Panasonic KX-TEA308RU / KX-TE82460X / KX-TE82492X / KX-TE82493X / KX-A227X Service Manual ▷ View online
PIN No
Pin Name
I/O
Function
184
DS3
O
Dial Shunt
185
SHUNT3
O
Receive Mute
186
PAD3
O
3dB PAD
187
BELLA3
I
Bell Detect A
188
BELLB3
I
Bell Detect B
189
LED_SW
O
LED ON
195
PAG_SW
O
External Paging Output
198
MOH_SW
O
External BGM Input
199
BREAK
O
Extension 15V Cutting
200
PDRLY
O
SW Relay for Power Down
201
BLRLY
O
BELL Cutting
202
BL_PWR
O
BELL Power Supply Control
203
NRESET
O
ALL Module Reset
94
USB_VBUS
I
Power Supply Surveillance
95
USB_PUP
O
Pullup Control
96
Reserve
I
-
97
NINT_DC
I
DC Power Supply Surveillance Signal
98
SEL
I
Selection Signal
99
OUT232C
O
RS-232C Control
100
IN232C
I
RS-232C State Surveillance
103
Reserve
I
-
45
KX-TEA308RU
13.2. IC7
PIN No
Pin Name
I/O
Function
3
HOOK 8
I
Ext Hook Detect 8
4
HOOK 7
I
Ext Hook Detect 7
7
HOOK 6
I
Ext Hook Detect 6
8
HOOK 5
I
Ext Hook Detect 5
13
HOOK 4
I
Ext Hook Detect 4
14
HOOK 3
I
Ext Hook Detect 3
17
HOOK 2
I
Ext Hook Detect 2
18
HOOK 1
I
Ext Hook Detect 1
13.3. IC8
PIN No
Pin Name
I/O
Function
2
BELL8
O
Ext BELL Control 8
5
BELL7
O
Ext BELL Control 7
6
BELL6
O
Ext BELL Control 6
9
BELL5
O
Ext BELL Control 5
12
BELL4
O
Ext BELL Control 4
15
BELL3
O
Ext BELL Control 3
16
BELL2
O
Ext BELL Control 2
46
KX-TEA308RU
14 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES
47
KX-TEA308RU
15.1. PREPARATION
•
•
•
• PbF (: Pb free) Solder
•
•
•
• Soldering Iron
Tip Temperature of 700°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where
someone with less experience could overheat and damage
the PCB foil.
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where
someone with less experience could overheat and damage
the PCB foil.
•
•
•
• Flux
Recommended Flux: Specific Gravity
→ 0.82.
Type
→ RMA (lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free)
(P.4).
(P.4).
15.2. REMOVAL PROCEDURE
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with a
cutter.
pressure to the P.C. board when cutting the pins with a
cutter.
2. Make a few cuts into the joint (between the IC and its pins)
first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
attached properly.
15.3. INSTALLATION PROCEDURE
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on the
PCB.
PCB.
Be certain each pin is located over the
correct pad on the PCB.
correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the
soldering iron along the tips of the pins while feeding
enough solder to the tip so that it flows under the pins as
they are heated.
enough solder to the tip so that it flows under the pins as
they are heated.
15.4. REMOVING SOLDER FROM
BETWEEN PINS
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part of
2. With a hot iron, use a sweeping motion along the flat part of
the pin to draw the solder from between the adjacent pads.
15 HOW TO REPLACE A FLAT PACKAGE IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount),
a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
a soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
48
KX-TEA308RU
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