,
Speaker Out Amplifier, DC-DC Converter
S1
Power switch
V1
Remote receiver, LED-G, R
V2
Key switch
SS
Sustain drive
PB
Fan control
SS2
Sustain Out
P
Power supply
SC
Scan drive
HX
PC / RS-232C_Input terminal
SU
Scan out (Upper)
HDE
DVI-D terminal
SD
Scan out (Lower)
HA
Component Video terminal (BNC)
7
TH-50PF11EK
3.2.
Applicable signals
8
TH-50PF11EK
4 Specifications
Power Source
220 - 240 V AC, 50/60Hz
Power Consumption
Power on
485 W
Stand-by condition
Save OFF 1.2 W, Save ON 0.7 W
Power off condition
0.4 W
Plasma Display panel
Drive method: AC type 50-inch,
16:9 aspect ratio
16:9 aspect ratio
Screen size
1,106 mm (W)
× 622 mm (H) × 1,269 mm (diagonal)
(No. of pixels)
2,073,600 (1,920 (W)
× 1,080 (H)) [5,760 × 1,080 dots]
Operating condition
Temperature
0
°C - 40 °C
Humidity
20 % - 80 %
Applicable signals
Colour System
NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format
525 (480) / 60i 60p, 625 (575) / 50i 50p, 750 (720) / 60p 50p, 1125 (1080) /
60i 60p 50i 50p 24p 25p 30p 24sF, 1250 (1080) / 50i
60i 60p 50i 50p 24p 25p 30p 24sF, 1250 (1080) / 50i
PC signals
VGA, SVGA, XGA, SXGA
UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
DVI-D IN
Video Input
DVI-D 24 Pin x 1
compliance with DVI Revision 1.0
* Refer to page 11 for applicable signals
compliance with DVI Revision 1.0
* Refer to page 11 for applicable signals
Audio Input
Stereo mini jack (M3) x 1
0.5 Vrms
0.5 Vrms
Content Protection
Compatible with HDCP 1.1
COMPONENT / RGB IN
Y / G (BNC)
with sync 1.0 Vp-p (75-ohm)
P
B
/B (BNC), P
R
/R (BNC)
0.7 Vp-p (75-ohm)
AUDIO IN (RCA PIN JACK
× 2)
0.5 Vrms
PC IN
(HIGH-DENSITY Mini-D-SUB 15PIN)
Y or G with sync 1.0 Vp-p (75-ohm)
Y or G without sync 0.7 Vp-p (75-ohm)
Y or G without sync 0.7 Vp-p (75-ohm)
B / P
B
/ C
B
: 0.7 Vp-p (75-ohm)
R / P
R
/ C
R
: 0.7 Vp-p (75-ohm)
HD / VD: 1.0 - 5.0 Vp-p (high impedance)
VBS (use HD port)
with picture 1.0 Vp-p (high impedance)
without picture 0.3 Vp-p (high impedance)
without picture 0.3 Vp-p (high impedance)
AUDIO IN (M3 JACK)
0.5 Vrms
SERIAL
EXTERNAL CONTROL TERMINAL (D-SUB 9PIN)
RS-232C COMPATIBLE
SPEAKERS
6-ohm, 16 W [8 W + 8 W] (10 % THD)
Accessories Supplied
Remote Control Transmitter
EUR7636090R
Batteries
2
× R6 Size
Fixing bands
TMME203
× 1
Dimensions (W
× H × D)
1,210 mm
× 724 mm × 95 mm
Mass (weight)
main unit only
approx. 36.0 kg net
with speakers
approx. 40.0 kg
Note:
• Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
• This equipment complies with the EMC standards listed below.
• This equipment complies with the EMC standards listed below.
EN55022, EN55024, EN61000-3-2, EN61000-3-3.
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