DOWNLOAD Panasonic KX-TDA6178X / KX-TDA6178XJ Service Manual ↓ Size: 2.85 MB | Pages: 67 in PDF or view online for FREE

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• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent fires,

injury or electric shock, which can be caused by improper repair work.

1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.

• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.

1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder. 

• PbF solder has a melting point that is 50

° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-

ture control and adjust it to 700

° ± 20° F, (370° ± 10°C). 

Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100

°F, (600°C).

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the

opposite side (See figure, below).

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other 
materials. 
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

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This card is plugged into a free slot on the TDA600 systems and randomly connects up to 24 SLT devices.
Can only be installed in shelves in which a PSU-L is intalled.
This card sends Caller ID signal to extension ports.
The LPR is SH-1(SH7020), and the memory is composed of a 512K byte Flash ROM and a 128K byte SRAM.
It also supports a software upgrade by downloading the latest version.

Functional Block

Functional contents

Extension Interface

Number of Ports

24 ports

SLT Interface

-26V 26mA Feeding function
(Voltage in ports 1-8 are switched over to -45V, depending on the circuit dis-
tance.)
Dial-pulse signal detecting function
DTMF signal detecting function
Bell signal issuing function
Hook detecting function
Ringtrip detecting function
2W/4W converting function
Surge protective function
CODEC function

• Test function (Loop back, Tone generation)
• Programmable digital filtering function
• Serial interface function
• PIO function

DTMF Receiver

24 lines for each port

Caller ID (FSK)

24 lines for each port

On-board Ringer

20/25Hz 75Vrms
Phase control (Three-phase / Four-phase)

On-board DC/DC Power Supply

Input +15V
Output +3.3V
Input +40V
Output: -30V, -55V, +80V

Power Failure Forwarding Function

4 lines supported

Self-Diagnostic Function

Carried out with outside-line interface in a pair (only one port)
Speech path test, Dial pulse test, DTMF test

ASIC

EC bus interface function
H.100 bus interface function, Digital PLL function
Local bus interface function
Time switch function, Gain controlling function, FIFO/DPRAM function
Intelligent PIO function

Control Unit

CPU

SH-1/SH7020 (12.288MHz)

Flash ROM

512Kbyte

SRAM

128Kbyte

FPGA

• Interface between codec and CPU
• SRAM type (XC3S250E) manufactured by XILINX
• CID128 bytes /ch transmission buffer 

LED Display Circuit

Card status indicating LED: Two colors (Red/Green)

External Interface Connector

Extension interface

50pin Amphenol connector: 1

Power failure forwarding 4pin modular jack: 2

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KX-TDA6178X/KX-TDA6178XJ BLOCK DIAGRAM

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6

• CPU (System clock: 12.288 MHz)......IC601

Data bus: 16bit, Address bus: 23bit

• Flash ROM (512Kbyte)......IC602

Flash memory consists of two areas: boot space and administration space.
Administration program can be rewritten through downloading.

• SRAM (1Mbit)......IC603

Used for the data buffer for CPU work area, and SLT communication.

• Reset

Resets of an ECSLC24 card are roughly classified into the two kinds: ASIC reset and LPR reset.
After the release of the ASIC reset, the LPR reset is released by the soft reset from the side of the main card and the LPR pro-
gram is booted.
For approx. 1 second after LPR reset until the Config reset signal (Done pin) in FPGA is cancelled, access to FPGA is
restricted.First check configuration in FPGA is complete, then start accessing.

Type of reset

Reset method

Specification

ASIC reset

ASIC reset is reset under the AND condition of reset signals (negative logic)
listed below.

Power-on reset

Reset by reset IC

Hard reset from the main bus

Reset by EC_RST signal

Soft reset from the main bus

Released after the specified time

LPR reset

Soft reset from the main bus

Low active
Reset pulse width: 1.6 microseconds or more