Panasonic KX-TES824UA / KX-TEM824UA / KX-TE82461X / KX-TE82474X / KX-TE82480X / KX-TE82483X / KX-TE82491X / KX-TE82492X / KX-TE82493X / KX-A227X / KX-TES824UAPP / KX-TEM824UAPP Service Manual ▷ View online
19.2. ACCESSORIES AND PACKING MATERIALS
60
19.3. MAIN BOARD PARTS
60
19.4. POWER SUPPLY BOARD PARTS
70
19.5. SUB BOARD PARTS
71
19.6. FIXTURES AND TOOLS
77
20 FOR THE SCHEMATIC DIAGRAM
78
21 SCHEMATIC DIAGRAM (KX-TES824UA/KX-TEM824UA)
80
21.1. MAIN No.1 (Extention A-D Block)
80
21.2. MAIN No.2 (Extention E-H Block)
84
21.3. MAIN No.3 (CO Block)
88
21.4. MAIN No.4 (Cross-Point Block)
92
21.5. MAIN No.5 (ASIC, Memory Block)
96
21.6. SUB
100
21.7. POWER SUPPLY
110
22 PRINTED CIRCUIT BOARD (KX-TES824UA/KX-TEM824UA) 114
22.1. MAIN BOARD
114
22.2. SUB BOARD
116
22.3. POWER SUPPLY
118
23 KX-TE82461X (4-PORT DOORPHONE CARD)
119
23.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
120
23.2. LOCATION OF OPTIONAL CARDS
121
23.3. DOORPHONE/DOOROPENER CARD BLOCK DIAGRAM
122
23.4. EXPLANATION OF BLOCK DIAGRAM/CIRCUIT
OPERATIONS
124
23.5. TROUBLESHOOTING GUIDE
125
23.6. IC DATA
126
23.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
127
23.8. ACCESSORIES AND PACKING MATERIALS
128
23.9. REPLACEMENT PARTS LIST (KX-TE82461X)
129
23.10. FOR THE SCHEMATIC DIAGRAM
131
23.11. SCHEMATIC DIAGRAM (KX-TE82461X)
132
23.12. PRINTED CIRCUIT BOARD (KX-TE82461X)
134
24 KX-TE82474X (8-PORT SLT EXTENSION CARD)
135
24.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
136
24.2. LOCATION OF OPTIONAL CARDS
137
24.3. BLOCK DIAGRAM
140
24.4. EXPLANATION OF BLOCK DIAGRAM
140
24.5. TROUBLESHOOTING GUIDE
147
24.6. IC DATA
149
24.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
150
24.8. CABINET AND ELECTRICAL PARTS
151
24.9. ACCESSORIES AND PACKING MATERIALS
151
24.10. REPLACEMENT PARTS LIST (KX-TE82474X)
152
24.11. FOR THE SCHEMATIC DIAGRAM
156
24.12. MEMO
157
24.13. SCHEMATIC DIAGRAM (KX-TE82474X)
158
24.14. PRINTED CIRCUIT BOARD (KX-TE82474X)
164
25 KX-TE82480X (2-PORT ANALOGUE CO LINE AND 8-PORT
SLT EXTENSION CARD)
166
25.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
167
25.2. LOCATION OF OPTIONAL CARDS
168
25.3. BLOCK DIAGRAM
172
25.4. EXPLANATION OF BLOCK DIAGRAM
172
25.5. CIRCUIT OPERATION
173
25.6. TROUBLESHOOTING GUIDE
183
25.7. IC DATA
186
25.8. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
187
25.9. CABINET AND ELECTRICAL PARTS
188
25.10. ACCESSORIES AND PACKING MATERIALS
188
25.11. REPLACEMENT PARTS LIST (KX-TE82480X)
189
25.12. FOR THE SCHEMATIC DIAGRAM
195
25.13. SCHEMATIC DIAGRAM (KX-TE82480X)
196
25.14. PRINTED CIRCUIT BOARD (KX-TE82480X)
204
26 KX-TE82483X (3-PORT ANALOGUE CO LINE AND 8-PORT
HYBRID EXTENSION)
206
26.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
207
26.2. LOCATION OF OPTIONAL CARDS
208
26.3. BLOCK DIAGRAM
210
26.4. EXPLANATION OF BLOCK DIAGRAM
210
26.5. CIRCUIT OPERATION
211
26.6. TROUBLESHOOTING GUIDE
222
26.7. IC DATA
225
26.8. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
227
26.9. CABINET AND ELECTRICAL PATRS
228
26.10. ACCESSORIES AND PACKING MATERIALS
228
26.11. REPLACEMENT PARTS LIST (KX-TE82483X)
229
26.12. FOR THE SCHEMATIC DIAGRAM
235
26.13. SCHEMATIC DIAGRAM (KX-TE82483X)
236
26.14. PRINTED CIRCUIT BOARD (KX-TE82483X)
246
27 KX-TE82491X (MESSAGE EXTENSION CARD FOR DISA/UCD
OGMs)
248
27.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
249
27.2. LOCATION OF OPTIONAL CARDS
250
27.3. BLOCK DIAGRAM
251
27.4. TROUBLESHOOTING GUIDE
252
27.5. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
253
27.6. ACCESSORIES AND PACKING MATERIALS
253
27.7. REPLACEMENT PARTS LIST (KX-TE82491X)
254
27.8. FOR THE SCHEMATIC DIAGRAM
255
27.9. SCHEMATIC DIAGRAM (KX-TE82491X)
256
27.10. PRINTED CIRCUIT BOARD (KX-TE82491X)
258
28 KX-TE82492X (2-CHANNEL VOICE MESSAGE CARD)
259
28.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
260
28.2. LOCATION OF OPTIONAL CARDS
261
28.3. BLOCK DIAGRAM
262
28.4. CIRCUIT OPERATIONS
263
3
KX-TES824UA / KX-TEM824UA /
28.5. TROUBLESHOOTING GUIDE
264
28.6. IC DATA
266
28.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
267
28.8. ACCESSORIES AND PACKING MATERIALS
267
28.9. REPLACEMENT PARTS LIST (KX-TE82492X)
268
28.10. FOR THE SCHEMATIC DIAGRAM
269
28.11. SCHEMATIC DIAGRAM (KX-TE82492X)
270
28.12. PRINTED CIRCUIT BOARD (KX-TE82492X)
272
29 KX-TE82493X (3-PORT CALLER ID CARD)
273
29.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
274
29.2. LOCATION OF OPTIONAL CARDS
275
29.3. BLOCK DIAGRAM
276
29.4. CIRCUIT OPERATIONS
276
29.5. TROUBLESHOOTING GUIDE
277
29.6. IC DATA
278
29.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES
280
29.8. ACCESSORIES AND PACKING MATERIALS
280
29.9. REPLACEMENT PARTS LIST (KX-TE82493X)
281
29.10. FOR THE SCHEMATIC DIAGRAM
283
29.11. SCHEMATIC DIAGRAM (KX-TE82493X)
284
29.12. PRINTED CIRCUIT BOARD (KX-TE82493X)
286
30 KX-A227X (BACK-UP BATTERY CABLE)
287
30.1. ACCESSORIES AND PACKING MATERIALS
288
30.2. REPLACEMENT PARTS LIST (KX-A227X)
289
4
KX-TES824UA / KX-TEM824UA /
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
•
•
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
•
•
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
5
KX-TES824UA / KX-TEM824UA /
1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED
6
KX-TES824UA / KX-TEM824UA /
