DOWNLOAD Panasonic TH-152UX1 / TH-152UX1W / TH-152UX1C Service Manual ↓ Size: 9.8 MB | Pages: 127 in PDF or view online for FREE

Model
TH-152UX1 TH-152UX1W TH-152UX1C
Pages
127
Size
9.8 MB
Type
PDF
Document
Service Manual
Brand
Device
Plasma / GPF13UX CHASSIS
File
th-152ux1-th-152ux1w-th-152ux1c.pdf
Date

Panasonic TH-152UX1 / TH-152UX1W / TH-152UX1C Service Manual ▷ View online

2
TH-152UX1 / TH-152UX1W / TH-152UX1C
9.7. Removal of DS-Board----------------------------------- 31
9.8. Removal of CJ(C1)-Board ----------------------------- 31
9.9. Removal of CK(C2)-Board ----------------------------- 32
9.10. Removal of CN(C1)-Board----------------------------- 32
9.11. Removal of CP(C2)-Board ----------------------------- 33
9.12. Removal of CQ(C3)-Board ---------------------------- 33
9.13. Removal of CR(C4)-Board----------------------------- 34
9.14. Removal of P5-Board ----------------------------------- 34
9.15. Removal of P9-Board ----------------------------------- 34
9.16. Removal of F_D-Board --------------------------------- 34
9.17. Removal of F1-Board ----------------------------------- 34
9.18. Removal of PB2-Board --------------------------------- 34
9.19. Removal of PB3-Board --------------------------------- 35
9.20. Removal of PB4-Board --------------------------------- 35
9.21. Removal of V1-Board ----------------------------------- 35
9.22. Removal of V3-Board ----------------------------------- 35
9.23. Removal of Slot Block----------------------------------- 36
9.24. Removal of P1-Board ----------------------------------- 36
9.25. Removal of P-Board ------------------------------------- 36
9.26. Removal of PB1-Board --------------------------------- 36
9.27. Removal of PSC-Board--------------------------------- 36
9.28. Removal of DSC-Board--------------------------------- 37
9.29. Removal of Front End Block -------------------------- 37
9.30. Removal of 4K Input Board (Upper)----------------- 37
9.31. Removal of 4K Input Board (Lower)----------------- 37
9.32. Removal of LVDS Output Board (Upper)----------- 37
9.33. Removal of LVDS Output Board (Lower)----------- 37
9.34. Removal of 2K Input Board---------------------------- 38
9.35. Removal of Power Board ------------------------------ 38
9.36. Removal of Exterior Chassis -------------------------- 38
9.37. Removal of F_A-Board --------------------------------- 38
9.38. Removal of F2-Board ----------------------------------- 38
9.39. Removal of D1(D_AD)-Board ------------------------- 39
9.40. Removal of Terminal Block ---------------------------- 39
9.41. Removal of CL(C3)-Board ----------------------------- 39
9.42. Removal of CM(C4)-Board ---------------------------- 40
9.43. Removal of Power Button Block---------------------- 41
9.44. Removal of Fan------------------------------------------- 41
9.45. Removal of CA(C1)-Board ----------------------------- 44
9.46. Removal of CB(C2)-Board ----------------------------- 45
9.47. Removal of CC(C3)-Board----------------------------- 45
9.48. Removal of CD(C4)-Board----------------------------- 46
9.49. Removal of CE(C1)-Board ----------------------------- 46
9.50. Removal of CF(C2)-Board ----------------------------- 47
9.51. Removal of CG(C3)-Board ---------------------------- 47
9.52. Removal of CH(C4)-Board----------------------------- 48
9.53. Removal of SU1-Board --------------------------------- 48
9.54. Removal of SU2-Board --------------------------------- 48
9.55. Removal of SU3-Board --------------------------------- 49
9.56. Removal of SD1-Board --------------------------------- 49
9.57. Removal of SD2-Board --------------------------------- 50
9.58. Removal of SD3-Board --------------------------------- 50
9.59. Removal of SCU-Board--------------------------------- 50
9.60. Removal of SCD-Board--------------------------------- 51
9.61. Removal of P2-Board ----------------------------------- 51
9.62. Removal of P3-Board ----------------------------------- 51
9.63. Removal of P4-Board ----------------------------------- 51
9.64. Removal of P6-Board ----------------------------------- 51
9.65. Removal of P7-Board ----------------------------------- 51
9.66. Removal of P8-Board ----------------------------------- 52
9.67. Removal of F_B-Board --------------------------------- 52
9.68. Removal of F_C-Board--------------------------------- 52
9.69. Removal of F_E-Board--------------------------------- 52
9.70. Removal of DU-Board ---------------------------------- 52
9.71. Removal of D2(D_AB)-Board------------------------- 53
9.72. Removal of D3(D_nill)-Board ------------------------- 53
9.73. Removal of D4(D_AC)-Board ------------------------ 53
9.74. Removal of SS2-Board--------------------------------- 53
9.75. Removal of SS3-Board--------------------------------- 53
9.76. Removal of SS4-Board--------------------------------- 54
9.77. Removal of SSU-Board -------------------------------- 54
9.78. Removal of SSD-Board -------------------------------- 54
9.79. Removal of PSS_L-Board ----------------------------- 54
9.80. Removal of PSS_R-Board ---------------------------- 55
9.81. Removal of DSS-Board -------------------------------- 55
10 Measurements and Adjustments-------------------------- 56
10.1. Adjustment Procedure---------------------------------- 56
10.2. Adjustment ------------------------------------------------ 61
11 Block Diagram --------------------------------------------------- 65
11.1.  Diagram Notes------------------------------------------- 65
11.2. Main Block (1 of 6) Diagram -------------------------- 66
11.3. Main Block (2 of 6) Diagram -------------------------- 67
11.4. Main Block (3 of 6) Diagram -------------------------- 68
11.5. Main Block (4 of 6) Diagram -------------------------- 69
11.6. Main Block (5 of 6) Diagram -------------------------- 70
11.7. Main Block (6 of 6) Diagram -------------------------- 71
11.8. Block (1 of 23) Diagram-------------------------------- 72
11.9. Block (2 of 23) Diagram-------------------------------- 73
