Panasonic KX-TDE0105XJ Service Manual ▷ View online
9
KX-TDE0105XJ
7 Troubleshooting Guide
10
KX-TDE0105XJ
8 Miscellaneous
8.1.
How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
8.1.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
• Soldering Iron
Tip Temperature of 700
°F ± 20°F (370°C ± 10°C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity
→ 0.82.
Type
→ RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4).
8.1.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
8.1.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
solder to the tip so that it flows under the pins as they are
heated.
8.1.4.
Removing Solder From Between
Pins
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
pads.
11
KX-TDE0105XJ
8.2.
Terminal Guide of the ICs Transistors and Diodes
12
KX-TDE0105XJ
9 Schematic Diagram
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(9)
(10)
(11)
(12)
(13)
(15)
(14)
(16)
(17)
(18)
(19)
(20)
(21)
(22)
(23)
(36)
(24)
(25)
(26)
(27)
(28)
(29)
(30)
(31)
(32)
(33)
(34)
(35)
(38)
(37)
(40)
(39)
(42)
(44)
(44)
(46)
(41)
(43)
(45)
(49)
(48)
(47)
(51)
(50)
(53)
(52)
(55)
(57)
(54)
(56)
(58)
(59)
(60)
(60)
(61)
(62)
(63)
KX-TDE0105
XJ IPCMEC CARD (1/2)
C
E
B
A
D
F
3
2
1
EX1_D[0-15]
EX1_A[17]
EX1_A[23]
EX1_A[21]
EX1_A[19]
EX1_A[21]
EX1_A[19]
EX1_D[1]
EX1_D[3]
EX1_D[7]
EX1_D[5]
EX1_D[5]
EX1_D[11]
EX1_D[15]
EX1_D[13]
EX1_D[13]
EX1_D[9]
EX1_A[15]
EX1_A[9]
EX1_A[11]
EX1_A[13]
EX1_A[7]
EX1_A[1]
EX1_A[3]
EX1_A[5]
EX1_A[18]
EX1_A[19]
EX1_A[1]
EX1_A[21]
EX1_A[16]
EX1_A[15]
EX1_A[14]
EX1_A[13]
EX1_A[12]
EX1_A[15]
EX1_A[14]
EX1_A[13]
EX1_A[12]
EX1_A[10]
EX1_A[17]
EX1_A[11]
EX1_A[7]
EX1_A[5]
EX1_A[20]
EX1_A[3]
EX1_A[8]
EX1_A[6]
EX1_A[4]
EX1_A[2]
EX1_A[9]
EX1_A[1-22]
EX1_D[4]
EX1_A[9]
EX1_A[1]
EX1_A[1]
EX1_A[11]
EX1_D[2]
EX1_A[19]
EX1_D[12]
EX1_D[5]
EX1_A[18]
EX1_A[16]
EX1_A[17]
EX1_D[13]
EX1_A[21]
EX1_A[10]
EX1_D[8]
EX1_D[3]
EX1_A[2]
EX1_D[6]
EX1_A[4]
EX1_D[7]
EX1_A[12]
EX1_A[6]
EX1_A[13]
EX1_D[10]
EX1_A[14]
EX1_A[8]
EX1_D[15]
EX1_D[1]
EX1_A[15]
EX1_A[3]
EX1_D[11]
EX1_A[20]
EX1_D[9]
EX1_A[5]
EX1_D[0]
EX1_A[7]
EX1_D[14]
SRAM_nBC1
EX1_A[22]
nRESET
C5009 100n 16
DL5002
1
2
3
CL5008
CL5018
C5006
100n
16
CL5011
CL5019
CL5013
CL5020
C5008 100n 16
C5002 10u 10
CL5001
CL5010
CL5021
IC5006
Mount
1 B
2
A
3
GND
5
VCC
4
Y
CL5012
CL5002
TP_+3.3VD_B_MAIN
IC5004
Mount
1 NC
2
A
3
GND
5
VCC
4
Y
CL5003
CL5097
CL5004
CL5099
TP_+3.3VD_B
CL5005
CL5014
CL5098
TP_DG_1
CL5007
CL5015
IC5003
Mount
1
A15
2
A14
3
A13
4
A12
5
A11
6
A10
7
A9
8
A8
9
A19
10
NC
11
*WE
12
CS2
13
NU
14
*UB
15
*LB
16
A18
17
A17
18
A7
19
A6
20
A5
21
A4
22
A3
23
A2
24
A1
25
A0
26
*CS1
27
VSS1
28
*OE
29
IO0
30
IO8
31
IO1
32
IO9
33
IO2
34
IO10
35
IO3
36
IO11
37
VCC
38
IO4
39
IO12
40
IO5
41
IO13
42
IO6
43
IO14
44
IO7
45
IO15/A-1
46
VSS2
47
*BYTE
48
A16
C5007 100n 16
TP_DG_2
R5017
0
No Mount
CL5009
CL5016
CL5006
IC5005
Mount
1 B
2
A
3
GND
5
VCC
4
Y
CL5017
DG
DG
DG
DG
DG
DG
DG
+3.3VD_B
+3.3VD_B
+3.3VD
+3.3VD
+3.3VD
SRAM
4
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