DOWNLOAD Panasonic KX-TDE620BX (serv.man2) Service Manual ↓ Size: 3.45 MB | Pages: 93 in PDF or view online for FREE

ORDER NO. KMS0811605CE

(for Asia, Oceania, Middle Near Esat, Africa 
and Latin America)

2

PAGE

PAGE

1 Safety Precautions -----------------------------------------------3

1.1. For Service Technicians  ---------------------------------3
1.2. Insulation Resistance Test -------------------------------3

2 Warning --------------------------------------------------------------3

2.1. Battery Caution ---------------------------------------------3
2.2. Caution--------------------------------------------------------3
2.3. Discarding of P. C. Board --------------------------------3
2.4. About Lead Free Solder (PbF: Pb free) --------------4

2.4.1. Suggested PbF Solder -------------------------------4

3 Specifications ------------------------------------------------------5

3.1. General Description ---------------------------------------5
3.2. Characteristics ----------------------------------------------5

4 Technical Descriptions------------------------------------------6

4.1. BUS-S Block Diagram ------------------------------------6
4.2. BUS-S Card Circuit Operation --------------------------7

4.2.1. BUS-S CARD-------------------------------------------7

4.3. Back Board Circuit Operation ------------------------- 11
4.4. Outline ------------------------------------------------------ 12

4.4.1. Genral Description ---------------------------------- 12
4.4.2. BUS-S Card------------------------------------------- 12
4.4.3. Back Board-------------------------------------------- 12
4.4.4. Power Supply Unit ---------------------------------- 12
4.4.5. System Control--------------------------------------- 13
4.4.6. Back Board Signal Connection Diagram ------ 16

5 Location of Controls and Components------------------ 19

5.1. Names and Locations----------------------------------- 19

6 Installation Instructions--------------------------------------- 20

6.1. System Configurations---------------------------------- 20
6.2. Expanded System---------------------------------------- 21
6.3. System Capacity ----------------------------------------- 24

7 Troubleshooting Guide---------------------------------------- 25

7.1. BUS-S Card ----------------------------------------------- 25

8 Service Fixture & Tools --------------------------------------- 31
9 Disassembly and Assembly Instructions--------------- 32

9.1. BUS-S Card ----------------------------------------------- 32
9.2. Back Board ------------------------------------------------ 33

10 Miscellaneous ---------------------------------------------------- 35

10.1. How To Replace a Flat Package IC ----------------- 35

10.1.1. Preparation-------------------------------------------- 35
10.1.2. Removal Procedure--------------------------------- 35
10.1.3. Procedure --------------------------------------------- 35
10.1.4. Removing Solder From Between Pins --------- 35

10.2. Terminal Guide of the ICs Transistors and

Diodes------------------------------------------------------- 36

11 Schematic Diagram--------------------------------------------- 37

11.1. Block Diagram -------------------------------------------- 37
11.2. BUS-S Card No.1 ---------------------------------------- 38
11.3. BUS-S Card No.2 ---------------------------------------- 42
11.4. BUS-S Card No.3 ---------------------------------------- 46
11.5. BUS-S Card No.4 ---------------------------------------- 50
11.6. BUS-S Card No.5 ---------------------------------------- 52
11.7. BUS-S Card No.6 ---------------------------------------- 54
11.8. BUS-S Card No.7 ---------------------------------------- 56
11.9. BB-EXP Card No.1 -------------------------------------- 58

11.10. BB-EXP Card No.2 -------------------------------------- 60

11.11. BB-EXP Card No.3 -------------------------------------- 62

11.12. Waveform -------------------------------------------------- 64

12 Printed Circuit Board ------------------------------------------ 65

12.1. BUS-S Board --------------------------------------------- 65

12.1.1. Component View------------------------------------ 65

12.2. BB-EXP Board-------------------------------------------- 66

12.2.1. Component View------------------------------------ 66

13 Appendix Information of Schematic Diagram -------- 67
14 Exploded View and Replacement Parts List----------- 68

14.1. IC Data ----------------------------------------------------- 68

14.1.1. CPU (IC200) ----------------------------------------- 68
14.1.2. ASIC (IC101)----------------------------------------- 72
14.1.3. SYSTEM TSW (IC501) ---------------------------- 76
14.1.4. CIRCLINK (IC401)---------------------------------- 80
14.1.5. FPGA (IC402)---------------------------------------- 82

14.2. Cabinet and Electric Parts----------------------------- 84
14.3. Accessories and Packing Materials----------------- 86
14.4. Replacement Parts List -------------------------------- 87

14.4.1. Cabinet and Electrical Parts---------------------- 87
14.4.2. Accessories and Packing Materials ------------ 87
14.4.3. Main Board Parts ----------------------------------- 88
14.4.4. Back/LED Board Parts----------------------------- 93
14.4.5. Tools---------------------------------------------------- 93

3

• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,

injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with ohmmeter between the jumpered AC plug and each exposed metal cabinet part, such as

screw threads, control shafts, handle brackets, etc.
Note:

Some exposed parts may be isolated from the chassis by design. These will read infinity.

4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired

and rechecked before it is returned to the customer.

1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the

manufacturer. Dispose of used batteries according to the manufacturer's lnstructions. 

2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location

when replacing it and soldering the replacement lithium battery in.

The power socket wall outlet should be located near this equipment and be easily accessible.

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.

4

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder. 

• PbF solder has a melting point that is 50

° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-

ture control and adjust it to 700

° ± 20° F, (370° ± 10°C). 

Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100

°F, (600°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.