Panasonic KX-TDA6181X Service Manual ▷ View online
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
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1.1.
SUGGESTED PBF SOLDER
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1.2.
HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
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2 FOR SERVICE TECHNICIANS
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3 GENERAL DESCRIPTION
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4 SPECIFICATION
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5 SYSTEM CONSTRUCTION
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5.1.
INSTALLING/REMOVING THE OPTIONAL SERVICE
CARDS
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6 BLOCK DIAGRAM
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7 CIRCUIT OPERATIONS
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7.1.
CONTROL-SYSTEM CIRCUIT
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7.2.
DESCRIPTION OF FUNCTIONS AND CIRCUITS
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7.3.
POWER SUPPLY CIRCUIT
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8 TROUBLESHOOTING GUIDE
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9 IC DATA
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9.1.
IC3 (ASIC)
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9.2.
IC6 (CODEC)
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9.3.
IC7 (CODEC)
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9.4.
IC9 (CODEC)
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9.5.
IC10 (CODEC)
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9.6.
IC601 (CPU) I/O MAP
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10 HOW TO REPLACE A FLAT PACKAGE IC
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10.1. PREPARATION
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10.2. REMOVAL PROCEDURE
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10.3. INSTALLATION PROCEDURE
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10.4. REMOVING SOLDER FROM BETWEEN PINS
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11 TERMINAL GUIDE OF ICs, TRANSISTORS AND DIODES
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12 CABINET AND ELECTRICAL PARTS LOCATION
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13 ACCESSORIES AND PACKING MATERIAL
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14 REPLACEMENT PARTS LIST
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14.1. CABINET AND ELECTRICAL PARTS LOCATION
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14.2. ACCESSORIES AND PACKING MATERIALS
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14.3. MAIN BOARD PARTS
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15 FOR SCHEMATIC DIAGRAM
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15.1. WAVEFORM
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15.2. ELCOT16 BLOCK DIAGRAM
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16 SCHEMATIC DIAGRAM
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16.1. No.1
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16.2. No.2
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16.3. No.3
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16.4. No.4
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17 PRINTED CIRCUIT BOARD
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17.1. COMPONENT VIEW
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17.2. BOTTOM VIEW
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CONTENTS
Page
Page
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KX-TDA6181X
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
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• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
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• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
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• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
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• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PBF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
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KX-TDA6181X
1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED
4
KX-TDA6181X
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic part´s boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch the IC or LSI pins with bare fingers.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic part´s boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch the IC or LSI pins with bare fingers.
3 GENERAL DESCRIPTION
This card is inserted in the free slot of the TDA600 system and is capable of connecting 16 analog loop start lines.
Up to 2 CALLER ID/PAYTONE card can be added on as option cards.
The LPR is an SH-1 (SH7020) with 512Kbyte flash ROM and 128Kbyte SRAM, and supports software version upgrade though
downloading.
Up to 2 CALLER ID/PAYTONE card can be added on as option cards.
The LPR is an SH-1 (SH7020) with 512Kbyte flash ROM and 128Kbyte SRAM, and supports software version upgrade though
downloading.
4 SPECIFICATION
Functional Block
Functional contents
Analog External Line Interface
Number of Ports
16 ports
Main Function
+30V 30mA Feeding function
Dial Pulse Signal Transmission Function
DTMF Signal Transmission Function
Inversion Detection Function
Bell Detecting Function
Ring-off Signal Detection Function
2w/4w Conversion Function
Surge Protection Function
Returning Sound Generation Function
4ch CODEC Function
Dial Pulse Signal Transmission Function
DTMF Signal Transmission Function
Inversion Detection Function
Bell Detecting Function
Ring-off Signal Detection Function
2w/4w Conversion Function
Surge Protection Function
Returning Sound Generation Function
4ch CODEC Function
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• CODEC function
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• Power down function
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• µ/A Iaw switching function
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• Test function (Loop back, Tone generation)
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• Programmable digital filtering function
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• Serial interface function
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• PIO function
DTMF Generator
Transmits arbitrary tones for every 16 line port
Option Card
Can be installed two CO-CID/PT cards for eight lines
On-board DC/DC Power Supply
Input +15V
Output +15V, +5V, +3.3V
Output +15V, +5V, +3.3V
Power Failure Forwarding Function
Supports four lines
Self-diagnosis Function
Performed with the extension interface in pairs
Channel Test, Dial Pulse Test, DTMF Test
Channel Test, Dial Pulse Test, DTMF Test
ASIC#2 (eSAMSON)
EC Bus interface function
H.100 Bus interface function, Digital PLL function
Local Bus interface function
Time Switch Function, Gain Control Function
Intelligent PIO Function, JTAG
H.100 Bus interface function, Digital PLL function
Local Bus interface function
Time Switch Function, Gain Control Function
Intelligent PIO Function, JTAG
Control Unit
CPU
SH-1/SH7020 (12.288MHz)
Flash ROM
512Kbyte
SRAM
128Kbyte
LED Display Circuit
Card Status Display LED: 2-color (red/green)
External Interface Connector
External Line Interface
50pin Amphenol Connector: 1 unit
Power Failure Transfer
4pin Modular Jack: 2 units
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KX-TDA6181X