Panasonic KX-TDA0158CE Service Manual ▷ View online
2
KX-TDA0158CE
TABLE OF CONTENTS
PAGE
PAGE
1 Safety Precautions -----------------------------------------------3
1.1. For Service Technicians ----------------------------------3
1.2. Caution--------------------------------------------------------3
1.2. Caution--------------------------------------------------------3
2 Warning --------------------------------------------------------------3
2.1. About Lead Free Solder (PbF: Pb free) --------------3
3 Specifications ------------------------------------------------------4
4 Technical Descriptions------------------------------------------5
4 Technical Descriptions------------------------------------------5
4.1. Block Diagram ----------------------------------------------5
4.2. Hardware Description -------------------------------------6
4.2. Hardware Description -------------------------------------6
5 Installation Instructions--------------------------------------- 11
5.1. Connecting the Cell Station to the Hybrid IP-
PBX ---------------------------------------------------------- 11
5.2. Connection the CS--------------------------------------- 12
5.3. CS Login Mode ------------------------------------------- 13
5.3. CS Login Mode ------------------------------------------- 13
6 Troubleshooting Guide---------------------------------------- 16
7 Disassembly and Assembly Instructions--------------- 18
7 Disassembly and Assembly Instructions--------------- 18
7.1. Disassembly Instructions------------------------------- 18
8 Measurements and Adjustments -------------------------- 19
8.1. Version Check and CSID Writing--------------------- 19
8.2. Adjustment for Main Part------------------------------- 21
8.3. Measurement and Adjustment for RF Part -------- 23
8.2. Adjustment for Main Part------------------------------- 21
8.3. Measurement and Adjustment for RF Part -------- 23
9 Miscellaneous ---------------------------------------------------- 26
9.1. Terminal guide of ICs, Transistors and Diodes --- 26
9.2. How To Replace a Flat Package IC ----------------- 27
9.2. How To Replace a Flat Package IC ----------------- 27
10 Schematic Diagram--------------------------------------------- 28
10.1. Main Board------------------------------------------------- 28
10.2. Waveform -------------------------------------------------- 32
10.2. Waveform -------------------------------------------------- 32
11 Printed Circuit Board ------------------------------------------ 34
11.1. Component View ----------------------------------------- 34
11.2. Bottom View ----------------------------------------------- 35
11.2. Bottom View ----------------------------------------------- 35
12 Appendix Information of Schematic Diagram --------- 36
13 Exploded View and Replacement Parts List ----------- 37
13 Exploded View and Replacement Parts List ----------- 37
13.1. IC Data------------------------------------------------------ 37
13.2. Cabinet and Electrical Parts Location--------------- 44
13.3. Accessories and Packing Material------------------- 45
13.4. Replacement Parts List --------------------------------- 46
13.2. Cabinet and Electrical Parts Location--------------- 44
13.3. Accessories and Packing Material------------------- 45
13.4. Replacement Parts List --------------------------------- 46
3
KX-TDA0158CE
1 Safety Precautions
1.1.
For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-
vent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
1.2.
Caution
When you note the serial number, write down all of the 11 digits.
The serial number may be found on the label affixed to the bottom of the unit.
The serial number may be found on the label affixed to the bottom of the unit.
2 Warning
2.1.
About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
tains lead.
We will use PbF when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn), Silver,
(Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50
° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700
° ± 20° F, (370° ± 10°C).
Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100
°F, (600°C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
4
KX-TDA0158CE
2.1.1.
Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac
turer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
3 Specifications
Item
Description
Radio Access Method
Multi Carrier TDMA-TDD
Frequency Band
1880 MHz to 1900 MHz*
1
(*
1
The number may vary depending on the country /area . In Taiwan, it is
1880 MHz to 1895 MHz.)
Number of Carriers
10*
2
(*
2
The number may vary depending on the country /area . In Taiwan, it is 8.)
