DOWNLOAD Panasonic KX-NS500UC (serv.man2) Service Manual ↓ Size: 12.71 MB | Pages: 127 in PDF or view online for FREE

Model
KX-NS500UC (serv.man2)
Pages
127
Size
12.71 MB
Type
PDF
Document
Service Manual
Brand
Device
PBX / HYBRID IP-PBX
File
kx-ns500uc-sm2.pdf
Date

Panasonic KX-NS500UC (serv.man2) Service Manual ▷ View online

37
KX-NS500UC
10.2. Fan and Power Supply Board
1. Loosen the 1 Screws(A), Remove the Fan Cover.
2. Remove the DC Motor.
3. Remove the 1connector  from the Mother Board.
4. Loosen the 2 Screws(A) and 2 Screws(E), Remove the Capacitor 
Cover.
5. Loosen the 2 Screws(E), Remove the Connect Plate.
6. Loosen the 7 Screws(E), Remove the Power Supply Board.
7. Remove the 1connector(AC Inlet Connect)  from the Power Sup-
ply Board.
8. Remove the 1connector  from the Mother Board.
9. Remove the Power Supply Board and Relay Board.
10. Remove the Relay Board from the Power Supply Board.
38
KX-NS500UC
11 Miscellaneous
11.1. How To Replace a Flat Package IC
Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a sol-
dering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
11.1.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700
F ± 20F (370C ± 10C)
Note: We recommend a 30 to 40 Watt soldering iron. An
expert may be able to use a 60 to 80 Watt iron where some-
one with less experience could overheat and damage the
PCB foil.
• Flux
Recommended Flux: Specific Gravity 
 0.82.
Type 
 RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.5).
11.1.2.
Removal Procedure
1. Put plenty of solder on the IC pins so that the pins can be
completely covered.
Note:
If the IC pins are not soldered enough, you may give
pressure to the P.C. board when cutting the pins with
a cutter.
2. Make a few cuts into the joint (between the IC and its
pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC
pins.
When you attach a new IC to the board, remove all solder
left on the land with some tools like a soldering wire. If some
solder is left at the joint on the board, the new IC will not be
attached properly.
11.1.3.
Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering
two diagonally opposite pins in the correct positions on
the PCB.
Be certain each pin is located over the correct pad on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the sol-
dering iron along the tips of the pins while feeding enough
solder to the tip so that it flows under the pins as they are
heated.
11.1.4.
Removing Solder From Between
Pins
1. Add a small amount of solder to the bridged pins.
2. With a hot iron, use a sweeping motion along the flat part
of the pin to draw the solder from between the adjacent
pads.
39
KX-NS500UC
11.2. How to Replace the LLP (Leadless Leadframe Package) IC and IC
ground plate
11.2.1.
Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 
F ± 20 F (370 C ± 10 C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less 
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608 
F ± 68 F (320 C ± 20 C)
11.2.2.
Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
11.2.3.
How to Remove the IC
1. Heat the IC with a hot air desoldering tool through the
P.C.Board.
2. Pick up the IC with tweezers, etc. when the solder is
melted completely.
Note:
• Be careful not to touch the peripheral parts with twee-
zers, etc. They are unstable. 
3. After removing the IC, clean the P.C.Board of residual sol-
der.
11.2.4.
How to Install the IC
1. Place the solder a little on the land where the radiation
GND pad on IC bottom is to be attached.
2. Place the solder a little on the land where IC pins are to
be attached, then place the IC.
Note:
• When placing the IC, the positioning should be done very
carefully.
3. Heat the IC with a hot air desoldering tool through the
P.C.Board until the solder on IC bottom is melted.
Note:
• Be sure to place it precisely, controlling the air volume of
the hot air desoldering tool.
4. After soldering, confirm there are no short and open cir-
cuits with visual inspection.
40
KX-NS500UC
11.2.5.
How to Remove a Solder Bridge (Doesn't apply to IC ground plate.)
When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron.
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