11.10. Block (3 of 23) Diagram-------------------------------- 74
11.11. Block (4 of 23) Diagram-------------------------------- 75
11.12. Block (5 of 23) Diagram-------------------------------- 76
11.13. Block (6 of 23) Diagram-------------------------------- 77
11.14. Block (7 of 23) Diagram-------------------------------- 78
11.15. Block (8 of 23) Diagram-------------------------------- 79
11.16. Block (9 of 23) Diagram-------------------------------- 80
11.17. Block (10 of 23) Diagram ------------------------------ 81
11.18. Block (11 of 23) Diagram ------------------------------ 82
11.19. Block (12 of 23) Diagram ------------------------------ 83
11.20. Block (13 of 23) Diagram ------------------------------ 84
11.21. Block (14 of 23) Diagram ------------------------------ 85
11.22. Block (15 of 23) Diagram ------------------------------ 86
11.23. Block (16 of 23) Diagram ------------------------------ 87
11.24. Block (17 of 23) Diagram ------------------------------ 88
11.25. Block (18 of 23) Diagram ------------------------------ 89
11.26. Block (19 of 23) Diagram ------------------------------ 90
11.27. Block (20 of 23) Diagram ------------------------------ 91
11.28. Block (21 of 23) Diagram ------------------------------ 92
11.29. Block (22 of 23) Diagram ------------------------------ 93
11.30. Block (23 of 23) Diagram ------------------------------ 94
12 Wiring Connection Diagram -------------------------------- 95
12.1. Wiring (Fan)----------------------------------------------- 95
12.2. Wiring (Slot Block, Front End Block, V1, V2,
V3-Board)-------------------------------------------------- 99
12.3. Wiring (F2, PB1, PB2, PB3, PB4-Board) ---------101
12.4. Wiring (F1, FA, FB, FC, FD, FE-Board)-----------104
12.5. Wiring (DU, DSS, D1, D2, D3, D4-Board)--------106
12.6. Wiring (SD1, SU1, SS2, SS3, SS4, SCD,
SCU, PSC1, PSS_R, PSS_L, CB, CC, CF,
CG, CK, CL, CP, CQ-Board) -------------------------108
13 Exploded View and Replacement Parts List---------- 111
3
TH-152UX1 / TH-152UX1W / TH-152UX1C
1 Safety Precautions
1.1.
General Guidelines
1. When conducting repairs and servicing, do not attempt to modify the equipment, its parts or its materials.
2. When wiring units (with cables, flexible cables or lead wires) are supplied as repair parts and only one wire or some of the
wires have been broken or disconnected, do not attempt to repair or re-wire the units. Replace the entire wiring unit instead.
3. When conducting repairs and servicing, do not twist the Faston connectors but plug them straight in or unplug them straight
out.
4. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
5. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
6. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1.
Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the
two prongs on the plug.
2. Measure the resistance value, with an ohmmeter,
between the jumpered AC plug and each exposed metal-
lic cabinet part on the equipment such as screwheads,
connectors, control shafts, etc. When the exposed metal-
lic part has a return path to the chassis, the reading
should be between 1Mohm and 5.2Mohm.
When the exposed metal does not have a return path to 
the chassis, the reading must be
.
Figure 1
1.1.2.
Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use
an isolation transformer for this check.
2. Connect a 1.5kohm, 10 watts resistor, in parallel with a
0.15
µF capacitors, between each exposed metallic part
on the set and a good earth ground such as a water pipe,
as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensi-
tivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the volt-
age at each point.
5. Reverse the AC plug in the AC outlet and repeat each of
the above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a measure-
ment is outside of the limits specified, there is a possibility
of a shock hazard, and the equipment should be repaired
and rechecked before it is returned to the customer.
1.1.3.
High-place work
Please use the safty equipment (protection cap, gloves, safety
shoes, and stepladder, etc.) when you work in the height where
height is 2m or more. 
4
TH-152UX1 / TH-152UX1W / TH-152UX1C
2 Warning
2.1.
Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor [chip] components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as [anti-static (ESD protected)] can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals.   These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise ham less motion such as the brush-
ing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient
to damage an ES device).
5
TH-152UX1 / TH-152UX1W / TH-152UX1C
2.2.
About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol PbF stamped on the back of PCB.
Caution
• Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 
°F (30~40 °C) higher. Please
use a high temperature soldering iron and set it to 700 ± 20 
°F (370 ± 10 °C).
• Pb free solder will tend to splash when heated too high (about 1100 
°F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb sol-
der. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
• After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto the
opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder. How-
ever, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
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Panasonic TH-152UX1 / TH-152UX1W / TH-152UX1C Service Manual ▷ Download

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  • Here you can View online or download the Service Manual for the Panasonic TH-152UX1 / TH-152UX1W / TH-152UX1C in PDF for free, which will help you to disassemble, recover, fix and repair Panasonic TH-152UX1 / TH-152UX1W / TH-152UX1C Plasma. Information contained in Panasonic TH-152UX1 / TH-152UX1W / TH-152UX1C Service Manual (repair manual) includes:
  • Disassembly, troubleshooting, maintenance, adjustment, installation and setup instructions.
  • Schematics, Circuit, Wiring and Block diagrams.
  • Printed wiring boards (PWB) and printed circuit boards (PCB).
  • Exploded View and Parts List.