Carrier Spacing
1728 kHz
Bit Rate
1152 kbps
Carrier Multiplex
TDMA, 24 (Tx12, Rx12) slots per frame
Frame Length
10 ms
Modulation Scheme
GFSK
Roll-off factor=0.5 50% roll-off in the transmitter
Roll-off factor=0.5 50% roll-off in the transmitter
Data Coding for Modulator
Differential Coding
Voice CODEC
32 kbps ADPCM (CCITT G.721)
Transmission Output
Average 10 mW
Peak 250 mW
Peak 250 mW
Operating conditions
0-40
°C, 20-80% relative air humidity (not condensing)
Operation range
Up to 300 m outdoors, Up to 50 m indoors
Dimension
Cell Station 164 (L) mm
× 133 (W) mm × 36 (D) mm (5
1
/
2
× 6
25
/
32
× 1
11
/
32
)
Weight
about 280 g
5
KX-TDA0158CE
4 Technical Descriptions
4.1.
Block Diagram
4.1.1.
Main Board
FP
G
A
IC
103
FLA
S
H
R
O
M
(3
2
M
b
it)
IC
101
AD
2
3
-A
D
1
DA
B
1
5
-DA
B
0
RE
S
E
T
FP
G
A
BBI
C
IC
100
R
F
o
u
t/i
n
R
F
M
odul
e
IC
8
0
0
R
SSI
,R
XD
A
AN
T
1
AN
T
2
A
n
tenna 1
A
n
te
nna 2
D
800
(A
nt
enna S
w
it
c
h
)
X
100
(10.
368M
H
z
)
IC
201
2.
5V
R
eg.
D1
R8
V
D3
R2
V
LD
O
1
LD
O
2
A
d
d
ress/
D
a
ta
B
u
s
F-
R
S
T
D3
R2
V
DC/
DC
C
onv
er
te
r I
C
IC
203 5.
5V
D5
R5
V
RF
_
V
P
C
M
I/F
FS
C
0
FS
C
1
PC
M
I
/F
D1
R2
V
X
101
(16.
384M
H
z
)
S
RAM
(2
M
b
it)
IC
102
AC
S0
AC
S1
UT
X
URX
C
N
101
T
e
s
t m
ode
s
o
ft
w
ar
e D
.L.
c
onnec
to
r
Re
d
PA[
0
]
RF
_
V
AC
S2
AC
S2
/C
S
1
D1
R2
V
D1
R8
V
D3R2V
D3
R2
V
D3
R2
V
Q
200
Q
210
S
P
I I/F
C
N
102
SPI
i
/f
c
o
nnec
to
r
SPI
D
O
SPI
C
L
K
SPI
D
I
C
N
103
(10p
in
)
Q
201
C
231,
232,
233
1.
0F
×
3
/C
E
D
C
/D
C
out
put
vo
lt
age c
ont
ro
l
C
N
100
P
D
R
1
[3
:0
]
S
tar
t-
up
c
ont
ro
l
ci
rc
u
it
ADP
CM
Tr
an
sco
d
e
r
IC
1
0
7
Ec
h
o
can
cel
le
r
IC
1
0
6
PA[
1
]
R
F
o
u
t/i
n
R
F
M
odul
e
IC
8
0
1
Tx
D
A
SK
SO
LE
P2
[2
]
D3
R2
V
G
reen
Q
701
D3
R2
V
P2
[5
]
RF
_
V
PA_
V
PA_
V
GA2R5V
nC
S
DA
T
A
DCL
K
ASD
I
VC
C
GN
D
H
T
ran
s.
T
100
+
D3
R2
V
-
D3
R2
V
L
H
T
ran
s.
T
101
+
D3
R2
V
-
L
H
T
ran
s.
T
102
+
D3
R2
V
-
L
H
T
ran
s.
T
103
+
D3
R2
V
-
L
+
PAO
N
RF
CL
K
RX
DS
G
P
D
R
0
[3
:0
]
PD
X1
[3
:0
]
PD
X0
[3
:0
]
Q
211
SC
L
K
Q
700
S
W
100
D
IP SW
(6bi
t)
IC
204
2.
5V
R
eg.
G
A
2R
5V
IC
200
1.
2V
R
eg.
IC
202
2.
18V
R
eg.
PA_
V
KX-TD
A0158CE :
BLOCK DIA
GRAM
