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TH-50PF11EK

8.19. Removal of Front Glass, V1, V2-Board and

Cabinet------------------------------------------------------ 25

8.20. Removal of Plasma Display Panel------------------- 26

9 Measurements and Adjustments -------------------------- 30

9.1. Adjustment Procedure ---------------------------------- 30
9.2. Adjustment ------------------------------------------------- 33

10 Block Diagram --------------------------------------------------- 37

10.1. Block (1 of 8) Diagram ---------------------------------- 37
10.2. Block (2 of 8) Diagram ---------------------------------- 38
10.3. Block (3 of 8) Diagram ---------------------------------- 39
10.4. Block (4 of 8) Diagram ---------------------------------- 40
10.5. Block (5 of 8) Diagram ---------------------------------- 41
10.6. Block (6 of 8) Diagram ---------------------------------- 42
10.7. Block (7 of 8) Diagram ---------------------------------- 43
10.8. Block (8 of 8) Diagram ---------------------------------- 44

11 Wiring Connection Diagram --------------------------------- 45

11.1. Wiring (1) --------------------------------------------------- 45
11.2. Wiring (2) --------------------------------------------------- 46
11.3. Wiring (3) --------------------------------------------------- 47

12 Schematic Diagram--------------------------------------------- 49

12.1. Schematic Diagram Notes ----------------------------- 49
12.2. P-Board (1 of 2) Schematic Diagram --------------- 50
12.3. P-Board (2 of 2) Schematic Diagram --------------- 51
12.4. PB, V1 and V2-Board Schematic Diagram -------- 52
12.5. HA-Board Schematic Diagram------------------------ 53
12.6. HX-Board Schematic Diagram------------------------ 54
12.7. HDE-Board (1 of 3) Schematic Diagram ----------- 55
12.8. HDE-Board (2 of 3) Schematic Diagram ----------- 56
12.9. HDE-Board (3 of 3) Schematic Diagram ----------- 57

12.10. DS-Board (1 of 6) Schematic Diagram ------------- 58

12.11. DS-Board (2 of 6) and H3-Board Schematic

Diagram----------------------------------------------------- 59

12.12. DS-Board (3 of 6) Schematic Diagram ------------- 60
12.13. DS-Board (4 of 6) Schematic Diagram ------------- 61
12.14. DS-Board (5 of 6) Schematic Diagram ------------- 62
12.15. DS-Board (6 of 6) Schematic Diagram ------------- 63
12.16. DN-Board (1 of 8) Schematic Diagram ------------- 64
12.17. DN-Board (2 of 8) Schematic Diagram ------------- 65
12.18. DN-Board (3 of 8) Schematic Diagram ------------- 66
12.19. DN-Board (4 of 8) Schematic Diagram ------------- 67
12.20. DN-Board (5 of 8) Schematic Diagram ------------- 68
12.21. DN-Board (6 of 8) Schematic Diagram ------------- 69
12.22. DN-Board (7 of 8) Schematic Diagram ------------- 70
12.23. DN-Board (8 of 8) Schematic Diagram ------------- 71
12.24. D-Board (1 of 7) Schematic Diagram --------------- 72
12.25. D-Board (2 of 7) Schematic Diagram --------------- 73
12.26. D-Board (3 of 7) Schematic Diagram --------------- 74
12.27. D-Board (4 of 7) Schematic Diagram --------------- 75
12.28. D-Board (5 of 7) Schematic Diagram --------------- 76
12.29. D-Board (6 of 7) Schematic Diagram --------------- 77
12.30. D-Board (7 of 7) Schematic Diagram --------------- 78
12.31. C1-Board (1 of 2) Schematic Diagram-------------- 79
12.32. C1-Board (2 of 2) Schematic Diagram-------------- 80
12.33. C2-Board (1 of 2) Schematic Diagram-------------- 81
12.34. C2-Board (2 of 2) Schematic Diagram-------------- 82
12.35. C3-Board (1 of 2) Schematic Diagram-------------- 83
12.36. C3-Board (2 of 2) Schematic Diagram-------------- 84
12.37. SC-Board (1 of 3) Schematic Diagram ------------- 85
12.38. SC-Board (2 of 3) Schematic Diagram ------------- 86
12.39. SC-Board (3 of 3) Schematic Diagram ------------- 87
12.40. SU-Board (1 of 3) Schematic Diagram ------------- 88

12.41. SU-Board (2 of 3) Schematic Diagram------------- 89
12.42. SU-Board (3 of 3) Schematic Diagram------------- 90
12.43. SD-Board (1 of 3) Schematic Diagram------------- 91
12.44. SD-Board (2 of 3) Schematic Diagram------------- 92
12.45. SD-Board (3 of 3) Schematic Diagram------------- 93
12.46. SS-Board (1 of 2) and S1-Board Schematic

Diagram ---------------------------------------------------- 94

12.47. SS-Board (2 of 2) and SS2-Board Schematic

Diagram ---------------------------------------------------- 95

13 Printed Circuit Board------------------------------------------ 96

13.1. P-Board ---------------------------------------------------- 96
13.2. PB-Board -------------------------------------------------100
13.3. HA-Board -------------------------------------------------101
13.4. HX-Board -------------------------------------------------102
13.5. HDE-Board -----------------------------------------------103
13.6. V1, V2, S1 and H3-Board ----------------------------104
13.7. DS-Board -------------------------------------------------105
13.8. DN-Board -------------------------------------------------107
13.9. D-Board ---------------------------------------------------109

13.10. C1-Board-------------------------------------------------- 111

13.11. C2-Board-------------------------------------------------- 112

13.12. C3-Board-------------------------------------------------- 113
13.13. SC-Board ------------------------------------------------- 114
13.14. SU-Board ------------------------------------------------- 117
13.15. SD-Board ------------------------------------------------- 118
13.16. SS2-Board------------------------------------------------ 119
13.17. SS-Board -------------------------------------------------120

14 Exploded View and Replacement Parts List----------123

14.1. Exploded View and Mechanical Replacement

Parts List --------------------------------------------------123

14.2. Electrical Replacement Parts List ------------------123

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TH-50PF11EK

1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the

wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.

3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight

out.

4. When servicing, observe the original lead dress.If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground

such as a water pipe, as shown in Figure 1.

3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U

1

 and U

2

, does not exceed the following values:

For a. c.: U

1

 = 35 V (peak) and U

2

 = 0.35 V (peak);

For d. c.: U

1

 = 1.0 V,

The limit value of U

2

 = 0.35 V (peak) for a. c. and U

1

 = 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0

mA d. c.
The limit value U

1

 = 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.

7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the customer.

Figure 1

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TH-50PF11EK

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-

num foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge sufficient to damage ES devices.

5. Do not use freon-propelled chemicals.   These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.
Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-

ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).

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TH-50PF11EK

This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution

• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 

°F (30~40 °C) higher. Please

use a high temperature soldering iron and set it to 700 ± 20 

°F (370 ± 10 °C).

• Pb free solder will tend to splash when heated too high (about 1100 

°F or 600 °C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the

opposite side. (see figure below)

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.