Panasonic KX-TDA6110XJ / KX-TDA6110X Service Manual ▷ View online
KX-TDA6110XJ
KX-TDA6110X
(for Europe, Asia Oceania, Middle Near East, Latin
America, Russia and Africa)
Bus Master Card
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear please read and follow the special instructions described in this manual on the use of PbF and how
it might be permissible to use Pb solder during service and repair work.
it might be permissible to use Pb solder during service and repair work.
ORDER NO. KMS0510141CE
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
3
1.1.
SUGGESTED PbF SOLDER
3
1.2.
HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED
4
2 FOR SERVICE TECHNICIANS
4
3 GENERAL DESCRIPTION
4
4 BUS-M CARD HARDWARE FUNCTION SPECIFICATION
5
5 SYSTEM CONSTRUCTION
6
5.1.
INSTALLING/REMOVING THE OPTIONAL SERVICE
CARDS
7
6 BLOCK DIAGRAM
13
6.1.
BLOCK DISCRIPTION
14
6.2.
DESCRIPTION OF THE SIGNAL OF BUS-M
15
7 TROUBLESHOOTING GUIDE
17
7.1.
START UP
17
7.2.
CONNECTION BETWEEN SHELVES
20
8 IC DATA
25
8.1.
FPGA (IC614)
25
8.2.
PROM (IC210)
28
8.3.
CTSW (IC101)
29
8.4.
CIRCLINK (IC301)
34
9 HOW TO REPLACE A FLAT PACKAGE IC
37
9.1.
PREPARATION
37
9.2.
REMOVAL PROCEDURE
37
9.3.
INSTALLATION PROCEDURE
37
9.4.
REMOVING SOLDER FROM BETWEEN PINS
37
10 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES
38
11 CABINET AND ELECTRICAL PARTS LOCATION
39
12 ACCESSORIES AND PACKING MATERIALS
40
13 REPLACEMENT PARTS LIST
41
13.1. CABINET AND ELECTRICAL PARTS LOCATION
41
13.2. ACCESSORIES AND PACKING MATERIALS
41
13.3. MAIN BOARD PARTS
41
14 FOR SCHEMATIC DIAGRAM
45
14.1. WAVEFORM
46
14.2. BUS-M BLOCK DIAGRAM
47
15 SCHEMATIC DIAGRAM
48
15.1. No.1
48
15.2. No.2
50
15.3. No.3
54
15.4. No.4
56
15.5. No.5
58
16 PRINTED CIRCUIT BOARD
60
16.1. Component View
60
CONTENTS
Page
Page
2
KX-TDA6110XJ / KX-TDA6110X
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
contains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
•
•
•
• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
be careful not to heat too long.
•
•
•
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
•
•
•
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
•
•
•
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
3
KX-TDA6110XJ / KX-TDA6110X
1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED
2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
3 GENERAL DESCRIPTION
This card (BUS-M card) is mounted in the BUS-M slot of TDA600´s basic shelf.
It has a function to operate TDA620 expansion shelves as one PBX by connecting them with a inter-shelf connecting cable. One
BUS-M card can be connected with one expansion shelf and the number of connected shelves can be increased up to 3 by
mounting an interface expansion card (BUS-ME card).
It has a function to operate TDA620 expansion shelves as one PBX by connecting them with a inter-shelf connecting cable. One
BUS-M card can be connected with one expansion shelf and the number of connected shelves can be increased up to 3 by
mounting an interface expansion card (BUS-ME card).
4
KX-TDA6110XJ / KX-TDA6110X