Panasonic KX-T7565RU Service Manual ▷ View online
EP2
9
KEY INPUT (KEY ON)
13
INT RX, INT TX
10
KEY SIGNAL
14
A0, A1, IOR, IOW
11
16.384MHz
15
D0, D1, D2, D3
12
8MHz
16
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KX-T7565RU
10 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES
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KX-T7565RU
11 HOW TO REPLACE THE FLAT PACKAGE IC
If you do not have the special tools (for example: SPOT HEATER) to remove the SPOT HEATER’S Flat IC, If you have solder
(large amount) a soldering iron and a cutter knife, you can easily remove IC’s even though large than 100 pin.
(large amount) a soldering iron and a cutter knife, you can easily remove IC’s even though large than 100 pin.
11.1. PREPARATION
·
SOLDER
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
Sparkle Solder 115A-1, 115B-1 or Almit Solder KR-19, KR-19RMA
·
Soldering iron
Recommended power consumption is between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle a 60~80 W iron, but beginner might damage foil by overheating.)
Recommended power consumption is between 30 W to 40 W.
Temperature of Copper Rod 662 ± 50°F (350 ± 10°C)
(An expert may handle a 60~80 W iron, but beginner might damage foil by overheating.)
·
Flux
HI115 Specific gravity 0.863
(Original flux should be replaced daily.)
HI115 Specific gravity 0.863
(Original flux should be replaced daily.)
11.2. FLAT PACKAGE IC REMOVE PROCEDURE
1. When all of the IC lead can not been seen at the standard degree, fill with large quantities of solder.
Note:
If you do not fill with solder and directly cut the IC lead with the cutter, stress may build up directly in the P.C.board’s pattern.
If you do not fill with large quantities of solder as in step 1 the P.C.board pattern may be removed.
If you do not fill with large quantities of solder as in step 1 the P.C.board pattern may be removed.
2. Using a cutter, cut the lead at the source. (Cut the contents with the cutter lightly 5 or 6 times.)
3. Remove when the solder melts. (Remove the lead at the same time.)
After removing the Flat IC and when attaching the new IC, remove any of the excess solder on the land using the soldering wire,
etc. If the excess solder is not removed from the land, the IC will slip and not be attached properly.
etc. If the excess solder is not removed from the land, the IC will slip and not be attached properly.
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11.3. FLAT PACKAGE IC INSTALLATION PROCEDURE
1. Temporary fix FLAT PACKAGE IC by soldering on two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux for all pins of FLAT PACKAGE IC.
3. Solder using the specified solder, in the direction of the arrow, by sliding the soldering iron.
11.4. BRIDGE MODIFICATION PROCEDURE
1. Lightly re-solder the bridged portion.
2. Remove the remaining solder along pins using a soldering iron as shown in the figure below.
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KX-T7565RU
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