Panasonic KX-UDT111RU (serv.man3) Service Manual ▷ View online
ORDER NO. KMS1304934CE
DECT Portable Station
Model No.
KX-UDT111RU
(for Russia, Ukraine, Kazakhstan)
2
KX-UDT111RU
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions -----------------------------------------------3
1.1. For Service Technicians ---------------------------------3
2 Warning --------------------------------------------------------------4
2.1. About Lead Free Solder (PbF: Pb free) --------------4
2.1.1. Suggested PbF Solder -------------------------------4
2.2. Discarding of P. C. Board --------------------------------4
3 Specifications ------------------------------------------------------5
4 Technical Descriptions------------------------------------------6
4 Technical Descriptions------------------------------------------6
4.1. Block Diagram ----------------------------------------------6
4.2. Circuit Operations ------------------------------------------7
4.2. Circuit Operations ------------------------------------------7
4.2.1. Outline----------------------------------------------------7
4.2.2. Power Supply Circuit / Reset Circuit--------------7
4.2.3. Reset Circuit --------------------------------------------7
4.2.4. Clock Circuit --------------------------------------------8
4.2.5. Bus Access ---------------------------------------------8
4.2.6. Charge circuit (Include Charger)------------------9
4.2.7. Battery Low/Power Down Detector ---------------9
4.2.8. LCD Circuit-------------------------------------------- 10
4.2.9. LED Circuit -------------------------------------------- 11
4.2.2. Power Supply Circuit / Reset Circuit--------------7
4.2.3. Reset Circuit --------------------------------------------7
4.2.4. Clock Circuit --------------------------------------------8
4.2.5. Bus Access ---------------------------------------------8
4.2.6. Charge circuit (Include Charger)------------------9
4.2.7. Battery Low/Power Down Detector ---------------9
4.2.8. LCD Circuit-------------------------------------------- 10
4.2.9. LED Circuit -------------------------------------------- 11
4.2.10. Vib Circuit---------------------------------------------- 11
4.2.11. RF Circuit---------------------------------------------- 12
4.2.12. TX Audio Path---------------------------------------- 13
4.2.13. RX Audio Path --------------------------------------- 14
4.2.13. RX Audio Path --------------------------------------- 14
5 Location of Controls and Components------------------ 15
5.1. Name of Controls----------------------------------------- 15
6 Installation Instructions--------------------------------------- 17
6.1. Charger Connection ------------------------------------- 17
6.2. Battery ------------------------------------------------------ 17
6.2. Battery ------------------------------------------------------ 17
6.2.1. Battery Installation ---------------------------------- 17
6.2.2. Charging the Batteries ----------------------------- 17
6.2.3. Battery Information---------------------------------- 18
6.2.4. Low Battery Warning ------------------------------- 18
6.2.5. Replacing the Battery ------------------------------ 18
6.2.2. Charging the Batteries ----------------------------- 17
6.2.3. Battery Information---------------------------------- 18
6.2.4. Low Battery Warning ------------------------------- 18
6.2.5. Replacing the Battery ------------------------------ 18
7 Operating Instructions ---------------------------------------- 19
7.1. Soft Keys --------------------------------------------------- 19
7.2. Handset Setting Menu Layout ------------------------ 21
7.3. Key Lock---------------------------------------------------- 22
7.4. Selecting the Display Language---------------------- 22
7.5. Display ------------------------------------------------------ 22
7.6. Function Menus------------------------------------------- 23
7.7. Function Keys --------------------------------------------- 24
7.8. Flexible Keys ---------------------------------------------- 24
7.9. Caller ID ---------------------------------------------------- 25
7.2. Handset Setting Menu Layout ------------------------ 21
7.3. Key Lock---------------------------------------------------- 22
7.4. Selecting the Display Language---------------------- 22
7.5. Display ------------------------------------------------------ 22
7.6. Function Menus------------------------------------------- 23
7.7. Function Keys --------------------------------------------- 24
7.8. Flexible Keys ---------------------------------------------- 24
7.9. Caller ID ---------------------------------------------------- 25
7.10. Character Mode Table ---------------------------------- 26
8 Firmware Version up ------------------------------------------- 27
9 Troubleshooting Guide---------------------------------------- 28
9 Troubleshooting Guide---------------------------------------- 28
9.1. Power ON NG--------------------------------------------- 28
9.2. No Display ------------------------------------------------- 29
9.3. Charge problem ------------------------------------------ 30
9.4. LED problem ---------------------------------------------- 30
9.5. Vibrator Trouble------------------------------------------- 31
9.6. RF Trouble ------------------------------------------------- 32
9.2. No Display ------------------------------------------------- 29
9.3. Charge problem ------------------------------------------ 30
9.4. LED problem ---------------------------------------------- 30
