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• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,

injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with ohmmeter between the jumpered AC plug and each exposed metal cabinet part, such as

screw threads, control shafts, handle brackets, etc.
Note:

Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired

and rechecked before it is returned to the customer.

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1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the

manufacturer. Dispose of used batteries according to the manufacturer's lnstructions. 

2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location

when replacing it and soldering the replacement lithium battery in.

The power socket wall outlet should be located near this equipment and be easily accessible.

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder. 

• PbF solder has a melting point that is 50

° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-

ture control and adjust it to 700

° ± 20° F, (370° ± 10°C). 

Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100

°F, (600°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

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Control Bus

Original bus (16-bit, 24 MHz) 

Switching

Space Division CMOS Cross point Switch 

Power Input

100 V AC to 240 V AC, 1.5A to 0.75A, 50 Hz/60Hz 

External Battery

+24 V DC (+12 V DC x 2) 

Maximum Power Failure Tolerance

300 ms (without using backup batteries)

Memory Backup Duration

7 years

Dialling

Outside (CO) Line

Pulse (10 pps, 20 pps) or Tone (DTMF)

Extension

Pulse (10 pps, 20 pps) or Tone (DTMF)

Intercom Path

4

Mode Conversion

Pulse-DTMF

Ring Frequency 

20 Hz/25 Hz (selectable)

Operating Environment 

Temperature

0 

°C to 40 °C

Humidity 

10% to 90% (non-condensing)

Conference Call Outside (CO) Line

2

Music on Hold (MOH)

1 port
Selectable MOH: Internal/External/Tone

Paging

Internal

1

Extension

1 port

Serial Interface Port

RS-232C 

1

USB 1.1

1

Extension Connection Cable

SLT

1 pair wire (T, R)

PT

2-pair wire (T, R, H, L)

DSS Console

1-pair wire (H, L)

Dimension

368 mm (W) x 284 mm (H) x 102 mm (D)

Weight (when fully expanded)

Approx. 3.5 kg

Terminal Equipment Loop Limit

PT

40 

Ω

SLT

600 

Ω including set

Doorphone

20 

Ω

Minimum Leakage Resistance

15000 

Ω minimum

Maximum Number of Extension
Instruments per Line

1 PT or SLT in standard connection
1 PT and 1 SLT in parallel connection

Ring Voltage

75 Vrms at 20 Hz/25 Hz depending on the ringing load

Outside (CO) Line Loop Limit

1600 

Ω maximum

Hookswitch Flash/Recall Timing Range

24 ms-2032 ms

Door Opener Current Limit

30 V DC/125 V AC, 3 A maximum

Paging Terminal Impedance

600 

Ω

MOH Terminal Impedance

10000 

Ω 

8

Tone

Po

we

r Switch

D

P

H4 Card

 

BV2

BV1

DOOR1

DOOR2

BV Card

OGM

 Card

Se

ria

l

Flash

PI

O

CO

8

Int.C

ID

3

BV

2

BGM

1

DPH

2

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T

4

Pa

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in

g

2

Tone

2

DT

MF-R

2

DTMF-G

1

8port

Extension

Block

2port

Co

 

Blo

ck

PI

O

8port

Extension

Block

3port

Co

 

Blo

ck

PI

O

 

Cross Point

DTMF-R

8port

Extension

Block

3port

Co

 

Blo

ck

Cross Point

Flash

ROM

SRAM

CPU

DSP

 

SRAM

8Mbit

C

N

710

DSP

#2

DSP

#1

C

N

707

DPH Block #

1,

#2

PI

O

DPH Block #

3, #

4

CN7

08

CID Card #3

FP

G

A

PI

O

S/

P

FSK Detect 

x3

Jac

k x

8 

Cross Point

Jac

k x

2 

Jac

k x

8 

Jac

k x

3 

Jac

k x

8 

Jac

k x

3 

DTMF Detect 

Stutter Detect x3

CID

Card

#1

Same as 

CID

Card

#3

C

N

706

CN7

11

C

N

712

3AP

 Card

2AP

 Card

 

1AP

 Card

DTMF-G

for CO

CO1-3

ext1-8

C

O

4-6

ext

9-16

C

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7-8

ext

17-24

R

S

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Bel

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A

C

75V

25H

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CN

60

0

Ext Paging

Ext Music

CN

601

Ho

s

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AC

 IN

25H

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+1

5V

-15V

+3.

3V

2

2

USB

In

t. C

ID 

x 

3

BGM

MODEM(Rx, Tx)

OGM(Play, Rec) x2

V

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lt

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c

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k

R

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if

ica

ti

o

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R

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if

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battery

b

a

cku

p

cir

cu

it 

Over current

D

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tect cir

cuit

c

ontrol

cir

cu

it

V

o

lt

age 

c

hange

noi

s

e

 fi

lt

er

L

  N 

FG

 

Surge p

rotec

to

r

Ri

nger

Amp.

cir

cu

it

C

N

7

0

5

24

V

G

N

D

E

x

p

a

n

s

i

o

n

C

o

n

n

e

c

t

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r

E

x

p

a

n

s

i

o

n

C

o

n

n

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c

t

o

r

DT

MF-R

KX-TES824CA/KX-TEM824CA  System Block Diagram

+27V

POWER

SUPPLY

IC601

L1, L2

Z1

IC8

IC7

IC2A~C

IC1A~C

IC7

IC600, IC601, IC602

IC613

IC614

IC511

IC512

IC500

IC501

IC502

IC704

IC705

IC701

IC702

IC703

IC700

IC10

IC6

IC705

IC704

IC700

CN703

CN704

IC1

IC2

IC3

IC4

CID

Card

#2

Same as 

CID

Card

#3