9.5. Vibrator Trouble------------------------------------------- 31
9.6. RF Trouble ------------------------------------------------- 32
9.6.1. No Link problem (DECT) -------------------------- 32
9.7. STM (Start Monitor)-------------------------------------- 33
9.8. Error Message -------------------------------------------- 34
9.8. Error Message -------------------------------------------- 34
9.8.1. Need Repair ------------------------------------------ 34
9.8.2. “ERROR 1”, “ERROR 2”--------------------------- 34
9.8.2. “ERROR 1”, “ERROR 2”--------------------------- 34
10 Disassembly and Assembly Instructions -------------- 35
10.1. Handset ---------------------------------------------------- 35
10.2. Charger Unit ---------------------------------------------- 35
10.2. Charger Unit ---------------------------------------------- 35
11 Measurements and Adjustments -------------------------- 36
11.1. Check Procedure (Handset) -------------------------- 36
11.1.1. Preparation ------------------------------------------- 36
11.1.2. PC Setting -------------------------------------------- 36
11.1.2. PC Setting -------------------------------------------- 36
11.2. Adjustment (Handset) ---------------------------------- 38
11.2.1. Equipment Required ------------------------------- 38
11.2.2. The Setting Method of JIG------------------------ 38
11.2.3. Connections (Handset) ---------------------------- 38
11.2.2. The Setting Method of JIG------------------------ 38
11.2.3. Connections (Handset) ---------------------------- 38
12 Miscellaneous --------------------------------------------------- 41
12.1. Terminal Guide of the ICs Transistors and
Diodes ------------------------------------------------------ 41
12.1.1. Handset ----------------------------------------------- 41
12.2. How To Replace a Flat Package IC----------------- 42
12.2.1. Preparation ------------------------------------------- 42
12.2.2. Removal Procedure -------------------------------- 42
12.2.3. Procedure--------------------------------------------- 42
12.2.4. Removing Solder From Between Pins--------- 42
12.2.2. Removal Procedure -------------------------------- 42
12.2.3. Procedure--------------------------------------------- 42
12.2.4. Removing Solder From Between Pins--------- 42
12.3. How to Replace the LLP (Leadless Leadframe
Package) IC----------------------------------------------- 43
12.3.1. Preparation ------------------------------------------- 43
12.3.2. Caution ------------------------------------------------ 43
12.3.3. How to Remove the IC ---------------------------- 43
12.3.4. How to Install the IC-------------------------------- 43
12.3.5. How to Remove a Solder Bridge---------------- 44
12.3.2. Caution ------------------------------------------------ 43
12.3.3. How to Remove the IC ---------------------------- 43
12.3.4. How to Install the IC-------------------------------- 43
12.3.5. How to Remove a Solder Bridge---------------- 44
12.4. Memo ------------------------------------------------------- 45
13 Schematic Diagram -------------------------------------------- 46
13.1. Handset ---------------------------------------------------- 46
13.2. Charger----------------------------------------------------- 50
13.2. Charger----------------------------------------------------- 50
14 Printed Circuit Board------------------------------------------ 51
14.1. Handset ---------------------------------------------------- 51
14.1.1. Component View------------------------------------ 51
14.1.2. Bottom View------------------------------------------ 52
14.1.2. Bottom View------------------------------------------ 52
14.2. Charger----------------------------------------------------- 52
15 Appendix Information of Schematic Diagram -------- 53
16 Exploded View and Replacement Parts List----------- 54
16 Exploded View and Replacement Parts List----------- 54
16.1. IC Data ----------------------------------------------------- 54
16.1.1. IC1(APU)---------------------------------------------- 54
16.1.2. IC100 (DPU) ----------------------------------------- 56
16.1.2. IC100 (DPU) ----------------------------------------- 56
16.2. Cabinet and Electric Parts----------------------------- 59
16.2.1. Handset ----------------------------------------------- 59
16.2.2. Charger Unit------------------------------------------ 60
16.2.2. Charger Unit------------------------------------------ 60
16.3. Accessories and Packing Materials----------------- 61
16.4. Replacement Parts List -------------------------------- 62
16.4. Replacement Parts List -------------------------------- 62
16.4.1. Handset ----------------------------------------------- 62
16.4.2. Charger Unit------------------------------------------ 64
16.4.3. Accessories and Packing Materials ------------ 64
16.4.4. Fixtures and Tools ---------------------------------- 64
16.4.2. Charger Unit------------------------------------------ 64
16.4.3. Accessories and Packing Materials ------------ 64
16.4.4. Fixtures and Tools ---------------------------------- 64
3
KX-UDT111RU
1 Safety Precautions
1. Before servicing, unplug the AC power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,
injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
4
KX-UDT111RU
2 Warning
2.1.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50
°F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700
°F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
2.1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
2.2.
Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.